CA2790266C - Transducer structure for a transducer probe and methods of fabricating same - Google Patents

Transducer structure for a transducer probe and methods of fabricating same Download PDF

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Publication number
CA2790266C
CA2790266C CA2790266A CA2790266A CA2790266C CA 2790266 C CA2790266 C CA 2790266C CA 2790266 A CA2790266 A CA 2790266A CA 2790266 A CA2790266 A CA 2790266A CA 2790266 C CA2790266 C CA 2790266C
Authority
CA
Canada
Prior art keywords
posts
piezoelectric transducer
transducer
substrate
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2790266A
Other languages
English (en)
French (fr)
Other versions
CA2790266A1 (en
Inventor
Matthew Harvey Krohn
Prabhjot Singh
Paul Aloysius Meyer
Wei Luo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of CA2790266A1 publication Critical patent/CA2790266A1/en
Application granted granted Critical
Publication of CA2790266C publication Critical patent/CA2790266C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • G01N29/245—Ceramic probes, e.g. lead zirconate titanate [PZT] probes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
CA2790266A 2011-09-22 2012-09-13 Transducer structure for a transducer probe and methods of fabricating same Expired - Fee Related CA2790266C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/240,754 US8853918B2 (en) 2011-09-22 2011-09-22 Transducer structure for a transducer probe and methods of fabricating same
US13/240,754 2011-09-22

Publications (2)

Publication Number Publication Date
CA2790266A1 CA2790266A1 (en) 2013-03-22
CA2790266C true CA2790266C (en) 2019-11-26

Family

ID=47828053

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2790266A Expired - Fee Related CA2790266C (en) 2011-09-22 2012-09-13 Transducer structure for a transducer probe and methods of fabricating same

Country Status (6)

Country Link
US (1) US8853918B2 (OSRAM)
JP (1) JP6208933B2 (OSRAM)
CN (1) CN103008218B (OSRAM)
CA (1) CA2790266C (OSRAM)
DE (1) DE102012108796B4 (OSRAM)
FR (1) FR2980379A1 (OSRAM)

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* Cited by examiner, † Cited by third party
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US9282945B2 (en) 2009-04-14 2016-03-15 Maui Imaging, Inc. Calibration of ultrasound probes
US9339256B2 (en) 2007-10-01 2016-05-17 Maui Imaging, Inc. Determining material stiffness using multiple aperture ultrasound
EP2627257B1 (en) 2010-10-13 2019-04-17 Maui Imaging, Inc. Concave ultrasound transducers and 3d arrays
TW201336478A (zh) 2011-12-01 2013-09-16 Maui Imaging Inc 使用以回音為基及多孔徑都卜勒超音波之移動偵測
CN104080407B (zh) 2011-12-29 2017-03-01 毛伊图像公司 任意路径的m模式超声成像
JP6399999B2 (ja) 2012-03-26 2018-10-03 マウイ イマギング，インコーポレーテッド 重み付け係数を適用することによって超音波画像の質を改善するためのシステム及び方法
CN104620128B (zh) 2012-08-10 2017-06-23 毛伊图像公司 多孔径超声探头的校准
KR102176319B1 (ko) 2012-08-21 2020-11-09 마우이 이미징, 인코포레이티드 초음파 이미징 시스템 메모리 아키텍처
US20140064513A1 (en) 2012-09-06 2014-03-06 MUSIC Group IP Ltd. System and method for remotely controlling audio equipment
US9510806B2 (en) 2013-03-13 2016-12-06 Maui Imaging, Inc. Alignment of ultrasound transducer arrays and multiple aperture probe assembly
DE102013213493A1 (de) * 2013-07-10 2015-01-15 Robert Bosch Gmbh Schallwandleranordnung
US9883848B2 (en) 2013-09-13 2018-02-06 Maui Imaging, Inc. Ultrasound imaging using apparent point-source transmit transducer
JP6722656B2 (ja) 2014-08-18 2020-07-15 マウイ イマギング，インコーポレーテッド ネットワークベース超音波イメージングシステム
CN105810258B (zh) * 2014-12-30 2018-11-02 中核武汉核电运行技术股份有限公司 一种用于压水堆燃料组件超声检查的探头及其制造工艺
WO2016160981A1 (en) 2015-03-30 2016-10-06 Maui Imaging, Inc. Ultrasound imaging systems and methods for detecting object motion
CN113729764A (zh) 2016-01-27 2021-12-03 毛伊图像公司 具有稀疏阵列探测器的超声成像
RU2649061C1 (ru) * 2016-12-22 2018-03-29 федеральное государственное бюджетное образовательное учреждение высшего образования "Национальный исследовательский университет "МЭИ" (ФГБОУ ВО "НИУ "МЭИ") Широкополосный ультразвуковой преобразователь
KR102394585B1 (ko) * 2017-12-19 2022-05-04 현대자동차 주식회사 음향센서 및 이의 제조방법
KR102721452B1 (ko) * 2019-03-29 2024-10-23 엘지디스플레이 주식회사 플렉서블 진동 모듈 및 이를 포함하는 표시 장치
CN115210005B (zh) * 2019-08-28 2024-04-23 Scr工程有限公司 流体分析设备
US12414474B2 (en) * 2021-10-21 2025-09-09 Baker Hughes Oilfield Operations Llc Methods of forming piezoelectric materials, piezoelectric devices, and associated tooling and systems
CN116293473B (zh) * 2022-12-08 2025-08-01 海鹰企业集团有限责任公司 一种改进型管道声纳湿端处理装置

