FR2901546A1 - Procede et dispositif de depollution d'environnement confine - Google Patents
Procede et dispositif de depollution d'environnement confine Download PDFInfo
- Publication number
- FR2901546A1 FR2901546A1 FR0604668A FR0604668A FR2901546A1 FR 2901546 A1 FR2901546 A1 FR 2901546A1 FR 0604668 A FR0604668 A FR 0604668A FR 0604668 A FR0604668 A FR 0604668A FR 2901546 A1 FR2901546 A1 FR 2901546A1
- Authority
- FR
- France
- Prior art keywords
- pumping
- gas
- purge gas
- chamber
- environment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000005086 pumping Methods 0.000 claims abstract description 68
- 238000010926 purge Methods 0.000 claims abstract description 55
- 230000008569 process Effects 0.000 claims abstract description 6
- 239000007789 gas Substances 0.000 claims description 89
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 238000004868 gas analysis Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 25
- 238000004140 cleaning Methods 0.000 description 16
- 230000008901 benefit Effects 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010790 dilution Methods 0.000 description 4
- 239000012895 dilution Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003344 environmental pollutant Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 238000005070 sampling Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000005202 decontamination Methods 0.000 description 3
- 230000003588 decontaminative effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000008246 gaseous mixture Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010223 real-time analysis Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0402—Cleaning, repairing, or assembling
- Y10T137/0419—Fluid cleaning or flushing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/6416—With heating or cooling of the system
- Y10T137/6579—Circulating fluid in heat exchange relationship
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Secondary Cells (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Chemical Vapour Deposition (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (18)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0604668A FR2901546B1 (fr) | 2006-05-24 | 2006-05-24 | Procede et dispositif de depollution d'environnement confine |
JP2009511561A JP5274450B2 (ja) | 2006-05-24 | 2007-05-24 | 密閉環境から汚染を除去するための方法および装置 |
CN2007800270992A CN101501817B (zh) | 2006-05-24 | 2007-05-24 | 用于从限定的环境去除污染的方法和装置 |
KR1020087031317A KR101202551B1 (ko) | 2006-05-24 | 2007-05-24 | 밀폐 환경으로부터 오염을 제거하는 방법 및 장치 |
PCT/FR2007/051328 WO2007135347A1 (fr) | 2006-05-24 | 2007-05-24 | Procede et dispositif de depollution d'environnement confine |
EP07766098A EP2030222A1 (fr) | 2006-05-24 | 2007-05-24 | Procede et dispositif de depollution d'environnement confine |
SG2011037074A SG172620A1 (en) | 2006-05-24 | 2007-05-24 | Method and device for removing pollution from a confined environment |
US12/227,587 US8151816B2 (en) | 2006-05-24 | 2007-05-24 | Method and device for removing pollution from a confined environment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0604668A FR2901546B1 (fr) | 2006-05-24 | 2006-05-24 | Procede et dispositif de depollution d'environnement confine |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2901546A1 true FR2901546A1 (fr) | 2007-11-30 |
FR2901546B1 FR2901546B1 (fr) | 2010-10-15 |
Family
ID=37595457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0604668A Active FR2901546B1 (fr) | 2006-05-24 | 2006-05-24 | Procede et dispositif de depollution d'environnement confine |
Country Status (8)
Country | Link |
---|---|
US (1) | US8151816B2 (fr) |
EP (1) | EP2030222A1 (fr) |
JP (1) | JP5274450B2 (fr) |
KR (1) | KR101202551B1 (fr) |
CN (1) | CN101501817B (fr) |
FR (1) | FR2901546B1 (fr) |
SG (1) | SG172620A1 (fr) |
WO (1) | WO2007135347A1 (fr) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2920046A1 (fr) * | 2007-08-13 | 2009-02-20 | Alcatel Lucent Sas | Procede de post-traitement d'un support de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs, et station de post-traitement pour la mise en oeuvre d'un tel procede |
FR2940322B1 (fr) * | 2008-12-19 | 2011-02-11 | Alcatel Lucent | Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe |
FR2954583B1 (fr) | 2009-12-18 | 2017-11-24 | Alcatel Lucent | Procede et dispositif de pilotage de fabrication de semi conducteurs par mesure de contamination |
FR2961946B1 (fr) * | 2010-06-29 | 2012-08-03 | Alcatel Lucent | Dispositif de traitement pour boites de transport et de stockage |
