FR3026667B1 - Dispositif de decoupe par laser apte a etre utilise dans un milieu contamine - Google Patents

Dispositif de decoupe par laser apte a etre utilise dans un milieu contamine

Info

Publication number
FR3026667B1
FR3026667B1 FR1459511A FR1459511A FR3026667B1 FR 3026667 B1 FR3026667 B1 FR 3026667B1 FR 1459511 A FR1459511 A FR 1459511A FR 1459511 A FR1459511 A FR 1459511A FR 3026667 B1 FR3026667 B1 FR 3026667B1
Authority
FR
France
Prior art keywords
cutting device
laser cutting
contaminated environment
contaminated
environment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1459511A
Other languages
English (en)
Other versions
FR3026667A1 (fr
Inventor
Marc Lacroix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orano Demantelement SAS
Original Assignee
Areva NC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Areva NC SA filed Critical Areva NC SA
Priority to FR1459511A priority Critical patent/FR3026667B1/fr
Priority to JP2017517734A priority patent/JP6701186B2/ja
Priority to PCT/EP2015/072749 priority patent/WO2016050940A1/fr
Priority to GB1705196.2A priority patent/GB2558681B/en
Publication of FR3026667A1 publication Critical patent/FR3026667A1/fr
Application granted granted Critical
Publication of FR3026667B1 publication Critical patent/FR3026667B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/10Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B23K26/103Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam the laser beam rotating around the fixed workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • B23K26/1464Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476Features inside the nozzle for feeding the fluid stream through the nozzle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • B23K26/1482Detachable nozzles, e.g. exchangeable or provided with breakaway lines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0006Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4296Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
FR1459511A 2014-10-03 2014-10-03 Dispositif de decoupe par laser apte a etre utilise dans un milieu contamine Active FR3026667B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1459511A FR3026667B1 (fr) 2014-10-03 2014-10-03 Dispositif de decoupe par laser apte a etre utilise dans un milieu contamine
JP2017517734A JP6701186B2 (ja) 2014-10-03 2015-10-01 光学ユニットを取外し可能に収容するための取外し可能シースを備える汚染環境内での使用に適したレーザ光線放射デバイス
PCT/EP2015/072749 WO2016050940A1 (fr) 2014-10-03 2015-10-01 Dispositif d'emission d'un faisceau laser apte a etre utilise dans un milieu contamine comprenant un fourreau pour loger de manière amovible un bloc optique
GB1705196.2A GB2558681B (en) 2014-10-03 2015-10-01 Laser-beam emission device suitable for use in a contaminated environment, including a removable sheath for removably housing an optical unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1459511A FR3026667B1 (fr) 2014-10-03 2014-10-03 Dispositif de decoupe par laser apte a etre utilise dans un milieu contamine

Publications (2)

Publication Number Publication Date
FR3026667A1 FR3026667A1 (fr) 2016-04-08
FR3026667B1 true FR3026667B1 (fr) 2016-12-09

Family

ID=52824296

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1459511A Active FR3026667B1 (fr) 2014-10-03 2014-10-03 Dispositif de decoupe par laser apte a etre utilise dans un milieu contamine

Country Status (4)

Country Link
JP (1) JP6701186B2 (fr)
FR (1) FR3026667B1 (fr)
GB (1) GB2558681B (fr)
WO (1) WO2016050940A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201700111136A1 (it) * 2017-10-04 2019-04-04 Fca Italy Spa Dispositivo e attrezzatura per il controllo di componenti di autoveicolo, particolarmente componenti di lamiera includenti uno o piu' fori
CN108011283B (zh) * 2017-11-28 2024-01-23 成都微深科技有限公司 一种便于拆装的防尘镜片组件
CN110560928A (zh) * 2019-09-02 2019-12-13 广州东振激光科技有限公司 一种加工连杆裂解槽的激光切割装置
CN110560927A (zh) * 2019-09-02 2019-12-13 广州东振激光科技有限公司 一种激光切割头
GB201913628D0 (en) * 2019-09-20 2019-11-06 Alltec Angewandte Laserlicht Tech Gmbh Housing for a head for directing an electromagnetic radiation beam at a target
CN112846493A (zh) * 2021-01-04 2021-05-28 武汉讯马激光设备有限公司 一种激光切割机喷嘴及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193783A (ja) * 1983-04-18 1984-11-02 Mitsubishi Electric Corp パイプ切断装置
FR2644901B1 (fr) * 1989-03-24 1993-02-19 Commissariat Energie Atomique Dispositif susceptible de miniaturisation, pour la focalisation d'un faisceau laser issu d'une fibre optique
JPH07100673A (ja) * 1993-10-01 1995-04-18 Ishikawajima Harima Heavy Ind Co Ltd 水中レーザー照射装置
US5496309A (en) * 1994-05-06 1996-03-05 Trimedyne, Inc. Catheter device utilizing a laser beam laterally directed by a high index prism in a liquid medium
NZ272635A (en) * 1994-08-02 1998-02-26 Mcneil Ppc Inc Laser cutting/drilling processing head that creates a vortex gas flow within the head to clean and prevent back spatting of particles onto the lens therein
JP3453280B2 (ja) * 1997-05-21 2003-10-06 三菱重工業株式会社 レ−ザ加工ヘッド
US6407360B1 (en) * 1998-08-26 2002-06-18 Samsung Electronics, Co., Ltd. Laser cutting apparatus and method
JP2005292396A (ja) * 2004-03-31 2005-10-20 Sekinosu Kk 投射レンズユニット
DE202005011772U1 (de) * 2005-04-07 2005-11-17 Gehring Gmbh & Co. Kg Laser-Honwerkzeug zum Erzeugen einer durch Mikrotaschen gebildeten Struktur auf einer tribologisch beanspruchten Fläche eines Werkstücks

Also Published As

Publication number Publication date
GB2558681B (en) 2020-12-02
JP2018501108A (ja) 2018-01-18
FR3026667A1 (fr) 2016-04-08
GB201705196D0 (en) 2017-05-17
GB2558681A (en) 2018-07-18
JP6701186B2 (ja) 2020-05-27
WO2016050940A1 (fr) 2016-04-07

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