JPS528991A - Gas phase reacting apparatus - Google Patents
Gas phase reacting apparatusInfo
- Publication number
- JPS528991A JPS528991A JP8442975A JP8442975A JPS528991A JP S528991 A JPS528991 A JP S528991A JP 8442975 A JP8442975 A JP 8442975A JP 8442975 A JP8442975 A JP 8442975A JP S528991 A JPS528991 A JP S528991A
- Authority
- JP
- Japan
- Prior art keywords
- gas phase
- reacting apparatus
- phase reacting
- film
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
- C23C16/45508—Radial flow
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/4558—Perforated rings
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
PURPOSE:An apparatus for forming a film on a semiconductor substrate by gas phase reaction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8442975A JPS5830386B2 (en) | 1975-07-11 | 1975-07-11 | Kisouhan no Souchi |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8442975A JPS5830386B2 (en) | 1975-07-11 | 1975-07-11 | Kisouhan no Souchi |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS528991A true JPS528991A (en) | 1977-01-24 |
JPS5830386B2 JPS5830386B2 (en) | 1983-06-29 |
Family
ID=13830327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8442975A Expired JPS5830386B2 (en) | 1975-07-11 | 1975-07-11 | Kisouhan no Souchi |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5830386B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03212933A (en) * | 1990-01-18 | 1991-09-18 | Tokyo Electron Ltd | Heat treatment method |
JPH0557588U (en) * | 1992-01-14 | 1993-07-30 | エスエムシー株式会社 | Connector for fluid pressure equipment |
-
1975
- 1975-07-11 JP JP8442975A patent/JPS5830386B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03212933A (en) * | 1990-01-18 | 1991-09-18 | Tokyo Electron Ltd | Heat treatment method |
JPH0557588U (en) * | 1992-01-14 | 1993-07-30 | エスエムシー株式会社 | Connector for fluid pressure equipment |
Also Published As
Publication number | Publication date |
---|---|
JPS5830386B2 (en) | 1983-06-29 |
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