FR3027705B1 - Module a microcircuit, procede de fabrication d'un module a microcircuit, dispositif electronique comportant un tel module - Google Patents
Module a microcircuit, procede de fabrication d'un module a microcircuit, dispositif electronique comportant un tel moduleInfo
- Publication number
- FR3027705B1 FR3027705B1 FR1402413A FR1402413A FR3027705B1 FR 3027705 B1 FR3027705 B1 FR 3027705B1 FR 1402413 A FR1402413 A FR 1402413A FR 1402413 A FR1402413 A FR 1402413A FR 3027705 B1 FR3027705 B1 FR 3027705B1
- Authority
- FR
- France
- Prior art keywords
- module
- microcircuit
- electronic device
- manufacturing
- microcircuit module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Security & Cryptography (AREA)
- General Engineering & Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1402413A FR3027705B1 (fr) | 2014-10-27 | 2014-10-27 | Module a microcircuit, procede de fabrication d'un module a microcircuit, dispositif electronique comportant un tel module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1402413A FR3027705B1 (fr) | 2014-10-27 | 2014-10-27 | Module a microcircuit, procede de fabrication d'un module a microcircuit, dispositif electronique comportant un tel module |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3027705A1 FR3027705A1 (fr) | 2016-04-29 |
FR3027705B1 true FR3027705B1 (fr) | 2017-12-22 |
Family
ID=52589437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1402413A Active FR3027705B1 (fr) | 2014-10-27 | 2014-10-27 | Module a microcircuit, procede de fabrication d'un module a microcircuit, dispositif electronique comportant un tel module |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3027705B1 (fr) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2784768A1 (fr) * | 1998-10-16 | 2000-04-21 | Schlumberger Ind Sa | Puce a circuits integres securisee contre l'action de rayonnements electromagnetiques |
EP1594163A1 (fr) * | 2004-05-03 | 2005-11-09 | Commissariat A L'energie Atomique | Dispositif électrique blindé et son procédé de fabrication |
EP2533175B1 (fr) * | 2011-06-10 | 2016-11-09 | Oberthur Technologies | Support de données dotées d'une plaque de contact avec une impression dessus |
EP2720175A1 (fr) * | 2012-10-09 | 2014-04-16 | Gemalto SA | Module électronique, dispositif à module électronique et procédé de fabrication. |
-
2014
- 2014-10-27 FR FR1402413A patent/FR3027705B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
FR3027705A1 (fr) | 2016-04-29 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 2 |
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PLSC | Publication of the preliminary search report |
Effective date: 20160429 |
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PLFP | Fee payment |
Year of fee payment: 3 |
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PLFP | Fee payment |
Year of fee payment: 4 |
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PLFP | Fee payment |
Year of fee payment: 5 |
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PLFP | Fee payment |
Year of fee payment: 6 |
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PLFP | Fee payment |
Year of fee payment: 7 |
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CA | Change of address |
Effective date: 20201019 |
|
CD | Change of name or company name |
Owner name: IDEMIA FRANCE, FR Effective date: 20201019 |
|
PLFP | Fee payment |
Year of fee payment: 8 |
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PLFP | Fee payment |
Year of fee payment: 9 |
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PLFP | Fee payment |
Year of fee payment: 10 |