GB1054340A - - Google Patents

Info

Publication number
GB1054340A
GB1054340A GB1054340DA GB1054340A GB 1054340 A GB1054340 A GB 1054340A GB 1054340D A GB1054340D A GB 1054340DA GB 1054340 A GB1054340 A GB 1054340A
Authority
GB
United Kingdom
Prior art keywords
copper
added
hydroxy
ion
nov
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Publication date
Publication of GB1054340A publication Critical patent/GB1054340A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
GB1054340D Expired GB1054340A (ja)

Publications (1)

Publication Number Publication Date
GB1054340A true GB1054340A (ja) 1900-01-01

Family

ID=1758081

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1054340D Expired GB1054340A (ja)

Country Status (1)

Country Link
GB (1) GB1054340A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2262103A (en) * 1990-06-05 1993-06-09 Fukuda Metal Foil And Powder C Surface treatment of a copper foil for printed circuit boards by electroplating and chromate treatment
EP1214739A2 (en) * 1999-08-09 2002-06-19 Ltech Corporation Copper deposit process
CN107604392A (zh) * 2017-09-29 2018-01-19 佛山市春暖花开科技有限公司 一种铜的电镀液

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2262103A (en) * 1990-06-05 1993-06-09 Fukuda Metal Foil And Powder C Surface treatment of a copper foil for printed circuit boards by electroplating and chromate treatment
GB2262103B (en) * 1990-06-05 1995-10-04 Fukuda Metal Foil And Powder C Method of surface treatment of copper foil for printed circuit boards and copper foil for printed circuit boards
EP1214739A2 (en) * 1999-08-09 2002-06-19 Ltech Corporation Copper deposit process
EP1214739A4 (en) * 1999-08-09 2005-04-13 Ltech Corp COPPER DEPOSITION METHOD
CN107604392A (zh) * 2017-09-29 2018-01-19 佛山市春暖花开科技有限公司 一种铜的电镀液

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