GB1020061A - Multilayer circuits - Google Patents

Multilayer circuits

Info

Publication number
GB1020061A
GB1020061A GB14970/63A GB1497063A GB1020061A GB 1020061 A GB1020061 A GB 1020061A GB 14970/63 A GB14970/63 A GB 14970/63A GB 1497063 A GB1497063 A GB 1497063A GB 1020061 A GB1020061 A GB 1020061A
Authority
GB
United Kingdom
Prior art keywords
sheet
ceramic
wafers
holes
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB14970/63A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Publication of GB1020061A publication Critical patent/GB1020061A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Products (AREA)
GB14970/63A 1962-04-27 1963-04-16 Multilayer circuits Expired GB1020061A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US190664A US3189978A (en) 1962-04-27 1962-04-27 Method of making multilayer circuits

Publications (1)

Publication Number Publication Date
GB1020061A true GB1020061A (en) 1966-02-16

Family

ID=22702275

Family Applications (1)

Application Number Title Priority Date Filing Date
GB14970/63A Expired GB1020061A (en) 1962-04-27 1963-04-16 Multilayer circuits

Country Status (3)

Country Link
US (1) US3189978A (US20090192370A1-20090730-C00001.png)
BE (1) BE631489A (US20090192370A1-20090730-C00001.png)
GB (1) GB1020061A (US20090192370A1-20090730-C00001.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG130973A1 (en) * 2001-03-30 2007-04-26 Lam Res Corp Cerium oxide ceramic containing components in semiconductor processing equipment
CN111517758A (zh) * 2019-02-03 2020-08-11 苏州艾福电子通讯股份有限公司 一种微波介质陶瓷粉及其制备方法、及其应用

