FR3020297B1 - Feutre de polissage mecano-chimique avec fenetre de detection de point limite - Google Patents

Feutre de polissage mecano-chimique avec fenetre de detection de point limite Download PDF

Info

Publication number
FR3020297B1
FR3020297B1 FR1553824A FR1553824A FR3020297B1 FR 3020297 B1 FR3020297 B1 FR 3020297B1 FR 1553824 A FR1553824 A FR 1553824A FR 1553824 A FR1553824 A FR 1553824A FR 3020297 B1 FR3020297 B1 FR 3020297B1
Authority
FR
France
Prior art keywords
limited
detection window
chemical polishing
mechanical chemical
polishing felt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1553824A
Other languages
English (en)
Other versions
FR3020297A1 (fr
Inventor
Bainian Qian
Marty DeGroot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Dow Global Technologies LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR3020297A1 publication Critical patent/FR3020297A1/fr
Application granted granted Critical
Publication of FR3020297B1 publication Critical patent/FR3020297B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/12—Optical coatings produced by application to, or surface treatment of, optical elements by surface treatment, e.g. by irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polyurethanes Or Polyureas (AREA)
FR1553824A 2014-04-29 2015-04-28 Feutre de polissage mecano-chimique avec fenetre de detection de point limite Expired - Fee Related FR3020297B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/264,440 US9314897B2 (en) 2014-04-29 2014-04-29 Chemical mechanical polishing pad with endpoint detection window
US14264440 2014-04-29

Publications (2)

Publication Number Publication Date
FR3020297A1 FR3020297A1 (fr) 2015-10-30
FR3020297B1 true FR3020297B1 (fr) 2018-11-23

Family

ID=54261834

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1553824A Expired - Fee Related FR3020297B1 (fr) 2014-04-29 2015-04-28 Feutre de polissage mecano-chimique avec fenetre de detection de point limite

Country Status (7)

Country Link
US (1) US9314897B2 (fr)
JP (1) JP6502159B2 (fr)
KR (1) KR102409773B1 (fr)
CN (1) CN105014527A (fr)
DE (1) DE102015004928A1 (fr)
FR (1) FR3020297B1 (fr)
TW (1) TWI616277B (fr)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN108698206B (zh) 2016-01-19 2021-04-02 应用材料公司 多孔化学机械抛光垫
TWI593511B (zh) * 2016-06-08 2017-08-01 智勝科技股份有限公司 研磨墊及研磨方法
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US20180345449A1 (en) * 2017-06-06 2018-12-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
KR101945878B1 (ko) 2017-07-11 2019-02-11 에스케이씨 주식회사 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (fr) 2017-08-07 2019-02-14 Applied Materials, Inc. Tampons à polir à distribution abrasive et leurs procédés de fabrication
US10465097B2 (en) * 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
US10464187B2 (en) * 2017-12-01 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
JP7299970B2 (ja) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド 改良型研磨パッドのための配合物
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
KR102421208B1 (ko) * 2020-09-10 2022-07-14 에스케이씨솔믹스 주식회사 연마 패드 및 이를 이용한 반도체 소자의 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5433651A (en) 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6106662A (en) 1998-06-08 2000-08-22 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6171181B1 (en) 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
JP2002001647A (ja) 2000-06-19 2002-01-08 Rodel Nitta Co 研磨パッド
JP2002198342A (ja) * 2000-12-27 2002-07-12 Tokyo Seimitsu Co Ltd ウェーハ研磨装置の研磨終点検出装置
JP2003048151A (ja) * 2001-08-08 2003-02-18 Rodel Nitta Co 研磨パッド
KR100434189B1 (ko) * 2002-03-21 2004-06-04 삼성전자주식회사 화학 기계적 연마장치 및 그 제어방법
JP3779636B2 (ja) * 2002-03-27 2006-05-31 株式会社東芝 光学測定による残膜の判定方法
DE60308946T2 (de) * 2002-06-03 2007-05-10 Jsr Corp. Polierkissen und Verfahren zur Herstellung eines Polierkissens
US7704125B2 (en) * 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
KR100541545B1 (ko) * 2003-06-16 2006-01-11 삼성전자주식회사 화학기계적 연마 장비의 연마 테이블
US7195539B2 (en) 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7258602B2 (en) 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
US6984163B2 (en) 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US7018581B2 (en) 2004-06-10 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad with reduced stress window
JP5110677B2 (ja) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
JP2007307639A (ja) 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
SG177961A1 (en) * 2007-01-15 2012-02-28 Toyo Tire & Rubber Co Polishing pad and method for producing the same
US8257544B2 (en) * 2009-06-10 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having a low defect integral window
US8697217B2 (en) * 2010-01-15 2014-04-15 Rohm and Haas Electronics Materials CMP Holdings, Inc. Creep-resistant polishing pad window
JP5620141B2 (ja) * 2010-04-15 2014-11-05 東洋ゴム工業株式会社 研磨パッド
JP5715770B2 (ja) * 2010-06-17 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法
CN102310366B (zh) * 2010-07-08 2014-03-05 罗门哈斯电子材料Cmp控股股份有限公司 具有低缺陷整体窗的化学机械抛光垫
JP5612945B2 (ja) * 2010-07-23 2014-10-22 株式会社荏原製作所 基板の研磨の進捗を監視する方法および研磨装置
US8257545B2 (en) * 2010-09-29 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
US8512427B2 (en) 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer
US9156125B2 (en) * 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US9186772B2 (en) * 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith
US20150065013A1 (en) * 2013-08-30 2015-03-05 Dow Global Technologies Llc Chemical mechanical polishing pad
US8980749B1 (en) * 2013-10-24 2015-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing silicon wafers

