FR3026667B1 - Dispositif de decoupe par laser apte a etre utilise dans un milieu contamine - Google Patents
Dispositif de decoupe par laser apte a etre utilise dans un milieu contamineInfo
- Publication number
- FR3026667B1 FR3026667B1 FR1459511A FR1459511A FR3026667B1 FR 3026667 B1 FR3026667 B1 FR 3026667B1 FR 1459511 A FR1459511 A FR 1459511A FR 1459511 A FR1459511 A FR 1459511A FR 3026667 B1 FR3026667 B1 FR 3026667B1
- Authority
- FR
- France
- Prior art keywords
- cutting device
- laser cutting
- contaminated environment
- contaminated
- environment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
- B23K26/103—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam the laser beam rotating around the fixed workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1482—Detachable nozzles, e.g. exchangeable or provided with breakaway lines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1459511A FR3026667B1 (fr) | 2014-10-03 | 2014-10-03 | Dispositif de decoupe par laser apte a etre utilise dans un milieu contamine |
JP2017517734A JP6701186B2 (ja) | 2014-10-03 | 2015-10-01 | 光学ユニットを取外し可能に収容するための取外し可能シースを備える汚染環境内での使用に適したレーザ光線放射デバイス |
PCT/EP2015/072749 WO2016050940A1 (fr) | 2014-10-03 | 2015-10-01 | Dispositif d'emission d'un faisceau laser apte a etre utilise dans un milieu contamine comprenant un fourreau pour loger de manière amovible un bloc optique |
GB1705196.2A GB2558681B (en) | 2014-10-03 | 2015-10-01 | Laser-beam emission device suitable for use in a contaminated environment, including a removable sheath for removably housing an optical unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1459511A FR3026667B1 (fr) | 2014-10-03 | 2014-10-03 | Dispositif de decoupe par laser apte a etre utilise dans un milieu contamine |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3026667A1 FR3026667A1 (fr) | 2016-04-08 |
FR3026667B1 true FR3026667B1 (fr) | 2016-12-09 |
Family
ID=52824296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1459511A Active FR3026667B1 (fr) | 2014-10-03 | 2014-10-03 | Dispositif de decoupe par laser apte a etre utilise dans un milieu contamine |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6701186B2 (fr) |
FR (1) | FR3026667B1 (fr) |
GB (1) | GB2558681B (fr) |
WO (1) | WO2016050940A1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT201700111136A1 (it) * | 2017-10-04 | 2019-04-04 | Fca Italy Spa | Dispositivo e attrezzatura per il controllo di componenti di autoveicolo, particolarmente componenti di lamiera includenti uno o piu' fori |
CN108011283B (zh) * | 2017-11-28 | 2024-01-23 | 成都微深科技有限公司 | 一种便于拆装的防尘镜片组件 |
CN110560928A (zh) * | 2019-09-02 | 2019-12-13 | 广州东振激光科技有限公司 | 一种加工连杆裂解槽的激光切割装置 |
CN110560927A (zh) * | 2019-09-02 | 2019-12-13 | 广州东振激光科技有限公司 | 一种激光切割头 |
GB201913628D0 (en) * | 2019-09-20 | 2019-11-06 | Alltec Angewandte Laserlicht Tech Gmbh | Housing for a head for directing an electromagnetic radiation beam at a target |
CN112846493A (zh) * | 2021-01-04 | 2021-05-28 | 武汉讯马激光设备有限公司 | 一种激光切割机喷嘴及其制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59193783A (ja) * | 1983-04-18 | 1984-11-02 | Mitsubishi Electric Corp | パイプ切断装置 |
FR2644901B1 (fr) * | 1989-03-24 | 1993-02-19 | Commissariat Energie Atomique | Dispositif susceptible de miniaturisation, pour la focalisation d'un faisceau laser issu d'une fibre optique |
JPH07100673A (ja) * | 1993-10-01 | 1995-04-18 | Ishikawajima Harima Heavy Ind Co Ltd | 水中レーザー照射装置 |
US5496309A (en) * | 1994-05-06 | 1996-03-05 | Trimedyne, Inc. | Catheter device utilizing a laser beam laterally directed by a high index prism in a liquid medium |
NZ272635A (en) * | 1994-08-02 | 1998-02-26 | Mcneil Ppc Inc | Laser cutting/drilling processing head that creates a vortex gas flow within the head to clean and prevent back spatting of particles onto the lens therein |
JP3453280B2 (ja) * | 1997-05-21 | 2003-10-06 | 三菱重工業株式会社 | レ−ザ加工ヘッド |
US6407360B1 (en) * | 1998-08-26 | 2002-06-18 | Samsung Electronics, Co., Ltd. | Laser cutting apparatus and method |
JP2005292396A (ja) * | 2004-03-31 | 2005-10-20 | Sekinosu Kk | 投射レンズユニット |
DE202005011772U1 (de) * | 2005-04-07 | 2005-11-17 | Gehring Gmbh & Co. Kg | Laser-Honwerkzeug zum Erzeugen einer durch Mikrotaschen gebildeten Struktur auf einer tribologisch beanspruchten Fläche eines Werkstücks |
-
2014
- 2014-10-03 FR FR1459511A patent/FR3026667B1/fr active Active
-
2015
- 2015-10-01 GB GB1705196.2A patent/GB2558681B/en active Active
- 2015-10-01 JP JP2017517734A patent/JP6701186B2/ja active Active
- 2015-10-01 WO PCT/EP2015/072749 patent/WO2016050940A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
GB2558681B (en) | 2020-12-02 |
JP2018501108A (ja) | 2018-01-18 |
FR3026667A1 (fr) | 2016-04-08 |
GB201705196D0 (en) | 2017-05-17 |
GB2558681A (en) | 2018-07-18 |
JP6701186B2 (ja) | 2020-05-27 |
WO2016050940A1 (fr) | 2016-04-07 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 2 |
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PLSC | Publication of the preliminary search report |
Effective date: 20160408 |
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PLFP | Fee payment |
Year of fee payment: 3 |
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PLFP | Fee payment |
Year of fee payment: 4 |
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Year of fee payment: 5 |
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PLFP | Fee payment |
Year of fee payment: 6 |
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PLFP | Fee payment |
Year of fee payment: 7 |
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PLFP | Fee payment |
Year of fee payment: 8 |
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CA | Change of address |
Effective date: 20211207 |
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CD | Change of name or company name |
Owner name: ORANO DEMANTELEMENT, FR Effective date: 20211207 |
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PLFP | Fee payment |
Year of fee payment: 9 |
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PLFP | Fee payment |
Year of fee payment: 10 |