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US4518889A (en) * 1982-09-22 1985-05-21 North American Philips Corporation Piezoelectric apodized ultrasound transducers
US4658176A (en) * 1984-07-25 1987-04-14 Hitachi, Ltd. Ultrasonic transducer using piezoelectric composite
US4828961A (en) * 1986-07-02 1989-05-09 W. R. Grace & Co.-Conn. Imaging process for forming ceramic electronic circuits
EP0462311B1 (de) * 1990-06-21 1995-04-05 Siemens Aktiengesellschaft Verbund-Ultraschallwandler und Verfahren zur Herstellung eines strukturierten Bauelementes aus piezoelektrischer Keramik
US6117612A (en) 1995-04-24 2000-09-12 Regents Of The University Of Michigan Stereolithography resin for rapid prototyping of ceramics and metals
US5648942A (en) 1995-10-13 1997-07-15 Advanced Technology Laboratories, Inc. Acoustic backing with integral conductors for an ultrasonic transducer
JPH11112048A (ja) * 1997-10-02 1999-04-23 Seiko Epson Corp 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
JP4234846B2 (ja) * 1999-05-12 2009-03-04 上田日本無線株式会社 複合圧電体及び角柱状圧電セラミック焼結体
JP2001326999A (ja) * 2000-05-18 2001-11-22 Olympus Optical Co Ltd 圧電構造体の加工方法および複合圧電体の製造方法
AU2001296428A1 (en) * 2000-09-27 2002-04-08 The Regents Of The University Of California Dynamic mask projection stereo micro lithography
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US6984922B1 (en) * 2002-07-22 2006-01-10 Matsushita Electric Industrial Co., Ltd. Composite piezoelectric transducer and method of fabricating the same
CN101422376B (zh) * 2003-01-23 2012-05-23 株式会社日立医药 超声波探头与超声波诊断设备
JP2005342337A (ja) * 2004-06-04 2005-12-15 Matsushita Electric Ind Co Ltd 超音波探触子
US7449821B2 (en) 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
WO2006100807A1 (ja) * 2005-03-24 2006-09-28 Murata Manufacturing Co., Ltd 圧電素子、及び圧電素子の製造方法
JPWO2006134754A1 (ja) * 2005-06-13 2009-01-08 佐口　隆之 治療用超音波発射装置
US7652410B2 (en) * 2006-08-01 2010-01-26 Insightec Ltd Ultrasound transducer with non-uniform elements
US20090199392A1 (en) * 2008-02-11 2009-08-13 General Electric Company Ultrasound transducer probes and system and method of manufacture
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Also Published As

Publication number Publication date
CN103008218B (zh) 2016-06-29
CA2790266A1 (en) 2013-03-22
US8853918B2 (en) 2014-10-07
JP2013068616A (ja) 2013-04-18
FR2980379A1 (fr) 2013-03-29
CN103008218A (zh) 2013-04-03
DE102012108796A1 (de) 2013-03-28
DE102012108796B4 (de) 2021-03-04
JP6208933B2 (ja) 2017-10-04
US20130076207A1 (en) 2013-03-28

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Effective date: 20170707

MKLA Lapsed

Effective date: 20210913