TWI317251B - A plating process for making an electronic device - Google Patents
A plating process for making an electronic device Download PDFInfo
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- TWI317251B TWI317251B TW092125053A TW92125053A TWI317251B TW I317251 B TWI317251 B TW I317251B TW 092125053 A TW092125053 A TW 092125053A TW 92125053 A TW92125053 A TW 92125053A TW I317251 B TWI317251 B TW I317251B
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000007747 plating Methods 0.000 title claims description 30
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/36—Inkjet printing inks based on non-aqueous solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Glass Compositions (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0221891.5A GB0221891D0 (en) | 2002-09-20 | 2002-09-20 | Process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200421952A TW200421952A (en) | 2004-10-16 |
| TWI317251B true TWI317251B (en) | 2009-11-11 |
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ID=9944477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092125053A TWI317251B (en) | 2002-09-20 | 2003-09-10 | A plating process for making an electronic device |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US7314573B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1543703B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP4392350B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR100961713B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN1695406A (cg-RX-API-DMAC7.html) |
| AT (1) | ATE341187T1 (cg-RX-API-DMAC7.html) |
| AU (1) | AU2003260730A1 (cg-RX-API-DMAC7.html) |
| DE (1) | DE60308705T2 (cg-RX-API-DMAC7.html) |
| GB (1) | GB0221891D0 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI317251B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2004028224A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4633727B2 (ja) * | 2003-05-30 | 2011-02-16 | フジフィルム・イメイジング・カラランツ・リミテッド | 方法 |
| GB0324947D0 (en) * | 2003-10-25 | 2003-11-26 | Avecia Ltd | Process |
| EP2915856B1 (en) * | 2014-03-03 | 2019-10-16 | Agfa-Gevaert | Etch-resistant inkjet inks for manufacturing conductive patterns |
| CN104494310B (zh) * | 2014-09-16 | 2017-04-12 | 苏州锐发打印技术有限公司 | 用于太阳能电池网格导线制作的3d打印系统及控制方法 |
| US10743420B2 (en) * | 2015-06-04 | 2020-08-11 | Kateeva, Inc. | Methods for producing an etch resist pattern on a metallic surface |
| US10806035B2 (en) | 2015-08-13 | 2020-10-13 | Kateeva, Inc. | Methods for producing an etch resist pattern on a metallic surface |
| US10398034B2 (en) | 2016-12-12 | 2019-08-27 | Kateeva, Inc. | Methods of etching conductive features, and related devices and systems |
| EP3786239B1 (en) * | 2019-08-26 | 2023-11-15 | Agfa-Gevaert Nv | Radiation curable composition for plating applications |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4315985A (en) * | 1972-11-30 | 1982-02-16 | International Business Machines Corporation | Fine-line circuit fabrication and photoresist application therefor |
| US4270985A (en) * | 1978-07-21 | 1981-06-02 | Dynachem Corporation | Screen printing of photopolymerizable inks |
| US5270368A (en) * | 1992-07-15 | 1993-12-14 | Videojet Systems International, Inc. | Etch-resistant jet ink and process |
| US5721007A (en) * | 1994-09-08 | 1998-02-24 | The Whitaker Corporation | Process for low density additive flexible circuits and harnesses |
| JPH10282662A (ja) | 1997-04-07 | 1998-10-23 | Nippon Kayaku Co Ltd | 液状フォトレジストインク組成物及びその硬化物 |
-
2002
- 2002-09-20 GB GBGB0221891.5A patent/GB0221891D0/en not_active Ceased
-
2003
- 2003-08-22 AT AT03797363T patent/ATE341187T1/de not_active IP Right Cessation
- 2003-08-22 KR KR1020057004708A patent/KR100961713B1/ko not_active Expired - Fee Related
- 2003-08-22 DE DE60308705T patent/DE60308705T2/de not_active Expired - Lifetime
- 2003-08-22 AU AU2003260730A patent/AU2003260730A1/en not_active Abandoned
- 2003-08-22 CN CNA038252031A patent/CN1695406A/zh active Pending
- 2003-08-22 EP EP03797363A patent/EP1543703B1/en not_active Expired - Lifetime
- 2003-08-22 JP JP2004537254A patent/JP4392350B2/ja not_active Expired - Fee Related
- 2003-08-22 WO PCT/GB2003/003679 patent/WO2004028224A1/en not_active Ceased
- 2003-08-22 US US10/528,581 patent/US7314573B2/en not_active Expired - Fee Related
- 2003-09-10 TW TW092125053A patent/TWI317251B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004028224A1 (en) | 2004-04-01 |
| GB0221891D0 (en) | 2002-10-30 |
| US20060049129A1 (en) | 2006-03-09 |
| ATE341187T1 (de) | 2006-10-15 |
| CN1695406A (zh) | 2005-11-09 |
| KR20050071496A (ko) | 2005-07-07 |
| TW200421952A (en) | 2004-10-16 |
| JP2005539389A (ja) | 2005-12-22 |
| US7314573B2 (en) | 2008-01-01 |
| AU2003260730A1 (en) | 2004-04-08 |
| DE60308705T2 (de) | 2007-08-16 |
| JP4392350B2 (ja) | 2009-12-24 |
| EP1543703A1 (en) | 2005-06-22 |
| KR100961713B1 (ko) | 2010-06-10 |
| DE60308705D1 (de) | 2006-11-09 |
| EP1543703B1 (en) | 2006-09-27 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |