FR2980379A1 - Structure transductrice pour sonde transductrice et procedes de fabrication de celle-ci - Google Patents

Structure transductrice pour sonde transductrice et procedes de fabrication de celle-ci Download PDF

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Publication number
FR2980379A1
FR2980379A1 FR1258773A FR1258773A FR2980379A1 FR 2980379 A1 FR2980379 A1 FR 2980379A1 FR 1258773 A FR1258773 A FR 1258773A FR 1258773 A FR1258773 A FR 1258773A FR 2980379 A1 FR2980379 A1 FR 2980379A1
Authority
FR
France
Prior art keywords
transducer
columns
piezoelectric
substrate
piezoelectric transducer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
FR1258773A
Other languages
English (en)
French (fr)
Inventor
Matthew Harvey Krohn
Prabhjot Singh
Paul Aloysius Meyer
Wei Luo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2980379A1 publication Critical patent/FR2980379A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • G01N29/2437Piezoelectric probes
    • G01N29/245Ceramic probes, e.g. lead zirconate titanate [PZT] probes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/09Forming piezoelectric or electrostrictive materials
    • H10N30/092Forming composite materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/852Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/42Piezoelectric device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49005Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
FR1258773A 2011-09-22 2012-09-19 Structure transductrice pour sonde transductrice et procedes de fabrication de celle-ci Ceased FR2980379A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/240,754 US8853918B2 (en) 2011-09-22 2011-09-22 Transducer structure for a transducer probe and methods of fabricating same

Publications (1)

Publication Number Publication Date
FR2980379A1 true FR2980379A1 (fr) 2013-03-29

Family

ID=47828053

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1258773A Ceased FR2980379A1 (fr) 2011-09-22 2012-09-19 Structure transductrice pour sonde transductrice et procedes de fabrication de celle-ci

Country Status (6)

Country Link
US (1) US8853918B2 (OSRAM)
JP (1) JP6208933B2 (OSRAM)
CN (1) CN103008218B (OSRAM)
CA (1) CA2790266C (OSRAM)
DE (1) DE102012108796B4 (OSRAM)
FR (1) FR2980379A1 (OSRAM)

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US9282945B2 (en) 2009-04-14 2016-03-15 Maui Imaging, Inc. Calibration of ultrasound probes
US9339256B2 (en) 2007-10-01 2016-05-17 Maui Imaging, Inc. Determining material stiffness using multiple aperture ultrasound
JP6092109B2 (ja) 2010-10-13 2017-03-08 マウイ イマギング,インコーポレーテッド 凹面超音波トランスデューサ及び3dアレイ
EP2785253B1 (en) 2011-12-01 2023-11-15 Maui Imaging, Inc. Motion detection using ping-based and multiple aperture doppler ultrasound
CN104080407B (zh) 2011-12-29 2017-03-01 毛伊图像公司 任意路径的m模式超声成像
IN2014DN07243A (OSRAM) 2012-03-26 2015-04-24 Maui Imaging Inc
KR102176193B1 (ko) 2012-08-10 2020-11-09 마우이 이미징, 인코포레이티드 다중 어퍼처 초음파 프로브들의 교정
CN104582582B (zh) 2012-08-21 2017-12-15 毛伊图像公司 超声成像系统存储器架构
US20140064513A1 (en) 2012-09-06 2014-03-06 MUSIC Group IP Ltd. System and method for remotely controlling audio equipment
WO2014160291A1 (en) 2013-03-13 2014-10-02 Maui Imaging, Inc. Alignment of ultrasound transducer arrays and multiple aperture probe assembly
DE102013213493A1 (de) * 2013-07-10 2015-01-15 Robert Bosch Gmbh Schallwandleranordnung
US9883848B2 (en) 2013-09-13 2018-02-06 Maui Imaging, Inc. Ultrasound imaging using apparent point-source transmit transducer
US10401493B2 (en) 2014-08-18 2019-09-03 Maui Imaging, Inc. Network-based ultrasound imaging system
CN105810258B (zh) * 2014-12-30 2018-11-02 中核武汉核电运行技术股份有限公司 一种用于压水堆燃料组件超声检查的探头及其制造工艺
JP6770973B2 (ja) 2015-03-30 2020-10-21 マウイ イマギング,インコーポレーテッド 物体の動きを検出するための超音波イメージングシステム及び方法
CN108778530B (zh) 2016-01-27 2021-07-27 毛伊图像公司 具有稀疏阵列探测器的超声成像
RU2649061C1 (ru) * 2016-12-22 2018-03-29 федеральное государственное бюджетное образовательное учреждение высшего образования "Национальный исследовательский университет "МЭИ" (ФГБОУ ВО "НИУ "МЭИ") Широкополосный ультразвуковой преобразователь
KR102394585B1 (ko) * 2017-12-19 2022-05-04 현대자동차 주식회사 음향센서 및 이의 제조방법
KR102721452B1 (ko) * 2019-03-29 2024-10-23 엘지디스플레이 주식회사 플렉서블 진동 모듈 및 이를 포함하는 표시 장치
US12409474B2 (en) * 2019-08-28 2025-09-09 S.C.R. (Engineers) Limited Devices for analysis of a fluid
US12414474B2 (en) * 2021-10-21 2025-09-09 Baker Hughes Oilfield Operations Llc Methods of forming piezoelectric materials, piezoelectric devices, and associated tooling and systems
CN116293473B (zh) * 2022-12-08 2025-08-01 海鹰企业集团有限责任公司 一种改进型管道声纳湿端处理装置