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US3546776A (en) * 1962-09-06 1970-12-15 Aerovox Corp Process for manufacturing a ceramic multilayer circuit module
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
US3387365A (en) * 1965-09-28 1968-06-11 John P. Stelmak Method of making electrical connections to a miniature electronic component
US3514834A (en) * 1966-01-28 1970-06-02 Stolle Corp Method for securing an elongated metal member to a flat metal sheet
US3346951A (en) * 1966-02-24 1967-10-17 Talon Inc Method of making electrical contact elements
US3838204A (en) * 1966-03-30 1974-09-24 Ibm Multilayer circuits
DE1301378B (de) * 1966-03-30 1969-08-21 Ibm Verfahren zur Herstellung vielschichtiger elektrischer Schaltungselemente auf keramischer Basis
US3423517A (en) * 1966-07-27 1969-01-21 Dielectric Systems Inc Monolithic ceramic electrical interconnecting structure
US3835530A (en) * 1967-06-05 1974-09-17 Texas Instruments Inc Method of making semiconductor devices
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
US3520054A (en) * 1967-11-13 1970-07-14 Mitronics Inc Method of making multilevel metallized ceramic bodies for semiconductor packages
US3458930A (en) * 1967-12-07 1969-08-05 Zenith Radio Corp Leadless inverted device forming process
US3545079A (en) * 1968-05-02 1970-12-08 Vitramon Inc Method of making multilayer circuit system
US3634600A (en) * 1969-07-22 1972-01-11 Ceramic Metal Systems Inc Ceramic package
US3852877A (en) * 1969-08-06 1974-12-10 Ibm Multilayer circuits
US3717487A (en) * 1970-06-17 1973-02-20 Sprague Electric Co Ceramic slip composition
US3601522A (en) * 1970-06-18 1971-08-24 American Lava Corp Composite ceramic package breakaway notch
US3770529A (en) * 1970-08-25 1973-11-06 Ibm Method of fabricating multilayer circuits
US3978248A (en) * 1970-12-18 1976-08-31 Hitachi, Ltd. Method for manufacturing composite sintered structure
US3731005A (en) * 1971-05-18 1973-05-01 Metalized Ceramics Corp Laminated coil
US3893230A (en) * 1971-11-15 1975-07-08 Ford Motor Co Method of manufacture of an exhaust gas sensor for an air-fuel ratio sensing system
DE2324006A1 (de) * 1972-05-18 1973-12-06 Ericsson Telefon Ab L M Verfahren zur herstellung einer mehrschicht-dickfilmschaltung mit leitenden kreuzverbindungen
US3798762A (en) * 1972-08-14 1974-03-26 Us Army Circuit board processing
US3864810A (en) * 1972-09-27 1975-02-11 Minnesota Mining & Mfg Process and composite leadless chip carriers with external connections
US3788722A (en) * 1973-04-18 1974-01-29 Panel Technology Process for producing a gaseous breakdown display device
US3956052A (en) * 1974-02-11 1976-05-11 International Business Machines Corporation Recessed metallurgy for dielectric substrates
US3918148A (en) * 1974-04-15 1975-11-11 Ibm Integrated circuit chip carrier and method for forming the same
JPS5328266A (en) * 1976-08-13 1978-03-16 Fujitsu Ltd Method of producing multilayer ceramic substrate
JPS5382170A (en) * 1976-12-28 1978-07-20 Ngk Insulators Ltd Method of producing coupled type ic ceramic package
US4445274A (en) * 1977-12-23 1984-05-01 Ngk Insulators, Ltd. Method of manufacturing a ceramic structural body
JPS594873B2 (ja) * 1978-09-26 1984-02-01 松下電器産業株式会社 印刷配線板
US4336088A (en) * 1980-06-30 1982-06-22 International Business Machines Corp. Method of fabricating an improved multi-layer ceramic substrate
US4437141A (en) 1981-09-14 1984-03-13 Texas Instruments Incorporated High terminal count integrated circuit device package
US4626818A (en) * 1983-11-28 1986-12-02 Centralab, Inc. Device for programmable thick film networks
JPS60203442A (ja) * 1984-03-28 1985-10-15 株式会社村田製作所 セラミツクグリ−ンシ−ト積層体の製造装置
JPS61236192A (ja) * 1985-04-12 1986-10-21 株式会社日立製作所 セラミツク基板の電極形成方法
US4641221A (en) * 1985-08-02 1987-02-03 The Dow Chemical Company Thin tape for dielectric materials
US4828961A (en) * 1986-07-02 1989-05-09 W. R. Grace & Co.-Conn. Imaging process for forming ceramic electronic circuits
US4786342A (en) * 1986-11-10 1988-11-22 Coors Porcelain Company Method for producing cast tape finish on a dry-pressed substrate
WO1988005959A1 (en) * 1987-02-04 1988-08-11 Coors Porcelain Company Ceramic substrate with conductively-filled vias and method for producing
US4890383A (en) * 1988-01-15 1990-01-02 Simens Corporate Research & Support, Inc. Method for producing displays and modular components
US4843280A (en) * 1988-01-15 1989-06-27 Siemens Corporate Research & Support, Inc. A modular surface mount component for an electrical device or led's
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US4920640A (en) * 1988-01-27 1990-05-01 W. R. Grace & Co.-Conn. Hot pressing dense ceramic sheets for electronic substrates and for multilayer electronic substrates
US4859806A (en) * 1988-05-17 1989-08-22 Microelectronics And Computer Technology Corporation Discretionary interconnect
US5013347A (en) * 1989-06-29 1991-05-07 Microelectronic Packaging Inc. Glass bonding method
NL8901872A (nl) * 1989-07-20 1991-02-18 Stamicarbon Dunne zelfdragende anorganische groenlingen, en werkwijze voor het bereiden van dergelijke groenlingen.
US5411563A (en) * 1993-06-25 1995-05-02 Industrial Technology Research Institute Strengthening of multilayer ceramic/glass articles
US5523920A (en) * 1994-01-03 1996-06-04 Motorola, Inc. Printed circuit board comprising elevated bond pads
US5849396A (en) * 1995-09-13 1998-12-15 Hughes Electronics Corporation Multilayer electronic structure and its preparation
US6690165B1 (en) 1999-04-28 2004-02-10 Hironori Takahashi Magnetic-field sensing coil embedded in ceramic for measuring ambient magnetic field
JP4138211B2 (ja) * 2000-07-06 2008-08-27 株式会社村田製作所 電子部品およびその製造方法、集合電子部品、電子部品の実装構造、ならびに電子装置
US7579681B2 (en) * 2002-06-11 2009-08-25 Micron Technology, Inc. Super high density module with integrated wafer level packages
US20110291256A1 (en) * 2010-06-01 2011-12-01 Rainer Steiner Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package
US10596369B2 (en) 2011-03-01 2020-03-24 Greatbatch Ltd. Low equivalent series resistance RF filter for an active implantable medical device
US11198014B2 (en) 2011-03-01 2021-12-14 Greatbatch Ltd. Hermetically sealed filtered feedthrough assembly having a capacitor with an oxide resistant electrical connection to an active implantable medical device housing
US9889306B2 (en) 2012-01-16 2018-02-13 Greatbatch Ltd. Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device
US8653384B2 (en) 2012-01-16 2014-02-18 Greatbatch Ltd. Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device
US10046166B2 (en) 2012-01-16 2018-08-14 Greatbatch Ltd. EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device
US10420949B2 (en) 2012-01-16 2019-09-24 Greatbatch Ltd. Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step
US10881867B2 (en) 2012-01-16 2021-01-05 Greatbatch Ltd. Method for providing a hermetically sealed feedthrough with co-fired filled via for an active implantable medical device
USRE46699E1 (en) 2013-01-16 2018-02-06 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US10249415B2 (en) 2017-01-06 2019-04-02 Greatbatch Ltd. Process for manufacturing a leadless feedthrough for an active implantable medical device
CN112038297B (zh) * 2020-08-14 2022-10-25 中国电子科技集团公司第十三研究所 氧化铝瓷件及其制作方法、陶瓷外壳的制作方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG130973A1 (en) * 2001-03-30 2007-04-26 Lam Res Corp Cerium oxide ceramic containing components in semiconductor processing equipment
CN111517758A (zh) * 2019-02-03 2020-08-11 苏州艾福电子通讯股份有限公司 一种微波介质陶瓷粉及其制备方法、及其应用

Also Published As

Publication number Publication date
US3189978A (en) 1965-06-22
BE631489A (US20090192370A1-20090730-C00001.png)

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