FR2993052B1 - Capteur de gaz et son procede de fabrication - Google Patents

Capteur de gaz et son procede de fabrication Download PDF

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Publication number
FR2993052B1
FR2993052B1 FR1356486A FR1356486A FR2993052B1 FR 2993052 B1 FR2993052 B1 FR 2993052B1 FR 1356486 A FR1356486 A FR 1356486A FR 1356486 A FR1356486 A FR 1356486A FR 2993052 B1 FR2993052 B1 FR 2993052B1
Authority
FR
France
Prior art keywords
gas sensor
manufacturing same
manufacturing
same
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1356486A
Other languages
English (en)
Other versions
FR2993052A1 (fr
Inventor
Andreas Krauss
Walter Daves
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2993052A1 publication Critical patent/FR2993052A1/fr
Application granted granted Critical
Publication of FR2993052B1 publication Critical patent/FR2993052B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
    • H01L29/045Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403Cells and electrode assemblies
    • G01N27/414Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
    • G01N27/4141Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS specially adapted for gases
    • G01N27/4143Air gap between gate and channel, i.e. suspended gate [SG] FETs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1608Silicon carbide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
FR1356486A 2012-07-03 2013-07-03 Capteur de gaz et son procede de fabrication Expired - Fee Related FR2993052B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012211460.2 2012-07-03
DE102012211460.2A DE102012211460A1 (de) 2012-07-03 2012-07-03 Gassensor und Verfahren zum Herstellen eines solchen

Publications (2)

Publication Number Publication Date
FR2993052A1 FR2993052A1 (fr) 2014-01-10
FR2993052B1 true FR2993052B1 (fr) 2018-01-19

Family

ID=49770002

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1356486A Expired - Fee Related FR2993052B1 (fr) 2012-07-03 2013-07-03 Capteur de gaz et son procede de fabrication

Country Status (4)

Country Link
JP (1) JP6312119B2 (fr)
CN (1) CN103529108B (fr)
DE (1) DE102012211460A1 (fr)
FR (1) FR2993052B1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014215421A1 (de) 2014-08-05 2016-02-11 Robert Bosch Gmbh Mikromechanische Gassensorvorrichtung und entsprechendes Herstellungsverfahren
JP6792141B2 (ja) * 2016-06-23 2020-11-25 富士通株式会社 ガスセンサ及びその使用方法
DE102017200156A1 (de) * 2017-01-09 2018-07-12 Robert Bosch Gmbh Herstellungsverfahren für eine mikromechanische Sensorvorrichtung und entsprechende mikromechanische Sensorvorrichtung
CN109490391B (zh) * 2018-10-12 2020-08-25 华东师范大学 一种氧化锆复合氧化钨纳米管no2气体传感器的制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2687254B2 (ja) * 1990-11-08 1997-12-08 株式会社オーク製作所 ガス感応素子
US5768192A (en) * 1996-07-23 1998-06-16 Saifun Semiconductors, Ltd. Non-volatile semiconductor memory cell utilizing asymmetrical charge trapping
SE9901440A0 (en) * 1999-04-22 2000-10-23 Ind Mikroelektronik Centrum Ab A field effect transistor of SiC for high temperature application, use of such a transistor and a method for production thereof
FR2872914B1 (fr) * 2004-07-07 2006-10-13 Univ Rennes I Etablissement Pu Capteur pour la detection et/ou la mesure d'une concentration de charges electriques contenues dans une ambiance, utilisations et procede de fabrication correspondants
US7632760B2 (en) * 2005-04-07 2009-12-15 Semiconductor Components Industries, Llc Semiconductor device having field stabilization film and method
JP2007017312A (ja) * 2005-07-08 2007-01-25 Hitachi Ltd 半導体ガスセンサとその製造方法
DE102007003541A1 (de) * 2007-01-24 2008-07-31 Robert Bosch Gmbh Elektronisches Bauteil
JP5208537B2 (ja) * 2008-02-19 2013-06-12 株式会社東芝 不揮発性記憶素子
JP2011124240A (ja) * 2008-03-31 2011-06-23 Tokyo Electron Ltd Mos型半導体メモリ装置、その製造方法およびコンピュータ読み取り可能な記憶媒体
JP5168725B2 (ja) * 2008-07-08 2013-03-27 住友電気工業株式会社 ガスセンサ
DE102008054752A1 (de) * 2008-12-16 2010-06-17 Robert Bosch Gmbh Gassensor mit Feldeffekttransistor
EP2417441B1 (fr) * 2009-04-06 2018-05-30 Sensic Ab Détecteur de gaz
DE102009045475B4 (de) * 2009-10-08 2023-06-29 Robert Bosch Gmbh Gassensitive Halbleitervorrichtung sowie deren Verwendung
US9018684B2 (en) * 2009-11-23 2015-04-28 California Institute Of Technology Chemical sensing and/or measuring devices and methods
DE102010031167A1 (de) * 2010-07-09 2012-01-12 Robert Bosch Gmbh Herstellungsverfahren für einen chemosensitiven Feldeffekttransistor
DE102010031153A1 (de) * 2010-07-09 2012-01-12 Robert Bosch Gmbh Feldeffekttransistoren für Gassensoren
DE102011002854A1 (de) * 2010-08-10 2012-02-16 Robert Bosch Gmbh Feldeffekt-Gassensor, Verfahren zur Herstellung eines Feldeffekt-Gassensors und Verfahren zur Detektion von Gas
JP5603193B2 (ja) * 2010-09-29 2014-10-08 株式会社日立製作所 ガスセンサ

Also Published As

Publication number Publication date
CN103529108A (zh) 2014-01-22
JP6312119B2 (ja) 2018-04-18
FR2993052A1 (fr) 2014-01-10
DE102012211460A1 (de) 2014-01-09
JP2014013239A (ja) 2014-01-23
CN103529108B (zh) 2018-04-24

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