GB0221891D0 - Process - Google Patents

Process

Info

Publication number
GB0221891D0
GB0221891D0 GBGB0221891.5A GB0221891A GB0221891D0 GB 0221891 D0 GB0221891 D0 GB 0221891D0 GB 0221891 A GB0221891 A GB 0221891A GB 0221891 D0 GB0221891 D0 GB 0221891D0
Authority
GB
United Kingdom
Prior art keywords
parts
ink
resistant
plate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0221891.5A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avecia Ltd
Original Assignee
Avecia Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avecia Ltd filed Critical Avecia Ltd
Priority to GBGB0221891.5A priority Critical patent/GB0221891D0/en
Publication of GB0221891D0 publication Critical patent/GB0221891D0/en
Priority to US10/528,581 priority patent/US7314573B2/en
Priority to EP03797363A priority patent/EP1543703B1/en
Priority to DE60308705T priority patent/DE60308705T2/de
Priority to AT03797363T priority patent/ATE341187T1/de
Priority to AU2003260730A priority patent/AU2003260730A1/en
Priority to CNA038252031A priority patent/CN1695406A/zh
Priority to KR1020057004708A priority patent/KR100961713B1/ko
Priority to PCT/GB2003/003679 priority patent/WO2004028224A1/en
Priority to JP2004537254A priority patent/JP4392350B2/ja
Priority to TW092125053A priority patent/TWI317251B/zh
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Glass Compositions (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Chemically Coating (AREA)
GBGB0221891.5A 2002-09-20 2002-09-20 Process Ceased GB0221891D0 (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
GBGB0221891.5A GB0221891D0 (en) 2002-09-20 2002-09-20 Process
JP2004537254A JP4392350B2 (ja) 2002-09-20 2003-08-22 メッキ法
AT03797363T ATE341187T1 (de) 2002-09-20 2003-08-22 Plattierungsprozess
EP03797363A EP1543703B1 (en) 2002-09-20 2003-08-22 Plating process
DE60308705T DE60308705T2 (de) 2002-09-20 2003-08-22 Plattierungsprozess
US10/528,581 US7314573B2 (en) 2002-09-20 2003-08-22 Plating process
AU2003260730A AU2003260730A1 (en) 2002-09-20 2003-08-22 Plating process
CNA038252031A CN1695406A (zh) 2002-09-20 2003-08-22 沉积方法
KR1020057004708A KR100961713B1 (ko) 2002-09-20 2003-08-22 도금 방법
PCT/GB2003/003679 WO2004028224A1 (en) 2002-09-20 2003-08-22 Plating process
TW092125053A TWI317251B (en) 2002-09-20 2003-09-10 A plating process for making an electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0221891.5A GB0221891D0 (en) 2002-09-20 2002-09-20 Process

Publications (1)

Publication Number Publication Date
GB0221891D0 true GB0221891D0 (en) 2002-10-30

Family

ID=9944477

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0221891.5A Ceased GB0221891D0 (en) 2002-09-20 2002-09-20 Process

Country Status (11)

Country Link
US (1) US7314573B2 (cg-RX-API-DMAC7.html)
EP (1) EP1543703B1 (cg-RX-API-DMAC7.html)
JP (1) JP4392350B2 (cg-RX-API-DMAC7.html)
KR (1) KR100961713B1 (cg-RX-API-DMAC7.html)
CN (1) CN1695406A (cg-RX-API-DMAC7.html)
AT (1) ATE341187T1 (cg-RX-API-DMAC7.html)
AU (1) AU2003260730A1 (cg-RX-API-DMAC7.html)
DE (1) DE60308705T2 (cg-RX-API-DMAC7.html)
GB (1) GB0221891D0 (cg-RX-API-DMAC7.html)
TW (1) TWI317251B (cg-RX-API-DMAC7.html)
WO (1) WO2004028224A1 (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4633727B2 (ja) * 2003-05-30 2011-02-16 フジフィルム・イメイジング・カラランツ・リミテッド 方法
GB0324947D0 (en) * 2003-10-25 2003-11-26 Avecia Ltd Process
EP2915856B1 (en) * 2014-03-03 2019-10-16 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
CN104494310B (zh) * 2014-09-16 2017-04-12 苏州锐发打印技术有限公司 用于太阳能电池网格导线制作的3d打印系统及控制方法
US10743420B2 (en) * 2015-06-04 2020-08-11 Kateeva, Inc. Methods for producing an etch resist pattern on a metallic surface
US10806035B2 (en) 2015-08-13 2020-10-13 Kateeva, Inc. Methods for producing an etch resist pattern on a metallic surface
US10398034B2 (en) 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
EP3786239B1 (en) * 2019-08-26 2023-11-15 Agfa-Gevaert Nv Radiation curable composition for plating applications

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4315985A (en) * 1972-11-30 1982-02-16 International Business Machines Corporation Fine-line circuit fabrication and photoresist application therefor
US4270985A (en) * 1978-07-21 1981-06-02 Dynachem Corporation Screen printing of photopolymerizable inks
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
US5721007A (en) * 1994-09-08 1998-02-24 The Whitaker Corporation Process for low density additive flexible circuits and harnesses
JPH10282662A (ja) 1997-04-07 1998-10-23 Nippon Kayaku Co Ltd 液状フォトレジストインク組成物及びその硬化物

Also Published As

Publication number Publication date
WO2004028224A1 (en) 2004-04-01
US20060049129A1 (en) 2006-03-09
ATE341187T1 (de) 2006-10-15
CN1695406A (zh) 2005-11-09
KR20050071496A (ko) 2005-07-07
TW200421952A (en) 2004-10-16
JP2005539389A (ja) 2005-12-22
US7314573B2 (en) 2008-01-01
AU2003260730A1 (en) 2004-04-08
DE60308705T2 (de) 2007-08-16
TWI317251B (en) 2009-11-11
JP4392350B2 (ja) 2009-12-24
EP1543703A1 (en) 2005-06-22
KR100961713B1 (ko) 2010-06-10
DE60308705D1 (de) 2006-11-09
EP1543703B1 (en) 2006-09-27

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)