FR3006850B1 - Appareil de controle electronique pour vehicule utilisant une structure en pente et methode associee - Google Patents

Appareil de controle electronique pour vehicule utilisant une structure en pente et methode associee Download PDF

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Publication number
FR3006850B1
FR3006850B1 FR1363522A FR1363522A FR3006850B1 FR 3006850 B1 FR3006850 B1 FR 3006850B1 FR 1363522 A FR1363522 A FR 1363522A FR 1363522 A FR1363522 A FR 1363522A FR 3006850 B1 FR3006850 B1 FR 3006850B1
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FR
France
Prior art keywords
vehicle
control device
electronic control
associated method
slope structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1363522A
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English (en)
Other versions
FR3006850A1 (fr
Inventor
Man Ho Seok
Wan Kyu Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hyundai Kefico Corp
Original Assignee
Hyundai Autron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Autron Co Ltd filed Critical Hyundai Autron Co Ltd
Publication of FR3006850A1 publication Critical patent/FR3006850A1/fr
Application granted granted Critical
Publication of FR3006850B1 publication Critical patent/FR3006850B1/fr
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0039—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a tubular housing wherein the PCB is inserted longitudinally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
FR1363522A 2013-06-11 2013-12-24 Appareil de controle electronique pour vehicule utilisant une structure en pente et methode associee Active FR3006850B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130066458A KR101460898B1 (ko) 2013-06-11 2013-06-11 경사 구조물을 이용한 차량의 전자 제어 장치 및 그 제조 방법

Publications (2)

Publication Number Publication Date
FR3006850A1 FR3006850A1 (fr) 2014-12-12
FR3006850B1 true FR3006850B1 (fr) 2022-11-04

Family

ID=51167936

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1363522A Active FR3006850B1 (fr) 2013-06-11 2013-12-24 Appareil de controle electronique pour vehicule utilisant une structure en pente et methode associee

Country Status (5)

Country Link
US (1) US9313936B2 (fr)
KR (1) KR101460898B1 (fr)
CN (1) CN104244635B (fr)
DE (1) DE102013227038A1 (fr)
FR (1) FR3006850B1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101418683B1 (ko) * 2013-06-11 2014-07-14 현대오트론 주식회사 방수형 하우징 실링을 이용한 차량의 전자 제어 장치 및 그 제조 방법
JP6401534B2 (ja) * 2014-07-29 2018-10-10 株式会社デンソーテン 制御装置
JP6366413B2 (ja) * 2014-08-06 2018-08-01 アルパイン株式会社 電子回路ユニット
KR101575265B1 (ko) * 2014-09-30 2015-12-07 현대오트론 주식회사 고정 부재를 이용한 차량의 전자 제어 장치 및 그 제조 방법
KR101575268B1 (ko) * 2014-09-30 2015-12-07 현대오트론 주식회사 고정 부재를 이용한 차량의 전자 제어 장치 및 그 제조 방법
DE102015216732B4 (de) 2015-09-02 2020-08-06 Vitesco Technologies GmbH Gehäuse mit einer darin angeordneten Leiterplatte
JP6543292B2 (ja) * 2017-03-09 2019-07-10 矢崎総業株式会社 電気接続箱及びワイヤハーネス
CN108198916A (zh) * 2018-03-12 2018-06-22 黄琴 一种led光源点胶装置
EP3693228A1 (fr) * 2019-02-11 2020-08-12 voestalpine Automotive Components Dettingen GmbH & Co. KG Boîtier, en particulier pour composants haut voltage

