FR3118052B1 - Poudre pour revêtement électriquement isolant - Google Patents

Poudre pour revêtement électriquement isolant Download PDF

Info

Publication number
FR3118052B1
FR3118052B1 FR2014033A FR2014033A FR3118052B1 FR 3118052 B1 FR3118052 B1 FR 3118052B1 FR 2014033 A FR2014033 A FR 2014033A FR 2014033 A FR2014033 A FR 2014033A FR 3118052 B1 FR3118052 B1 FR 3118052B1
Authority
FR
France
Prior art keywords
powder
electrically insulating
insulating coating
relates
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2014033A
Other languages
English (en)
Other versions
FR3118052A1 (fr
Inventor
Santiago Carreras
Jean-Yves Loze
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arkema France SA
Original Assignee
Arkema France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR2014033A priority Critical patent/FR3118052B1/fr
Application filed by Arkema France SA filed Critical Arkema France SA
Priority to JP2023538958A priority patent/JP2024502290A/ja
Priority to PCT/FR2021/052411 priority patent/WO2022136789A1/fr
Priority to EP21852041.9A priority patent/EP4267653A1/fr
Priority to CN202180090927.7A priority patent/CN116724069A/zh
Priority to KR1020237025102A priority patent/KR20230124688A/ko
Priority to US18/269,228 priority patent/US20240052198A1/en
Publication of FR3118052A1 publication Critical patent/FR3118052A1/fr
Application granted granted Critical
Publication of FR3118052B1 publication Critical patent/FR3118052B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/08Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino-carboxylic acids
    • C08G69/14Lactams
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D177/00Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D177/02Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D177/00Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/02Processes for applying liquids or other fluent materials performed by spraying
    • B05D1/04Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field
    • B05D1/06Applying particulate materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254After-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44Amides
    • C08G59/444Sulfonamides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/08Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino-carboxylic acids
    • C08G69/10Alpha-amino-carboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/36Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03Powdery paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03Powdery paints
    • C09D5/031Powdery paints characterised by particle size or shape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03Powdery paints
    • C09D5/032Powdery paints characterised by a special effect of the produced film, e.g. wrinkle, pearlescence, matt finish
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/305Polyamides or polyesteramides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/18Processes for applying liquids or other fluent materials performed by dipping
    • B05D1/22Processes for applying liquids or other fluent materials performed by dipping using fluidised-bed technique
    • B05D1/24Applying particulate materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00Metallic substrate
    • B05D2202/20Metallic substrate based on light metals
    • B05D2202/25Metallic substrate based on light metals based on Al
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00Metallic substrate
    • B05D2202/40Metallic substrate based on other transition elements
    • B05D2202/45Metallic substrate based on other transition elements based on Cu
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0218Pretreatment, e.g. heating the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0406Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
    • B05D3/0426Cooling with air
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • C08L2203/206Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G5/00Installations of bus-bars

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Proteomics, Peptides & Aminoacids (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L’invention concerne l’utilisation d’une poudre comprenant au moins un polyamide et au moins une résine époxy pour la fabrication d’un revêtement électriquement isolant d’une surface. L’invention concerne également un composant de transport de l’électricité recouvert au moins en partie d’un revêtement susceptible d’être obtenu par la fusion d’une telle poudre. Pas de figure.
FR2014033A 2020-12-23 2020-12-23 Poudre pour revêtement électriquement isolant Active FR3118052B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR2014033A FR3118052B1 (fr) 2020-12-23 2020-12-23 Poudre pour revêtement électriquement isolant
PCT/FR2021/052411 WO2022136789A1 (fr) 2020-12-23 2021-12-21 Poudre pour revêtement électriquement isolant
EP21852041.9A EP4267653A1 (fr) 2020-12-23 2021-12-21 Poudre pour revêtement électriquement isolant
CN202180090927.7A CN116724069A (zh) 2020-12-23 2021-12-21 用于电绝缘涂层的粉末
JP2023538958A JP2024502290A (ja) 2020-12-23 2021-12-21 電気絶縁性コーティング用粉末
KR1020237025102A KR20230124688A (ko) 2020-12-23 2021-12-21 전기 절연 코팅용 분말
US18/269,228 US20240052198A1 (en) 2020-12-23 2021-12-21 Powder for an electrically insulating coating

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2014033A FR3118052B1 (fr) 2020-12-23 2020-12-23 Poudre pour revêtement électriquement isolant
FR2014033 2020-12-23

Publications (2)

Publication Number Publication Date
FR3118052A1 FR3118052A1 (fr) 2022-06-24
FR3118052B1 true FR3118052B1 (fr) 2023-11-24

