FR3055978B1 - Dispositif de traitement laser - Google Patents

Dispositif de traitement laser Download PDF

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Publication number
FR3055978B1
FR3055978B1 FR1758239A FR1758239A FR3055978B1 FR 3055978 B1 FR3055978 B1 FR 3055978B1 FR 1758239 A FR1758239 A FR 1758239A FR 1758239 A FR1758239 A FR 1758239A FR 3055978 B1 FR3055978 B1 FR 3055978B1
Authority
FR
France
Prior art keywords
transparent member
transparent
light
passing
treatment device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1758239A
Other languages
English (en)
Other versions
FR3055978A1 (fr
Inventor
Hiroshi Ohno
Kota Nomura
Tetsuo Sakai
Itaru Chida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of FR3055978A1 publication Critical patent/FR3055978A1/fr
Application granted granted Critical
Publication of FR3055978B1 publication Critical patent/FR3055978B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D10/00—Modifying the physical properties by methods other than heat treatment or deformation
    • C21D10/005—Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B23K26/103—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam the laser beam rotating around the fixed workpiece
    • B23K26/106—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam the laser beam rotating around the fixed workpiece inside the workpiece
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/262—Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21C—NUCLEAR REACTORS
    • G21C21/00—Apparatus or processes specially adapted to the manufacture of reactors or parts thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Semiconductor Lasers (AREA)

Abstract

Selon un mode de réalisation, un dispositif de traitement au laser comprend une section d'irradiation de lumière, et un élément optique. L'élément optique comprend un premier élément transparent fourni via un espace avec une extrémité de la section d'irradiation de lumière, et un second élément transparent. Le premier élément transparent comprend une première surface opposée à l'extrémité de la section d'irradiation de lumière, et une seconde surface fournie afin d'être connectée à la première surface. Le second élément transparent comprend une surface plane et une surface convexe, la surface plane étant fournie afin d'être opposée à la seconde surface du premier élément transparent, la lumière qui est passée à travers le premier élément transparent passant à travers la surface convexe. Un axe optique du faisceau laser passant à travers la première surface et un axe optique passant à travers la surface convexe sont différents l'un de l'autre.
FR1758239A 2016-09-14 2017-09-07 Dispositif de traitement laser Active FR3055978B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016179165 2016-09-14
JP2016179165A JP6483647B2 (ja) 2016-09-14 2016-09-14 レーザ加工装置

Publications (2)

Publication Number Publication Date
FR3055978A1 FR3055978A1 (fr) 2018-03-16
FR3055978B1 true FR3055978B1 (fr) 2020-11-20

Family

ID=61387316

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1758239A Active FR3055978B1 (fr) 2016-09-14 2017-09-07 Dispositif de traitement laser

Country Status (4)

Country Link
US (1) US10946481B2 (fr)
JP (1) JP6483647B2 (fr)
KR (1) KR101985091B1 (fr)
FR (1) FR3055978B1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202009738PA (en) 2018-04-23 2020-10-29 Lsp Technologies Inc Apparatus for laser peening hidden surfaces
KR102075731B1 (ko) * 2018-09-27 2020-02-10 한국기계연구원 레이저 제염 시스템
EP3653330A1 (fr) * 2018-11-13 2020-05-20 Unitechnologies SA Dispositif et procédé de traitement de surface à l'intérieur de petites cavités de forme libre et de petites rainures de forme libre
US20210301368A1 (en) * 2020-03-30 2021-09-30 Airbus Sas Laser shock peening apparatus
US20240115319A1 (en) * 2022-10-06 2024-04-11 Cyclone Biosciences, Llc Laser resection device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2992093B2 (ja) 1991-01-16 1999-12-20 並木精密宝石株式会社 微小レンズ付光ファイバ端末
JPH05110181A (ja) * 1991-10-16 1993-04-30 Toshiba Corp レーザービーム切り替え機構
DE19618149B4 (de) * 1996-05-07 2005-01-20 Daimlerchrysler Ag Optische Verbindungsleiste
US6987240B2 (en) 2002-04-18 2006-01-17 Applied Materials, Inc. Thermal flux processing by scanning
JP4025598B2 (ja) 2002-07-29 2007-12-19 京セラ株式会社 ファイバーレンズ
GB2398034B (en) * 2003-02-04 2005-08-10 Rolls Royce Plc Laser shock peening
JP4697699B2 (ja) 2004-04-28 2011-06-08 株式会社東芝 レーザー加工装置
US20120074110A1 (en) * 2008-08-20 2012-03-29 Zediker Mark S Fluid laser jets, cutting heads, tools and methods of use
WO2014147724A1 (fr) 2013-03-18 2014-09-25 株式会社 東芝 Dispositif électronique et procédé d'entrée
JP6430219B2 (ja) * 2014-11-17 2018-11-28 株式会社東芝 レーザ加工装置及びレーザ加工方法

Also Published As

Publication number Publication date
US10946481B2 (en) 2021-03-16
KR20180030386A (ko) 2018-03-22
FR3055978A1 (fr) 2018-03-16
JP2018043266A (ja) 2018-03-22
US20180071863A1 (en) 2018-03-15
KR101985091B1 (ko) 2019-05-31
JP6483647B2 (ja) 2019-03-13

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