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3019645A1 (de) * 1980-05-22 1981-12-03 Siemens AG, 1000 Berlin und 8000 München Isolierter einschub mit hoher spannungsfestigkeit
DE3019646A1 (de) * 1980-05-22 1981-11-26 SIEMENS AG AAAAA, 1000 Berlin und 8000 München Galvanisch trennende koppelstelle fuer energie- und/oder signaluebertragung
DE3019668A1 (de) * 1980-05-22 1981-11-26 SIEMENS AG AAAAA, 1000 Berlin und 8000 München Geraet zum erfassen und verarbeiten von elektrischen signalen
JP2794965B2 (ja) * 1991-02-28 1998-09-10 三菱電機株式会社 制御装置のベースユニット
JP2980591B1 (ja) * 1998-07-27 1999-11-22 三菱電機株式会社 基板取付装置
US6361350B2 (en) * 1998-11-12 2002-03-26 Eastman Kodak Company Card connector having a guide portion
JP2002134939A (ja) * 2000-10-30 2002-05-10 Denso Corp 車載用電子制御装置
US6882533B2 (en) * 2001-02-22 2005-04-19 Hewlett-Packard Development Company, L.P. Thermal connector for cooling electronics
US6519155B1 (en) * 2001-09-24 2003-02-11 Hon Hai Precision Ind. Co., Ltd. Retainer device for heat sink assembly
JP3773896B2 (ja) * 2002-02-15 2006-05-10 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
US20060232940A1 (en) * 2002-10-14 2006-10-19 Siemens Aktiengesellschaft Method for mounting a switching module, switching module and pressure pad
JP3920256B2 (ja) * 2003-10-02 2007-05-30 日本航空電子工業株式会社 カード用コネクタ
US6940727B2 (en) * 2003-10-08 2005-09-06 Hewlett-Packard Development Company, L.P. Card guide that comprises card guide portions that serve to guide a circuit board into a chassis
DE102004002562A1 (de) * 2004-01-17 2005-08-04 Conti Temic Microelectronic Gmbh Strahlungsschützendes Bechergehäuse für eine elektrische Baugruppe mit einem Schaltungsträger
US7133285B2 (en) * 2004-01-23 2006-11-07 Yamaichi Electronics U.S.A., Inc. Electronics connector with heat sink
US7145773B2 (en) * 2004-02-26 2006-12-05 Nortel Networks Limited Pluggable electronic module
JP2006013059A (ja) * 2004-06-24 2006-01-12 Keihin Corp 電子回路基板の収容ケース
US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
JP2007035741A (ja) * 2005-07-25 2007-02-08 Sumitomo Wiring Syst Ltd 回路基板の収納構造
KR101252846B1 (ko) * 2006-04-28 2013-04-09 엘지디스플레이 주식회사 백라이트 어셈블리 및 이를 구비한 액정표시장치
US7667972B2 (en) * 2007-05-11 2010-02-23 Chant Sincere Co., Ltd. Connector with a heat sink
DE102008051547A1 (de) * 2008-10-14 2010-04-15 Continental Automotive Gmbh Elektronisches Gerät mit Bechergehäuse und Verfahren zur Herstellung desselben
CN102005234A (zh) * 2009-08-28 2011-04-06 鸿富锦精密工业（深圳）有限公司 硬盘固定装置
DE102009054767A1 (de) * 2009-12-16 2011-06-22 Robert Bosch GmbH, 70469 Abschlusselement für ein Gehäuse
CN202172534U (zh) * 2011-06-28 2012-03-21 联合汽车电子有限公司 电子控制器壳体
JP5556795B2 (ja) * 2011-11-23 2014-07-23 株式会社デンソー 筐体
JP2014093414A (ja) * 2012-11-02 2014-05-19 Hitachi Automotive Systems Ltd 電子制御装置
KR101460896B1 (ko) * 2013-06-07 2014-11-12 현대오트론 주식회사 차량의 전자제어장치

Also Published As

Publication number Publication date
DE102013227038A1 (de) 2014-12-11
FR3006850A1 (fr) 2014-12-12
US20140362534A1 (en) 2014-12-11
KR101460898B1 (ko) 2014-11-14
CN104244635A (zh) 2014-12-24
CN104244635B (zh) 2017-07-04
US9313936B2 (en) 2016-04-12

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