RU162623U1 - Комплексный модуль теплопоглотителя с соединительной пластиной - Google Patents

Комплексный модуль теплопоглотителя с соединительной пластиной Download PDF

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Publication number
RU162623U1
RU162623U1 RU2015142986/07U RU2015142986U RU162623U1 RU 162623 U1 RU162623 U1 RU 162623U1 RU 2015142986/07 U RU2015142986/07 U RU 2015142986/07U RU 2015142986 U RU2015142986 U RU 2015142986U RU 162623 U1 RU162623 U1 RU 162623U1
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RU
Russia
Prior art keywords
heat sink
connecting plate
plastic
module
polyamide
Prior art date
Application number
RU2015142986/07U
Other languages
English (en)
Russian (ru)
Inventor
Чэнь ЛЮ
Original Assignee
ДСМ АйПи АССЕТС Б.В.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ДСМ АйПи АССЕТС Б.В. filed Critical ДСМ АйПи АССЕТС Б.В.
Application granted granted Critical
Publication of RU162623U1 publication Critical patent/RU162623U1/ru

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H63/00—Details of electrically-operated selector switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/52—Cooling of switch parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
RU2015142986/07U 2014-10-09 2015-10-08 Комплексный модуль теплопоглотителя с соединительной пластиной RU162623U1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201420581100.3 2014-10-09
CN201420581100.3U CN204466125U (zh) 2014-10-09 2014-10-09 一种集成散热器连接排模块

Publications (1)

Publication Number Publication Date
RU162623U1 true RU162623U1 (ru) 2016-06-20

Family

ID=53672940

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2015142986/07U RU162623U1 (ru) 2014-10-09 2015-10-08 Комплексный модуль теплопоглотителя с соединительной пластиной

Country Status (7)

Country Link
JP (1) JP3203138U (ja)
KR (1) KR20160001282U (ja)
CN (1) CN204466125U (ja)
DE (1) DE202015105289U1 (ja)
FR (1) FR3027186B3 (ja)
IT (1) ITUB201579471U1 (ja)
RU (1) RU162623U1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205030031U (zh) * 2015-10-12 2016-02-10 中磊电子（苏州）有限公司 导热塑料散热器与通信装置
CN106816345A (zh) * 2015-11-27 2017-06-09 帝斯曼知识产权资产管理有限公司 塑壳断路器底座
CN111816630B (zh) * 2020-06-30 2022-07-05 科华恒盛股份有限公司 一种散热结构及功率模块
DE102021124036A1 (de) 2021-09-16 2023-03-16 Song Chuan Precision Co., Ltd. Elektromagnetisches Relais
CN114131023A (zh) * 2021-11-03 2022-03-04 西安交通大学 大容量断路器散热结构的制造方法
US20230328931A1 (en) * 2022-04-08 2023-10-12 Hamilton Sundstrand Corporation Clip-on dielectric thermal dissipation fins

Also Published As

Publication number Publication date
FR3027186B3 (fr) 2016-12-16
ITUB201579471U1 (it) 2017-04-07
FR3027186A3 (fr) 2016-04-15
DE202015105289U1 (de) 2016-01-18
JP3203138U (ja) 2016-03-17
CN204466125U (zh) 2015-07-08
KR20160001282U (ko) 2016-04-19

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Legal Events

Date Code Title Description
MM9K Utility model has become invalid (non-payment of fees)

Effective date: 20181009