Also Published As

Publication number Publication date
US9314897B2 (en) 2016-04-19
TW201609310A (zh) 2016-03-16
KR20150124898A (ko) 2015-11-06
JP6502159B2 (ja) 2019-04-17
US20150306729A1 (en) 2015-10-29
DE102015004928A1 (de) 2015-10-29
CN105014527A (zh) 2015-11-04
KR102409773B1 (ko) 2022-06-16
FR3020297A1 (fr) 2015-10-30
JP2015211224A (ja) 2015-11-24
TWI616277B (zh) 2018-03-01

Similar Documents

Publication Publication Date Title
FR3020297B1 (fr) Feutre de polissage mecano-chimique avec fenetre de detection de point limite
IL287588A (en) Flux machine
DK3224606T3 (da) Sensorapparat
BR112015019226A2 (pt) máquina de lavar
GB201616446D0 (en) GC-TOF MS With improved detection limit
EP2994565A4 (fr) Lave-linge
FR3020296B1 (fr) Feutre de polissage mecano-chimique
BR112016029862A2 (pt) dispositivo aproximador de tecido
DK3161199T3 (da) Nonwoven-stoffer
EP3155186C0 (fr) Sous-couche de toiture
FR3019075B1 (fr) Feutre de polissage mecano-chimique avec fenetre de detection de point limite
BR112017007401A2 (pt) métodos de detecção específicos
CL2014002705S1 (es) Ensamble de lanceta
GB2556191B (en) Gesture detection
IL250053A0 (en) Movement detection device
DK3222767T3 (da) Vaskefremgangsmåde
UA33551S (uk) Губка господарська
UA34139S (uk) Губка побутова
UA34140S (uk) Губка побутова
UA33571S (uk) Губка господарська
TWM533658U (en) Washing machine with detection device
DE112015005705A5 (de) Haushaltslappen
ES1134383Y (es) Prendas de vestir
TH1601002981A (th) องค์ประกอบซักผ้า
TH1601002982A (th) องค์ประกอบซักผ้า

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLSC Publication of the preliminary search report

Effective date: 20180427

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8

PLFP Fee payment

Year of fee payment: 9

ST Notification of lapse

Effective date: 20241205