CN102431727A (zh) * | 2011-08-04 | 2012-05-02 | 上海华力微电子有限公司 | 氟化氩光掩模盒运送装置和方法 |
KR101372448B1 (ko) * | 2013-02-01 | 2014-03-11 | 나노세미콘(주) | 진공 및 가압을 이용한 잔류가스 및 이물질 제거장치 |
NL2010471C2 (en) * | 2013-03-18 | 2014-09-24 | Levitech B V | Substrate processing apparatus. |
CN104162523B (zh) * | 2013-05-16 | 2016-04-27 | 宝山钢铁股份有限公司 | X荧光光谱仪真空分光室的残留油污水汽的清除方法 |
JP6607314B2 (ja) * | 2016-06-08 | 2019-11-20 | 村田機械株式会社 | 容器保管装置及び容器保管方法 |
KR102377504B1 (ko) * | 2016-11-24 | 2022-03-23 | 에스케이하이닉스 주식회사 | 반도체 웨이퍼 제조 시스템 및 제어 방법 |
JP6880913B2 (ja) * | 2017-03-28 | 2021-06-02 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
US10388547B2 (en) * | 2017-06-23 | 2019-08-20 | Applied Materials, Inc. | Side storage pods, equipment front end modules, and methods for processing substrates |
KR101841925B1 (ko) * | 2017-07-28 | 2018-03-26 | 크린팩토메이션 주식회사 | 웨이퍼 내장 풉에 대한 지상 퍼지 스테이션 |
CN108414612A (zh) * | 2018-01-25 | 2018-08-17 | 中国科学院光电研究院 | 一种准分子激光器放电腔气体的检测方法及模块 |
CN110797278B (zh) * | 2018-08-01 | 2022-05-27 | 北京北方华创微电子装备有限公司 | 微环境的压力控制系统及其控制方法、半导体处理设备 |
CN110127151B (zh) * | 2019-04-09 | 2021-07-20 | 广东省第二人民医院(广东省卫生应急医院) | 一种用于去除透析用品包装中消毒气体的方法及装置 |
WO2020212570A1 (fr) * | 2019-04-17 | 2020-10-22 | Ecco Sko A/S | Procédé et emballage pour emballer une ou plusieurs peaux d'animaux |
US11545379B2 (en) * | 2020-07-31 | 2023-01-03 | Nanya Technology Corporation | System and method for controlling semiconductor manufacturing equipment |
CN115527825A (zh) * | 2021-06-25 | 2022-12-27 | 中微半导体设备(上海)股份有限公司 | 一种用于等离子体处理设备的检测装置及等离子体处理设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5788448A (en) * | 1994-12-08 | 1998-08-04 | Tokyo Electron Limited | Processing apparatus |
EP1059660A2 (fr) * | 1999-06-11 | 2000-12-13 | Sony Corporation | Conteneur scellé, Dispositif de stockage, Système de transport et procédé de stockage des composants électroniques |
JP2004128428A (ja) * | 2002-09-30 | 2004-04-22 | Tadashi Kamimura | Foup内ガス置換装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0786387A (ja) * | 1993-06-30 | 1995-03-31 | Sony Corp | ウエハボツクス |
JPH10178089A (ja) * | 1996-12-18 | 1998-06-30 | Sony Corp | ウェハボックスおよびこれを載置するテーブルと台車 |
US6984361B2 (en) * | 1997-12-23 | 2006-01-10 | Cosmed Group, Inc. | Use of continuous flow of Ox to control biological pathogens in mail and shipping parcels |
US6558622B1 (en) * | 1999-05-04 | 2003-05-06 | Steris Corporation | Sub-critical fluid cleaning and antimicrobial decontamination system and process |
US6228330B1 (en) * | 1999-06-08 | 2001-05-08 | The Regents Of The University Of California | Atmospheric-pressure plasma decontamination/sterilization chamber |
JP2000353728A (ja) * | 1999-06-11 | 2000-12-19 | Kan Electronics Co Ltd | ウエハー基板型プローブカード |
-
2006
- 2006-05-24 FR FR0604668A patent/FR2901546B1/fr active Active
-
2007
- 2007-05-24 CN CN2007800270992A patent/CN101501817B/zh active Active
- 2007-05-24 US US12/227,587 patent/US8151816B2/en active Active
- 2007-05-24 WO PCT/FR2007/051328 patent/WO2007135347A1/fr active Application Filing
- 2007-05-24 EP EP07766098A patent/EP2030222A1/fr not_active Withdrawn
- 2007-05-24 KR KR1020087031317A patent/KR101202551B1/ko active IP Right Grant
- 2007-05-24 JP JP2009511561A patent/JP5274450B2/ja active Active
- 2007-05-24 SG SG2011037074A patent/SG172620A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5788448A (en) * | 1994-12-08 | 1998-08-04 | Tokyo Electron Limited | Processing apparatus |
EP1059660A2 (fr) * | 1999-06-11 | 2000-12-13 | Sony Corporation | Conteneur scellé, Dispositif de stockage, Système de transport et procédé de stockage des composants électroniques |
JP2004128428A (ja) * | 2002-09-30 | 2004-04-22 | Tadashi Kamimura | Foup内ガス置換装置 |
Also Published As
Publication number | Publication date |
---|---|
US8151816B2 (en) | 2012-04-10 |
US20090263216A1 (en) | 2009-10-22 |
JP2009538000A (ja) | 2009-10-29 |
KR101202551B1 (ko) | 2012-11-19 |
CN101501817A (zh) | 2009-08-05 |
EP2030222A1 (fr) | 2009-03-04 |
KR20090017633A (ko) | 2009-02-18 |
JP5274450B2 (ja) | 2013-08-28 |
CN101501817B (zh) | 2013-10-16 |
FR2901546B1 (fr) | 2010-10-15 |
SG172620A1 (en) | 2011-07-28 |
WO2007135347A1 (fr) | 2007-11-29 |
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Legal Events
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TP | Transmission of property |
Owner name: ADIXEN VACUUM PRODUCTS, FR Effective date: 20111124 |
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