GB1054660A - - Google Patents

Info

Publication number
GB1054660A
GB1054660A GB1054660DA GB1054660A GB 1054660 A GB1054660 A GB 1054660A GB 1054660D A GB1054660D A GB 1054660DA GB 1054660 A GB1054660 A GB 1054660A
Authority
GB
United Kingdom
Prior art keywords
substrate
anode
cathode
vessel
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of GB1054660A publication Critical patent/GB1054660A/en
Priority claimed from US309159A external-priority patent/US3282816A/en
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
GB1054660D 1963-09-16 Active GB1054660A (hu)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US309159A US3282816A (en) 1963-09-16 1963-09-16 Process of cathode sputtering from a cylindrical cathode
US574216A US3354074A (en) 1963-09-16 1966-08-22 Cylindrical cathode sputtering apparatus including means for establishing a quadrupole magnetic field transverse of the discharge
US574868A US3341442A (en) 1963-09-16 1966-08-22 Method of cathode sputtering including cleaning by ion bombardment wherein an article to be coated is subjected to canal rays

Publications (1)

Publication Number Publication Date
GB1054660A true GB1054660A (hu)

Family

ID=27405363

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1054660D Active GB1054660A (hu) 1963-09-16

Country Status (3)

Country Link
US (2) US3354074A (hu)
DE (1) DE1515301A1 (hu)
GB (1) GB1054660A (hu)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3548189A (en) * 1965-06-16 1970-12-15 Aden B Meinel Method employing ion beams for polishing and figuring refractory dielectrics
US3404084A (en) * 1965-10-20 1968-10-01 Gen Precision Systems Inc Apparatus for depositing ionized electron beam evaporated material on a negatively biased substrate
US3410774A (en) * 1965-10-23 1968-11-12 Ibm Method and apparatus for reverse sputtering selected electrically exposed areas of a cathodically biased workpiece
US3544445A (en) * 1966-09-01 1970-12-01 Bendix Corp Floating shield in a triode sputtering apparatus protecting the base from the discharge
US3925182A (en) * 1973-09-25 1975-12-09 Shatterproof Glass Corp Method for continuous production of sputter-coated glass products
US4132613A (en) * 1974-12-23 1979-01-02 Telic Corporation Glow discharge method and apparatus
JPS51117933A (en) * 1975-04-10 1976-10-16 Tokuda Seisakusho Spattering apparatus
US4179351A (en) * 1976-09-09 1979-12-18 Hewlett-Packard Company Cylindrical magnetron sputtering source
US4090941A (en) * 1977-03-18 1978-05-23 United Technologies Corporation Cathode sputtering apparatus
US4126530A (en) * 1977-08-04 1978-11-21 Telic Corporation Method and apparatus for sputter cleaning and bias sputtering
US4252626A (en) * 1980-03-10 1981-02-24 United Technologies Corporation Cathode sputtering with multiple targets
US5069770A (en) * 1990-07-23 1991-12-03 Eastman Kodak Company Sputtering process employing an enclosed sputtering target
US7335426B2 (en) * 1999-11-19 2008-02-26 Advanced Bio Prosthetic Surfaces, Ltd. High strength vacuum deposited nitinol alloy films and method of making same
DE102004005663A1 (de) * 2004-02-05 2005-09-01 Zentrum für Material- und Umwelttechnik GmbH Verfahren zum Herstellen einer Targetanordnung
DE102006020004B4 (de) * 2006-04-26 2011-06-01 Systec System- Und Anlagentechnik Gmbh & Co.Kg Vorrichtung und Verfahren zur homogenen PVD-Beschichtung
CN106884150B (zh) * 2017-04-24 2023-06-09 爱瑞德科技(大连)有限公司 一种悬浮阳极及带有悬浮阳极的磁控溅射装置
CN111074208B (zh) * 2019-12-19 2021-04-06 中国科学院高能物理研究所 一种纯铌腔内表面镀铌三锡薄膜的方法及真空炉

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL50072C (hu) * 1935-12-28
US2189580A (en) * 1937-05-29 1940-02-06 Gen Electric Method of making a photoelectric cell
DE722131C (de) * 1937-08-15 1942-07-01 Bernhard Berghaus Anordnung und Verfahren zum Metallisieren von Gegenstaenden mittels Kathodenzerstaeubung
US3087838A (en) * 1955-10-05 1963-04-30 Hupp Corp Methods of photoelectric cell manufacture
GB830391A (en) * 1955-10-28 1960-03-16 Edwards High Vacuum Ltd Improvements in or relating to cathodic sputtering of metal and dielectric films
US2897129A (en) * 1957-03-04 1959-07-28 Titanium Metals Corp Electrode handling and storing apparatus
GB1022360A (en) * 1961-12-13 1966-03-09 Berghaus Elektrophysik Anst Method of and apparatus for coating an article
US3250694A (en) * 1962-10-17 1966-05-10 Ibm Apparatus for coating articles by cathode sputtering

Also Published As

Publication number Publication date
US3341442A (en) 1967-09-12
DE1515301A1 (de) 1969-06-19
US3354074A (en) 1967-11-21

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