GB1047390A - - Google Patents

Info

Publication number
GB1047390A
GB1047390A GB1047390DA GB1047390A GB 1047390 A GB1047390 A GB 1047390A GB 1047390D A GB1047390D A GB 1047390DA GB 1047390 A GB1047390 A GB 1047390A
Authority
GB
United Kingdom
Prior art keywords
terminal areas
wafer
conductive
areas
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of GB1047390A publication Critical patent/GB1047390A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
GB1047390D 1963-05-20 Expired GB1047390A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US281419A US3258898A (en) 1963-05-20 1963-05-20 Electronic subassembly

Publications (1)

Publication Number Publication Date
GB1047390A true GB1047390A (enExample) 1900-01-01

Family

ID=23077216

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1047390D Expired GB1047390A (enExample) 1963-05-20

Country Status (2)

Country Link
US (1) US3258898A (enExample)
GB (1) GB1047390A (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3330696A (en) * 1967-07-11 Method of fabricating thin film capacitors
US3325258A (en) * 1963-11-27 1967-06-13 Texas Instruments Inc Multilayer resistors for hybrid integrated circuits
US3393349A (en) * 1964-04-30 1968-07-16 Motorola Inc Intergrated circuits having isolated islands with a plurality of semiconductor devices in each island
DE1201887B (de) * 1964-08-01 1965-09-30 Telefunken Patent Verfahren und Vorrichtung zum Einloeten von Transistoren od. dgl.
US3397447A (en) * 1964-10-22 1968-08-20 Dow Corning Method of making semiconductor circuits
GB1095413A (enExample) * 1964-12-24
US3323198A (en) * 1965-01-27 1967-06-06 Texas Instruments Inc Electrical interconnections
US3436614A (en) * 1965-04-20 1969-04-01 Nippon Telegraph & Telephone Nonrectifying laminated ohmic contact for semiconductors consisting of chromium and 80% nickel
FR1486855A (enExample) * 1965-07-17 1967-10-05
US3442003A (en) * 1965-07-26 1969-05-06 Teledyne Inc Method for interconnecting thin films
US3413711A (en) * 1966-09-07 1968-12-03 Western Electric Co Method of making palladium copper contact for soldering
US3423822A (en) * 1967-02-27 1969-01-28 Northern Electric Co Method of making large scale integrated circuit
US3513022A (en) * 1967-04-26 1970-05-19 Rca Corp Method of fabricating semiconductor devices
US3851382A (en) * 1968-12-02 1974-12-03 Telefunken Patent Method of producing a semiconductor or thick film device
US3601745A (en) * 1969-12-24 1971-08-24 Sprague Electric Co Standardized resistor blank
US3627597A (en) * 1970-01-05 1971-12-14 Nathan A Tiner Engraving
US3754168A (en) * 1970-03-09 1973-08-21 Texas Instruments Inc Metal contact and interconnection system for nonhermetic enclosed semiconductor devices
US3924321A (en) * 1970-11-23 1975-12-09 Harris Corp Radiation hardened mis devices
DE2259133C3 (de) * 1972-12-02 1982-03-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren einer Halbleiteranordnung und Anwendung des Verfahrens
US3924093A (en) * 1973-05-09 1975-12-02 Bell Telephone Labor Inc Pattern delineation method and product so produced
US3846822A (en) * 1973-10-05 1974-11-05 Bell Telephone Labor Inc Methods for making field effect transistors
US3867217A (en) * 1973-10-29 1975-02-18 Bell Telephone Labor Inc Methods for making electronic circuits
US4040168A (en) * 1975-11-24 1977-08-09 Rca Corporation Fabrication method for a dual gate field-effect transistor
US4232439A (en) * 1976-11-30 1980-11-11 Vlsi Technology Research Association Masking technique usable in manufacturing semiconductor devices
US4208780A (en) * 1978-08-03 1980-06-24 Rca Corporation Last-stage programming of semiconductor integrated circuits including selective removal of passivation layer
US4548078A (en) * 1982-09-30 1985-10-22 Honeywell Inc. Integral flow sensor and channel assembly
US4576884A (en) * 1984-06-14 1986-03-18 Microelectronics Center Of North Carolina Method and apparatus for exposing photoresist by using an electron beam and controlling its voltage and charge
US5032543A (en) * 1988-06-17 1991-07-16 Massachusetts Institute Of Technology Coplanar packaging techniques for multichip circuits
TW498602B (en) * 2000-05-30 2002-08-11 Alps Electric Co Ltd Circuit unit
TWI260657B (en) * 2002-04-15 2006-08-21 Avx Corp Plated terminations
US7463474B2 (en) * 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US6982863B2 (en) * 2002-04-15 2006-01-03 Avx Corporation Component formation via plating technology
US7152291B2 (en) * 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US7177137B2 (en) * 2002-04-15 2007-02-13 Avx Corporation Plated terminations
US6960366B2 (en) * 2002-04-15 2005-11-01 Avx Corporation Plated terminations
US7576968B2 (en) 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US8975176B2 (en) * 2013-03-15 2015-03-10 Materion Corporation Gold die bond sheet preform

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955351A (en) * 1954-12-28 1960-10-11 Plast O Fab Circuits Inc Method of making a printed circuit
US2958928A (en) * 1955-12-14 1960-11-08 Western Electric Co Methods of making printed wiring circuits
US3052957A (en) * 1957-05-27 1962-09-11 Motorola Inc Plated circuit process
GB945742A (enExample) * 1959-02-06 Texas Instruments Inc
US3142783A (en) * 1959-12-22 1964-07-28 Hughes Aircraft Co Electrical circuit system
US3142112A (en) * 1960-03-30 1964-07-28 Hughes Aircraft Co Method of making an electrical interconnection grid

Also Published As

Publication number Publication date
US3258898A (en) 1966-07-05

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