CN1695406A - 沉积方法 - Google Patents

沉积方法 Download PDF

Info

Publication number
CN1695406A
CN1695406A CNA038252031A CN03825203A CN1695406A CN 1695406 A CN1695406 A CN 1695406A CN A038252031 A CNA038252031 A CN A038252031A CN 03825203 A CN03825203 A CN 03825203A CN 1695406 A CN1695406 A CN 1695406A
Authority
CN
China
Prior art keywords
parts
ink
deposition
resistant
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA038252031A
Other languages
English (en)
Chinese (zh)
Inventor
A·J·霍珀
M·R·詹姆斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avecia Ltd
Original Assignee
Avecia Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avecia Ltd filed Critical Avecia Ltd
Publication of CN1695406A publication Critical patent/CN1695406A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Glass Compositions (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Chemically Coating (AREA)
CNA038252031A 2002-09-20 2003-08-22 沉积方法 Pending CN1695406A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0221891.5A GB0221891D0 (en) 2002-09-20 2002-09-20 Process
GB0221891.5 2002-09-20

Publications (1)

Publication Number Publication Date
CN1695406A true CN1695406A (zh) 2005-11-09

Family

ID=9944477

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA038252031A Pending CN1695406A (zh) 2002-09-20 2003-08-22 沉积方法

Country Status (11)

Country Link
US (1) US7314573B2 (cg-RX-API-DMAC7.html)
EP (1) EP1543703B1 (cg-RX-API-DMAC7.html)
JP (1) JP4392350B2 (cg-RX-API-DMAC7.html)
KR (1) KR100961713B1 (cg-RX-API-DMAC7.html)
CN (1) CN1695406A (cg-RX-API-DMAC7.html)
AT (1) ATE341187T1 (cg-RX-API-DMAC7.html)
AU (1) AU2003260730A1 (cg-RX-API-DMAC7.html)
DE (1) DE60308705T2 (cg-RX-API-DMAC7.html)
GB (1) GB0221891D0 (cg-RX-API-DMAC7.html)
TW (1) TWI317251B (cg-RX-API-DMAC7.html)
WO (1) WO2004028224A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104494310A (zh) * 2014-09-16 2015-04-08 苏州锐发打印技术有限公司 用于太阳能电池网格导线制作的3d打印系统及控制方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4633727B2 (ja) * 2003-05-30 2011-02-16 フジフィルム・イメイジング・カラランツ・リミテッド 方法
GB0324947D0 (en) * 2003-10-25 2003-11-26 Avecia Ltd Process
EP2915856B1 (en) * 2014-03-03 2019-10-16 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
US10743420B2 (en) * 2015-06-04 2020-08-11 Kateeva, Inc. Methods for producing an etch resist pattern on a metallic surface
US10806035B2 (en) 2015-08-13 2020-10-13 Kateeva, Inc. Methods for producing an etch resist pattern on a metallic surface
US10398034B2 (en) 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
EP3786239B1 (en) * 2019-08-26 2023-11-15 Agfa-Gevaert Nv Radiation curable composition for plating applications

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4315985A (en) * 1972-11-30 1982-02-16 International Business Machines Corporation Fine-line circuit fabrication and photoresist application therefor
US4270985A (en) * 1978-07-21 1981-06-02 Dynachem Corporation Screen printing of photopolymerizable inks
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
US5721007A (en) * 1994-09-08 1998-02-24 The Whitaker Corporation Process for low density additive flexible circuits and harnesses
JPH10282662A (ja) 1997-04-07 1998-10-23 Nippon Kayaku Co Ltd 液状フォトレジストインク組成物及びその硬化物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104494310A (zh) * 2014-09-16 2015-04-08 苏州锐发打印技术有限公司 用于太阳能电池网格导线制作的3d打印系统及控制方法

Also Published As

Publication number Publication date
WO2004028224A1 (en) 2004-04-01
GB0221891D0 (en) 2002-10-30
US20060049129A1 (en) 2006-03-09
ATE341187T1 (de) 2006-10-15
KR20050071496A (ko) 2005-07-07
TW200421952A (en) 2004-10-16
JP2005539389A (ja) 2005-12-22
US7314573B2 (en) 2008-01-01
AU2003260730A1 (en) 2004-04-08
DE60308705T2 (de) 2007-08-16
TWI317251B (en) 2009-11-11
JP4392350B2 (ja) 2009-12-24
EP1543703A1 (en) 2005-06-22
KR100961713B1 (ko) 2010-06-10
DE60308705D1 (de) 2006-11-09
EP1543703B1 (en) 2006-09-27

Similar Documents

Publication Publication Date Title
EP1543083B1 (en) Process and ink for making electronic devices
KR101685469B1 (ko) 개선된 핫 멜트 조성물
EP1543704B1 (en) Printing process and solder mask ink composition
JP4633727B2 (ja) 方法
US20060019077A1 (en) Process
EP0659039A2 (en) Ultraviolet-curing composition, pattern forming method making use of the same, printed-wiring board and its production
KR102349608B1 (ko) 전달 필름을 사용한 3차원 기재의 이미지화
US9611402B2 (en) Hot melt compositions with improved etch resistance
JP4392350B2 (ja) メッキ法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication