FR3010925B1 - Procede de traitement d'une piece - Google Patents
Procede de traitement d'une pieceInfo
- Publication number
- FR3010925B1 FR3010925B1 FR1459022A FR1459022A FR3010925B1 FR 3010925 B1 FR3010925 B1 FR 3010925B1 FR 1459022 A FR1459022 A FR 1459022A FR 1459022 A FR1459022 A FR 1459022A FR 3010925 B1 FR3010925 B1 FR 3010925B1
- Authority
- FR
- France
- Prior art keywords
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- High Energy & Nuclear Physics (AREA)
- General Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Dicing (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013199914A JP2015069975A (ja) | 2013-09-26 | 2013-09-26 | 被加工物の加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3010925A1 FR3010925A1 (fr) | 2015-03-27 |
FR3010925B1 true FR3010925B1 (fr) | 2018-09-07 |
Family
ID=52623827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1459022A Active FR3010925B1 (fr) | 2013-09-26 | 2014-09-24 | Procede de traitement d'une piece |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2015069975A (fr) |
DE (1) | DE102014218759A1 (fr) |
FR (1) | FR3010925B1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6572032B2 (ja) * | 2015-07-09 | 2019-09-04 | 株式会社ディスコ | ウェーハの加工方法 |
CN106312337B (zh) * | 2016-09-19 | 2018-10-02 | 武汉帝尔激光科技股份有限公司 | 一种晶硅太阳能电池片激光切半机 |
JP6925718B2 (ja) * | 2017-06-05 | 2021-08-25 | 株式会社ディスコ | チップの製造方法 |
JP6925717B2 (ja) * | 2017-06-05 | 2021-08-25 | 株式会社ディスコ | チップの製造方法 |
JP6925719B2 (ja) * | 2017-06-05 | 2021-08-25 | 株式会社ディスコ | チップの製造方法 |
JP7031968B2 (ja) * | 2017-08-22 | 2022-03-08 | 株式会社ディスコ | チップの製造方法 |
JP7031967B2 (ja) * | 2017-08-22 | 2022-03-08 | 株式会社ディスコ | チップの製造方法 |
DE102018003675A1 (de) | 2018-05-04 | 2019-11-07 | Siltectra Gmbh | Verfahren zum Abtrennen von Festkörperschichten von Kompositstrukturen aus SiC und einer metallischen Beschichtung oder elektrischen Bauteilen |
JP7370881B2 (ja) * | 2020-01-24 | 2023-10-30 | 株式会社ディスコ | ウエーハ加工方法、及びウエーハ加工装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003088975A (ja) * | 2001-09-12 | 2003-03-25 | Hamamatsu Photonics Kk | レーザ加工方法 |
JP2005142303A (ja) * | 2003-11-05 | 2005-06-02 | Disco Abrasive Syst Ltd | シリコンウエーハの分割方法および分割装置 |
JP4733934B2 (ja) * | 2004-06-22 | 2011-07-27 | 株式会社ディスコ | ウエーハの加工方法 |
JP2006229021A (ja) | 2005-02-18 | 2006-08-31 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP2011156582A (ja) * | 2010-02-03 | 2011-08-18 | Disco Abrasive Syst Ltd | Co2レーザによる分割方法 |
JP2011165766A (ja) * | 2010-02-05 | 2011-08-25 | Disco Abrasive Syst Ltd | 光デバイスウエーハの加工方法 |
JP2011183434A (ja) * | 2010-03-09 | 2011-09-22 | Mitsuboshi Diamond Industrial Co Ltd | レーザ加工方法 |
US10239160B2 (en) * | 2011-09-21 | 2019-03-26 | Coherent, Inc. | Systems and processes that singulate materials |
-
2013
- 2013-09-26 JP JP2013199914A patent/JP2015069975A/ja active Pending
-
2014
- 2014-09-18 DE DE201410218759 patent/DE102014218759A1/de active Pending
- 2014-09-24 FR FR1459022A patent/FR3010925B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015069975A (ja) | 2015-04-13 |
FR3010925A1 (fr) | 2015-03-27 |
DE102014218759A1 (de) | 2015-03-26 |
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Legal Events
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PLFP | Fee payment |
Year of fee payment: 3 |
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Year of fee payment: 4 |
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PLSC | Publication of the preliminary search report |
Effective date: 20170804 |
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