Family

ID=74871589

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2014033A Active FR3118052B1 (fr) 2020-12-23 2020-12-23 Poudre pour revêtement électriquement isolant

Country Status (7)

Country Link
US (1) US20240052198A1 (fr)
EP (1) EP4267653A1 (fr)
JP (1) JP2024502290A (fr)
KR (1) KR20230124688A (fr)
CN (1) CN116724069A (fr)
FR (1) FR3118052B1 (fr)
WO (1) WO2022136789A1 (fr)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4885187A (en) 1988-11-07 1989-12-05 Minnesota Mining And Manufacturing Company Process for coating electrical bus bars and the like
FR2650834B1 (fr) * 1989-08-11 1991-10-18 Atochem Compositions thermoplastiques en poudre a base de polyamide et/ou de polyetheresteramide, leur procede de preparation et leur utilisation pour le revetement de substrats metalliques
US5652326A (en) 1993-03-03 1997-07-29 Sanyo Chemical Industries, Ltd. Polyetheresteramide and antistatic resin composition
FR2846332B1 (fr) 2002-10-23 2004-12-03 Atofina Copolymeres transparents a blocs polyamides et blocs polyethers
JP4193588B2 (ja) 2003-05-26 2008-12-10 宇部興産株式会社 ポリアミド系エラストマー
JP4161802B2 (ja) 2003-05-27 2008-10-08 宇部興産株式会社 ポリアミド組成物
US7056975B2 (en) 2003-05-27 2006-06-06 Ube Industries, Ltd. Thermoplastic resin composition having improved resistance to hydrolysis
FR2941700B1 (fr) 2009-02-02 2012-03-16 Arkema France Procede de synthese d'un alliage de copolymere a blocs presentant des proprietes antistatiques ameliorees.
FR2955864B1 (fr) 2010-02-01 2012-03-23 Arkema France Poudre a base de polyamide et procede de revetement d'objet par fusion de ladite poudre
EP3031862B1 (fr) * 2014-12-11 2018-08-29 Ems-Patent Ag Structure a plusieurs couches ayant au moins une couche metallique et au moins une couche polyamide
JP6392952B1 (ja) * 2017-08-10 2018-09-19 日本ペイント・インダストリアルコ−ティングス株式会社 粉体塗料組成物
FR3087775B1 (fr) 2018-10-24 2022-12-02 Arkema France Poudres de copolyamide a basse temperature de fusion
WO2020242272A1 (fr) 2019-05-30 2020-12-03 주식회사 아모그린텍 Barre omnibus à dissipation de chaleur, électriquement isolante

Also Published As

Publication number Publication date
JP2024502290A (ja) 2024-01-18
FR3118052A1 (fr) 2022-06-24
KR20230124688A (ko) 2023-08-25
WO2022136789A1 (fr) 2022-06-30
CN116724069A (zh) 2023-09-08
EP4267653A1 (fr) 2023-11-01
US20240052198A1 (en) 2024-02-15

Similar Documents

Publication Publication Date Title
KR101744627B1 (ko) 코일 부품
TW200833771A (en) Improved epoxy compositions
PH12018502363A1 (en) Liquid resin composition for sealing and electronic component device
FR3118052B1 (fr) Poudre pour revêtement électriquement isolant
CA3056671C (fr) Preimpregne et materiau composite renforce de fibres
US9049775B2 (en) Housing for an electric circuit for a fuel pump
TWI513066B (zh) 發光二極體封裝結構
US20070102796A1 (en) Power semiconductor module
CN107683533A (zh) 光电子器件和用于制造光电子器件的方法
US9605837B2 (en) Lighting device
MY201277A (en) Extended stiffener for platform miniaturization
DE60227433D1 (de) Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontage
US20210076497A1 (en) Circuit substrate arrangement with improved electrical contact
JP2017108002A (ja) 半導体モジュール
TWI313925B (en) A semiconductor connection package for an integrated circuit, a method of connecting a semiconductor connection package to an integrated circuit and an apparatus
WO2011001446A4 (fr) Enrobage anti-usure et/ou anti-frottement sur joint à rotule
US20170155025A1 (en) Light emitting device
US11499861B2 (en) Radar module
JP2014203919A (ja) 半導体装置
US20150262964A1 (en) Semiconductor chip and semiconductor package
AU2003292782A1 (en) Epoxy resin composition
TW430685B (en) Epoxy resin liquid composition for semiconductor encapsulation
US11462450B2 (en) Semiconductor device
CN113557410A (zh) 角度检测装置
FR3090985B1 (fr) Câble comprenant une couche semi-conductrice facilement pelable

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20220624

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4