GB1036166A - Improvements in or relating to semiconductor devices - Google Patents

Improvements in or relating to semiconductor devices

Info

Publication number
GB1036166A
GB1036166A GB6100/64A GB610064A GB1036166A GB 1036166 A GB1036166 A GB 1036166A GB 6100/64 A GB6100/64 A GB 6100/64A GB 610064 A GB610064 A GB 610064A GB 1036166 A GB1036166 A GB 1036166A
Authority
GB
United Kingdom
Prior art keywords
header
wafer
semi
flats
lead wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6100/64A
Inventor
Brian Ernest Head
Brian Herbert Shaw
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB6100/64A priority Critical patent/GB1036166A/en
Priority to US421178A priority patent/US3324357A/en
Priority to DE1514736A priority patent/DE1514736C3/en
Priority to DE19651514739 priority patent/DE1514739A1/en
Priority to NL6501141A priority patent/NL6501141A/xx
Priority to FR3688A priority patent/FR1427264A/en
Priority to NL6501142A priority patent/NL6501142A/xx
Priority to BE659002D priority patent/BE659002A/xx
Priority to BE659001D priority patent/BE659001A/xx
Priority to DE19651514742 priority patent/DE1514742A1/en
Priority to BE659624D priority patent/BE659624A/xx
Priority to NL6501745A priority patent/NL6501745A/xx
Priority to FR8137A priority patent/FR87924E/en
Publication of GB1036166A publication Critical patent/GB1036166A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/611—Combinations of BJTs and one or more of diodes, resistors or capacitors
    • H10D84/613—Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
    • H10D84/617—Combinations of vertical BJTs and only diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

1,036,166. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. Feb. 13, 1964, No. 6100/64. Heading H1K. The ends of lead wires extending through a header on which a semiconductor wafer is to be mounted are treated with the aid of an apertured jig 2 to form an array of coplanar flats, the positions of which correspond to electrode areas on the wafer. The wires may be bent to suitable positions and their ends ground, sheared or electrolytically machined flat in a single jig 3, Fig. 2, or the operations carried out in separate jigs. Afterwards the header is etched and the metal surfaces plated with gold or nickel. The flats may then be coated with solder and the semi-conductor wafer attached to them. Diodes, transistors, silicon controlled rectifiers and solid circuits may be mounted thus on headers with appropriate numbers of lead wires. Glass, ceramic or plastics may be used as the insulating part of the header.
GB6100/64A 1962-05-25 1964-02-13 Improvements in or relating to semiconductor devices Expired GB1036166A (en)

Priority Applications (13)

Application Number Priority Date Filing Date Title
GB6100/64A GB1036166A (en) 1964-02-13 1964-02-13 Improvements in or relating to semiconductor devices
US421178A US3324357A (en) 1964-01-29 1964-12-28 Multi-terminal semiconductor device having active element directly mounted on terminal leads
DE1514736A DE1514736C3 (en) 1964-01-29 1965-01-21 Method for manufacturing a plurality of semiconductor components
DE19651514739 DE1514739A1 (en) 1962-05-25 1965-01-27 Electric semiconductor device
NL6501141A NL6501141A (en) 1964-01-29 1965-01-29
FR3688A FR1427264A (en) 1964-01-29 1965-01-29 Semiconductor device enhancements
NL6501142A NL6501142A (en) 1964-01-29 1965-01-29
BE659002D BE659002A (en) 1962-05-25 1965-01-29
BE659001D BE659001A (en) 1962-05-25 1965-01-29
DE19651514742 DE1514742A1 (en) 1964-01-29 1965-02-06 Semiconductor device
BE659624D BE659624A (en) 1964-01-29 1965-02-12
NL6501745A NL6501745A (en) 1964-01-29 1965-02-12
FR8137A FR87924E (en) 1964-01-29 1965-03-05 Semiconductor device enhancements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB6100/64A GB1036166A (en) 1964-02-13 1964-02-13 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB1036166A true GB1036166A (en) 1966-07-13

Family

ID=9808374

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6100/64A Expired GB1036166A (en) 1962-05-25 1964-02-13 Improvements in or relating to semiconductor devices

Country Status (1)

Country Link
GB (1) GB1036166A (en)

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