FR3018389B1 - Procede de fabrication de lamelles bistables de courbures differentes - Google Patents

Procede de fabrication de lamelles bistables de courbures differentes

Info

Publication number
FR3018389B1
FR3018389B1 FR1451833A FR1451833A FR3018389B1 FR 3018389 B1 FR3018389 B1 FR 3018389B1 FR 1451833 A FR1451833 A FR 1451833A FR 1451833 A FR1451833 A FR 1451833A FR 3018389 B1 FR3018389 B1 FR 3018389B1
Authority
FR
France
Prior art keywords
different curves
manufacturing
blades
bistable blades
manufacturing bistable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1451833A
Other languages
English (en)
Other versions
FR3018389A1 (fr
Inventor
Emilie Trioux
Pascal Ancey
Stephane Monfray
Thomas Skotnicki
Skandar Basrour
Paul Muralt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Crolles 2 SAS
STMicroelectronics France SAS
Original Assignee
STMicroelectronics SA
STMicroelectronics Crolles 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA, STMicroelectronics Crolles 2 SAS filed Critical STMicroelectronics SA
Priority to FR1451833A priority Critical patent/FR3018389B1/fr
Priority to US14/634,454 priority patent/US10312431B2/en
Publication of FR3018389A1 publication Critical patent/FR3018389A1/fr
Application granted granted Critical
Publication of FR3018389B1 publication Critical patent/FR3018389B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/06—Solid state diffusion of only metal elements or silicon into metallic material surfaces using gases
    • C23C10/08—Solid state diffusion of only metal elements or silicon into metallic material surfaces using gases only one element being diffused
    • C23C10/10—Chromising
    • C23C10/12—Chromising of ferrous surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134—Plasma spraying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Combustion & Propulsion (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Micromachines (AREA)
FR1451833A 2014-03-06 2014-03-06 Procede de fabrication de lamelles bistables de courbures differentes Active FR3018389B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1451833A FR3018389B1 (fr) 2014-03-06 2014-03-06 Procede de fabrication de lamelles bistables de courbures differentes
US14/634,454 US10312431B2 (en) 2014-03-06 2015-02-27 Method of manufacturing bistable strips having different curvatures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1451833A FR3018389B1 (fr) 2014-03-06 2014-03-06 Procede de fabrication de lamelles bistables de courbures differentes

Publications (2)

Publication Number Publication Date
FR3018389A1 FR3018389A1 (fr) 2015-09-11
FR3018389B1 true FR3018389B1 (fr) 2017-09-01

Family

ID=51210513

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1451833A Active FR3018389B1 (fr) 2014-03-06 2014-03-06 Procede de fabrication de lamelles bistables de courbures differentes

Country Status (2)

Country Link
US (1) US10312431B2 (fr)
FR (1) FR3018389B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108897965B (zh) * 2018-07-10 2022-05-03 浙江工业大学 一种多稳态复合材料壳的设计方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR911E (fr) * 1902-01-27 1903-04-23 Chaudieres Lagosse Des Appareil servant à fixer les tubes dans les plaques tubulaires
US2988911A (en) * 1957-08-02 1961-06-20 Helen M Carter Automatic door lock mechanism for safes, strongboxes and other receptacles
US4083220A (en) * 1975-04-21 1978-04-11 Hitachi, Ltd. Sub-zero temperature plastic working process for metal
JP2819141B2 (ja) * 1989-02-13 1998-10-30 株式会社エー・アンド・デイ 定速排気装置および定速排気装置の制御方法
US5471721A (en) * 1993-02-23 1995-12-05 Research Corporation Technologies, Inc. Method for making monolithic prestressed ceramic devices
FR2753565B1 (fr) * 1996-09-13 1998-11-27 Thomson Csf Dispositif de commutation electrique et dispositif d'affichage utilisant ce dispositif de commutation
JP2963993B1 (ja) * 1998-07-24 1999-10-18 工業技術院長 超微粒子成膜法
JP2001026110A (ja) * 1999-07-07 2001-01-30 Samsung Electro Mech Co Ltd セラミック粉末とポリビニリデンフルオライドとの混合体を利用した圧電／電歪マイクロアクチュエータ及びその製造方法
JP2002004043A (ja) * 2000-06-19 2002-01-09 Matsushita Electric Ind Co Ltd 曲面を有する構造体及びその製造方法
US6674291B1 (en) * 2000-10-30 2004-01-06 Agere Systems Guardian Corp. Method and apparatus for determining and/or improving high power reliability in thin film resonator devices, and a thin film resonator device resultant therefrom
US6866730B2 (en) * 2003-03-21 2005-03-15 General Motors Corporation Metallic-based adhesion materials
US7212082B2 (en) * 2003-12-19 2007-05-01 Ube Industries, Ltd. Method of manufacturing piezoelectric thin film device and piezoelectric thin film device
US20060099440A1 (en) * 2004-11-09 2006-05-11 Purusottam Sahoo High energy plasma arc process
WO2008084578A1 (fr) * 2006-12-25 2008-07-17 Murata Manufacturing Co., Ltd. Résonateur en film mince piézoélectrique
JP5471612B2 (ja) * 2009-06-22 2014-04-16 日立金属株式会社 圧電性薄膜素子の製造方法及び圧電薄膜デバイスの製造方法
JP5599203B2 (ja) * 2010-03-02 2014-10-01 キヤノン株式会社 圧電薄膜、圧電素子、圧電素子の製造方法、液体吐出ヘッドおよび超音波モータ
KR101664853B1 (ko) * 2010-04-15 2016-10-12 코웨이 주식회사 래치 밸브 및 이를 이용한 유량 조절 장치
US20130241939A1 (en) * 2012-03-16 2013-09-19 Qualcomm Mems Technologies, Inc. High capacitance density metal-insulator-metal capacitors
FR2988911A1 (fr) 2012-04-02 2013-10-04 St Microelectronics Crolles 2 Plaque incurvee et son procede de fabrication
FR2988912A1 (fr) * 2012-04-02 2013-10-04 St Microelectronics Crolles 2 Dispositif de recuperation d'energie

Also Published As

Publication number Publication date
FR3018389A1 (fr) 2015-09-11
US10312431B2 (en) 2019-06-04
US20150255705A1 (en) 2015-09-10

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