GB1015532A - Improvements in or relating to semiconductor devices - Google Patents

Improvements in or relating to semiconductor devices

Info

Publication number
GB1015532A
GB1015532A GB14602/62A GB1460262A GB1015532A GB 1015532 A GB1015532 A GB 1015532A GB 14602/62 A GB14602/62 A GB 14602/62A GB 1460262 A GB1460262 A GB 1460262A GB 1015532 A GB1015532 A GB 1015532A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
electrode
emitter
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB14602/62A
Inventor
Carl Peter Sandbank
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL291538D priority Critical patent/NL291538A/xx
Priority to DENDAT1287696D priority patent/DE1287696B/de
Priority to BE631066D priority patent/BE631066A/xx
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB14602/62A priority patent/GB1015532A/en
Priority to CH452163A priority patent/CH423995A/en
Priority to DEJ23535A priority patent/DE1282188B/en
Priority to US273062A priority patent/US3244939A/en
Priority to FR931635A priority patent/FR1354552A/en
Priority to GB378564A priority patent/GB1036164A/en
Priority to NL6408106A priority patent/NL6408106A/xx
Priority to BE651446D priority patent/BE651446A/xx
Priority to FR984543A priority patent/FR86320E/en
Priority to DE1439529A priority patent/DE1439529B2/en
Priority to DEST22571A priority patent/DE1292758B/en
Priority to NL6409849A priority patent/NL6409849A/xx
Priority to FR986227A priority patent/FR86819E/en
Priority to NL6409848A priority patent/NL6409848A/xx
Priority to BE652660D priority patent/BE652660A/xx
Priority to DEST22635A priority patent/DE1292761B/en
Priority to FR989359A priority patent/FR86957E/en
Priority to CH1250264A priority patent/CH471468A/en
Priority to BE653537D priority patent/BE653537A/xx
Publication of GB1015532A publication Critical patent/GB1015532A/en
Expired legal-status Critical Current

Links

Classifications

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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Die Bonding (AREA)

Abstract

1,015,532. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. April 11, 1963 [April 16, 1962], No. 14602/62 Heading H1K. A semi-conductor device with one electrode at one plain face and another electrode at a further face of the semi-conductor is mounted on a thin insulating plate by joining the plain face to an area of metallic film deposited on the plate, the other electrode being connected by a wire to another separate area of metallic film, and the whole assembly is then encapsulated in a hardenable plastics material. In one embodiment (Fig. 1) an NPN silicon transistor 10 formed by epitaxial planar growth has a P- type base 10 and N-type emitter 14 formed by double diffusion into an N-type region 12 through holes, etched by photo-lithographic techniques, in a silicon dioxide layer 15, with aluminium film 18 providing base and emitter electrodes. The transistor is mounted on one end of a thin glass plate 31 (Fig. 3) on which has been vapour deposited gold-chromium stripes 32, 33, 34. Collector connection is effected through the N+ region and emitter and base connections are made by thin gold wires 35, 36 which may be thermo-compression bonded to the stripes or jointed thereto by a silver loaded epoxy resin. The whole assembly is then encapsulated in a mass of resin or glaze. In a further modification (Fig. 7, not shown) a further lead is provided extending out from each stripe through the mass of encapsulating resin which in this case covers the whole of the glass substrate. The invention is applicable to diodes, matched transistors (including integral resistors and capacitors in the semi-conductor material). The substrate may be glass, mica, ceramic or silicon.
GB14602/62A 1962-04-16 1962-04-16 Improvements in or relating to semiconductor devices Expired GB1015532A (en)

Priority Applications (22)

Application Number Priority Date Filing Date Title
NL291538D NL291538A (en) 1962-04-16
DENDAT1287696D DE1287696B (en) 1962-04-16
BE631066D BE631066A (en) 1962-04-16
GB14602/62A GB1015532A (en) 1962-04-16 1962-04-16 Improvements in or relating to semiconductor devices
CH452163A CH423995A (en) 1962-04-16 1963-04-09 Method of mounting and encapsulating a semiconductor device
DEJ23535A DE1282188B (en) 1962-04-16 1963-04-11 Electrical semiconductor arrangement with several strip-shaped supply lines isolated from one another
US273062A US3244939A (en) 1962-04-16 1963-04-15 Encapsulated die bonded hybrid integrated circuit
FR931635A FR1354552A (en) 1962-04-16 1963-04-16 Manufacturing process applicable to semiconductor electronic components for printed circuits
GB378564A GB1036164A (en) 1962-04-16 1964-01-29 Improvements in or relating to semiconductor devices
NL6408106A NL6408106A (en) 1962-04-16 1964-07-16
BE651446D BE651446A (en) 1962-04-16 1964-08-06
FR984543A FR86320E (en) 1962-04-16 1964-08-07 Manufacturing process applicable to semiconductor electronic components for printed circuits
DE1439529A DE1439529B2 (en) 1962-04-16 1964-08-12 : Semiconductor component with a planar semiconductor element on a bonding plate and method for producing the same
DEST22571A DE1292758B (en) 1962-04-16 1964-08-21 Electric semiconductor component
NL6409849A NL6409849A (en) 1962-04-16 1964-08-26
FR986227A FR86819E (en) 1962-04-16 1964-08-26 Manufacturing process applicable to semiconductor electronic components for printed circuits
NL6409848A NL6409848A (en) 1962-04-16 1964-08-26
BE652660D BE652660A (en) 1962-04-16 1964-09-04
DEST22635A DE1292761B (en) 1962-04-16 1964-09-05 Planar semiconductor device and method for its manufacture
FR989359A FR86957E (en) 1962-04-16 1964-09-25 Manufacturing process applicable to semiconductor electronic components for printed circuits
CH1250264A CH471468A (en) 1962-04-16 1964-09-25 Electric semiconductor device
BE653537D BE653537A (en) 1962-04-16 1964-09-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB14602/62A GB1015532A (en) 1962-04-16 1962-04-16 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB1015532A true GB1015532A (en) 1966-01-05

Family

ID=10044198

Family Applications (1)

Application Number Title Priority Date Filing Date
GB14602/62A Expired GB1015532A (en) 1962-04-16 1962-04-16 Improvements in or relating to semiconductor devices

Country Status (1)

Country Link
GB (1) GB1015532A (en)

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