FR3064817B1 - Boitier plastique non coplanaire d'encapsulation d'un composant electronique hyperfrequence de puissance - Google Patents

Boitier plastique non coplanaire d'encapsulation d'un composant electronique hyperfrequence de puissance Download PDF

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Publication number
FR3064817B1
FR3064817B1 FR1700356A FR1700356A FR3064817B1 FR 3064817 B1 FR3064817 B1 FR 3064817B1 FR 1700356 A FR1700356 A FR 1700356A FR 1700356 A FR1700356 A FR 1700356A FR 3064817 B1 FR3064817 B1 FR 3064817B1
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France
Prior art keywords
encapsulation
power
hyperfrequency
component
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1700356A
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English (en)
Other versions
FR3064817A1 (fr
Inventor
Pierre Franck Alleaume
Laurent Marechal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Monolithic Semiconductors SAS
Original Assignee
United Monolithic Semiconductors SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Monolithic Semiconductors SAS filed Critical United Monolithic Semiconductors SAS
Priority to FR1700356A priority Critical patent/FR3064817B1/fr
Publication of FR3064817A1 publication Critical patent/FR3064817A1/fr
Application granted granted Critical
Publication of FR3064817B1 publication Critical patent/FR3064817B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structure Of Receivers (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne une solution pour réaliser l'encapsulation d'un composant (14) de très haute fréquence et de forte puissance dans un boitier plastique standard (10), le boitier comportant une embase conductrice (11) thermiquement et électriquement sur laquelle est placé le composant (14) et un corps de boitier (13) réalisant l'encapsulation. Les broches (123) par lesquelles transitent les signaux à très haute fréquence, sont configurées et agencées de façon à former avec des broches de masse (122) disposées latéralement à celles-ci, des structures de guide d'ondes assurant un transit de ces signaux entre le composant (14) et l'extérieur du boitier d'encapsulation (10) avec une altération minimale. Les broches de connexion du boitier sont en outre disposées dans un plan décalé par rapport au plan de l'embase (11), ce qui permet de découpler les problèmes de transmission des signaux à très haute fréquence, des problèmes de dissipation thermique.
FR1700356A 2017-04-04 2017-04-04 Boitier plastique non coplanaire d'encapsulation d'un composant electronique hyperfrequence de puissance Active FR3064817B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1700356A FR3064817B1 (fr) 2017-04-04 2017-04-04 Boitier plastique non coplanaire d'encapsulation d'un composant electronique hyperfrequence de puissance

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1700356A FR3064817B1 (fr) 2017-04-04 2017-04-04 Boitier plastique non coplanaire d'encapsulation d'un composant electronique hyperfrequence de puissance
FR1700356 2017-04-04

Publications (2)

Publication Number Publication Date
FR3064817A1 FR3064817A1 (fr) 2018-10-05
FR3064817B1 true FR3064817B1 (fr) 2021-07-23

Family

ID=59579662

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1700356A Active FR3064817B1 (fr) 2017-04-04 2017-04-04 Boitier plastique non coplanaire d'encapsulation d'un composant electronique hyperfrequence de puissance

Country Status (1)

Country Link
FR (1) FR3064817B1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002063684A2 (fr) * 2001-02-02 2002-08-15 Stratedge Corporation Boitier a montage en surface monocouche
US20080197465A1 (en) * 2007-02-20 2008-08-21 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method of manufacturing the same
JP5001872B2 (ja) * 2008-02-13 2012-08-15 ルネサスエレクトロニクス株式会社 半導体装置
US8592960B2 (en) * 2010-08-31 2013-11-26 Viasat, Inc. Leadframe package with integrated partial waveguide interface
CN108352364B (zh) * 2015-09-01 2021-07-13 马科技术解决方案控股公司 空气腔封装

Also Published As

Publication number Publication date
FR3064817A1 (fr) 2018-10-05

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