DE112014002074A5 - Kameramodul mit optimierter Wärmeabfuhr - Google Patents

Kameramodul mit optimierter Wärmeabfuhr Download PDF

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Publication number
DE112014002074A5
DE112014002074A5 DE112014002074.5T DE112014002074T DE112014002074A5 DE 112014002074 A5 DE112014002074 A5 DE 112014002074A5 DE 112014002074 T DE112014002074 T DE 112014002074T DE 112014002074 A5 DE112014002074 A5 DE 112014002074A5
Authority
DE
Germany
Prior art keywords
heat dissipation
camera module
optimized heat
optimized
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112014002074.5T
Other languages
English (en)
Inventor
Franz Pfeiffer
Dieter Urban
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of DE112014002074A5 publication Critical patent/DE112014002074A5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
DE112014002074.5T 2013-08-09 2014-07-31 Kameramodul mit optimierter Wärmeabfuhr Withdrawn DE112014002074A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013108677.2A DE102013108677A1 (de) 2013-08-09 2013-08-09 Kameramodul mit optimierter Wärmeabfuhr
DE102013108677.2 2013-08-09
PCT/DE2014/200369 WO2015018414A1 (de) 2013-08-09 2014-07-31 Kameramodul mit optimierter wärmeabfuhr

Publications (1)

Publication Number Publication Date
DE112014002074A5 true DE112014002074A5 (de) 2015-12-31

Family

ID=51492138

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102013108677.2A Withdrawn DE102013108677A1 (de) 2013-08-09 2013-08-09 Kameramodul mit optimierter Wärmeabfuhr
DE112014002074.5T Withdrawn DE112014002074A5 (de) 2013-08-09 2014-07-31 Kameramodul mit optimierter Wärmeabfuhr

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102013108677.2A Withdrawn DE102013108677A1 (de) 2013-08-09 2013-08-09 Kameramodul mit optimierter Wärmeabfuhr

Country Status (2)

Country Link
DE (2) DE102013108677A1 (de)
WO (1) WO2015018414A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102464321B1 (ko) * 2015-07-15 2022-11-08 엘지이노텍 주식회사 카메라 모듈
DE102016100977A1 (de) * 2016-01-21 2017-07-27 Connaught Electronics Ltd. Antennenmodul für ein Kraftfahrzeug, Fahrerassistenzsystem sowie Kraftfahrzeug
US11402726B2 (en) 2018-07-17 2022-08-02 Lucid Vision Labs, Inc. Camera with alignable image sensor
JP7346281B2 (ja) * 2019-12-23 2023-09-19 美里工業株式会社 ドアミラー用発光ユニット
DE102022116986A1 (de) 2022-07-07 2024-01-18 Valeo Schalter Und Sensoren Gmbh Detektionsvorrichtung für ein Fahrzeug, Gehäuseteil für ein Gehäuse für eine Detektionsvorrichtung und Verfahren zur Herstellung einer Detektionsvorrichtung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5381176A (en) * 1991-08-11 1995-01-10 Sony Corporation Miniaturized video camera
DE10259795A1 (de) * 2002-12-19 2004-07-08 Siemens Ag Bilderzeugungsvorrichtung zum Einbau im Dachbereich oder im Aussenspiegel eines Kraftfahrzeuges
US20070097652A1 (en) * 2005-10-31 2007-05-03 Camdeor Technology Co., Ltd. Heat dissipator for a surveillance camera
TW201224719A (en) * 2010-12-07 2012-06-16 Hon Hai Prec Ind Co Ltd Electronic device
JPWO2012137267A1 (ja) * 2011-04-05 2014-07-28 パナソニック株式会社 固体撮像装置及び固体撮像装置の製造方法
DE102011109594A1 (de) * 2011-08-05 2013-02-07 Connaught Electronics Ltd. Vorrichtung mit einem Gehäuse, zumindest zwei Leiterplatten und zumindest einem Wärmeableitelement

Also Published As

Publication number Publication date
WO2015018414A1 (de) 2015-02-12
DE102013108677A1 (de) 2015-02-12

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Legal Events

Date Code Title Description
R005 Application deemed withdrawn due to failure to request examination