FR3027186B3 - Module de rangee de connexion a dissipateur thermique integre - Google Patents

Module de rangee de connexion a dissipateur thermique integre

Info

Publication number
FR3027186B3
FR3027186B3 FR1559558A FR1559558A FR3027186B3 FR 3027186 B3 FR3027186 B3 FR 3027186B3 FR 1559558 A FR1559558 A FR 1559558A FR 1559558 A FR1559558 A FR 1559558A FR 3027186 B3 FR3027186 B3 FR 3027186B3
Authority
FR
France
Prior art keywords
integrated thermal
connection range
range module
thermal dissipator
dissipator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1559558A
Other languages
English (en)
French (fr)
Other versions
FR3027186A3 (fr
Inventor
Cheng Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DSM IP Assets BV
Original Assignee
DSM IP Assets BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DSM IP Assets BV filed Critical DSM IP Assets BV
Publication of FR3027186A3 publication Critical patent/FR3027186A3/fr
Application granted granted Critical
Publication of FR3027186B3 publication Critical patent/FR3027186B3/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/52—Cooling of switch parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
FR1559558A 2014-10-09 2015-10-08 Module de rangee de connexion a dissipateur thermique integre Expired - Fee Related FR3027186B3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420581100.3U CN204466125U (zh) 2014-10-09 2014-10-09 一种集成散热器连接排模块

Publications (2)

Publication Number Publication Date
FR3027186A3 FR3027186A3 (fr) 2016-04-15
FR3027186B3 true FR3027186B3 (fr) 2016-12-16

Family

ID=53672940

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1559558A Expired - Fee Related FR3027186B3 (fr) 2014-10-09 2015-10-08 Module de rangee de connexion a dissipateur thermique integre

Country Status (7)

Country Link
JP (1) JP3203138U (ja)
KR (1) KR20160001282U (ja)
CN (1) CN204466125U (ja)
DE (1) DE202015105289U1 (ja)
FR (1) FR3027186B3 (ja)
IT (1) ITUB201579471U1 (ja)
RU (1) RU162623U1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205030031U (zh) * 2015-10-12 2016-02-10 中磊电子（苏州）有限公司 导热塑料散热器与通信装置
CN106816345A (zh) * 2015-11-27 2017-06-09 帝斯曼知识产权资产管理有限公司 塑壳断路器底座
CN111816630B (zh) * 2020-06-30 2022-07-05 科华恒盛股份有限公司 一种散热结构及功率模块
DE102021124036A1 (de) 2021-09-16 2023-03-16 Song Chuan Precision Co., Ltd. Elektromagnetisches Relais
CN114131023A (zh) * 2021-11-03 2022-03-04 西安交通大学 大容量断路器散热结构的制造方法
US20230328931A1 (en) * 2022-04-08 2023-10-12 Hamilton Sundstrand Corporation Clip-on dielectric thermal dissipation fins

Also Published As

Publication number Publication date
ITUB201579471U1 (it) 2017-04-07
FR3027186A3 (fr) 2016-04-15
DE202015105289U1 (de) 2016-01-18
JP3203138U (ja) 2016-03-17
CN204466125U (zh) 2015-07-08
RU162623U1 (ru) 2016-06-20
KR20160001282U (ko) 2016-04-19

Similar Documents

Publication Publication Date Title
BR112015029406A2 (pt) módulo de câmera
DK2949038T3 (da) Solcellemodul
DK2994238T3 (da) Belægningsanordning til termisk belægning
DK3472878T3 (da) Batterimodul med optimeret varmespredning
FR3009435B1 (fr) Module thermoelectrique
FR3027186B3 (fr) Module de rangee de connexion a dissipateur thermique integre
DK3522045T3 (da) Overlappende solcellemodul
HK1244319A1 (zh) 具有熱模塊的濕度傳感器
DE112014002074A5 (de) Kameramodul mit optimierter Wärmeabfuhr
DK2908069T3 (da) Solvarme absorberelement
DK3090175T3 (da) Mikrofluidisk indretning
FR3012417B1 (fr) Nacelle de turboreacteur
FR3005529B1 (fr) Module thermoelectrique
FI20135291A (fi) Lämpöpatterijärjestely
DK3401938T3 (da) Fotovoltaisk element
BR112018000487A2 (pt) dispositivo de isolamento térmico
DK3009763T3 (da) Termisk solfanger
FI11037U1 (fi) Lasielementti
FR3004236B1 (fr) Cage thermique etanche
DK3222148T3 (da) Tempereringsmodul
DK3183938T3 (da) Opvarmningsmodul
FR3018543B1 (fr) Installation thermique de combustion
DE112014005184A5 (de) Ausrückvorrichtung
FI10980U1 (fi) Jäähdytysmoduuli ja jäähdytyselementti
FR3025594B1 (fr) Echangeur thermique a degivrage ameliore

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

ST Notification of lapse

Effective date: 20210605