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US4518889A (en) * 1982-09-22 1985-05-21 North American Philips Corporation Piezoelectric apodized ultrasound transducers
US4658176A (en) * 1984-07-25 1987-04-14 Hitachi, Ltd. Ultrasonic transducer using piezoelectric composite
US4828961A (en) * 1986-07-02 1989-05-09 W. R. Grace & Co.-Conn. Imaging process for forming ceramic electronic circuits
DE59008863D1 (de) * 1990-06-21 1995-05-11 Siemens Ag Verbund-Ultraschallwandler und Verfahren zur Herstellung eines strukturierten Bauelementes aus piezoelektrischer Keramik.
US6117612A (en) 1995-04-24 2000-09-12 Regents Of The University Of Michigan Stereolithography resin for rapid prototyping of ceramics and metals
US5648942A (en) 1995-10-13 1997-07-15 Advanced Technology Laboratories, Inc. Acoustic backing with integral conductors for an ultrasonic transducer
JPH11112048A (ja) * 1997-10-02 1999-04-23 Seiko Epson Corp 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
JP4234846B2 (ja) * 1999-05-12 2009-03-04 上田日本無線株式会社 複合圧電体及び角柱状圧電セラミック焼結体
JP2001326999A (ja) * 2000-05-18 2001-11-22 Olympus Optical Co Ltd 圧電構造体の加工方法および複合圧電体の製造方法
WO2002027408A2 (en) * 2000-09-27 2002-04-04 The Regents Of The University Of California Dynamic mask projection stereo micro lithography
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US7449821B2 (en) 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
WO2006100807A1 (ja) * 2005-03-24 2006-09-28 Murata Manufacturing Co., Ltd 圧電素子、及び圧電素子の製造方法
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US7652410B2 (en) * 2006-08-01 2010-01-26 Insightec Ltd Ultrasound transducer with non-uniform elements
US20090199392A1 (en) * 2008-02-11 2009-08-13 General Electric Company Ultrasound transducer probes and system and method of manufacture
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US8212456B1 (en) * 2009-08-19 2012-07-03 Sandia Corporation Method of making and ceramic articles with multiple regions of distinct density

Also Published As

Publication number Publication date
JP6208933B2 (ja) 2017-10-04
CA2790266C (en) 2019-11-26
CA2790266A1 (en) 2013-03-22
CN103008218B (zh) 2016-06-29
JP2013068616A (ja) 2013-04-18
CN103008218A (zh) 2013-04-03
US8853918B2 (en) 2014-10-07
DE102012108796B4 (de) 2021-03-04
US20130076207A1 (en) 2013-03-28
DE102012108796A1 (de) 2013-03-28

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