FR2940322B1 - Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe - Google Patents

Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe

Info

Publication number
FR2940322B1
FR2940322B1 FR0807191A FR0807191A FR2940322B1 FR 2940322 B1 FR2940322 B1 FR 2940322B1 FR 0807191 A FR0807191 A FR 0807191A FR 0807191 A FR0807191 A FR 0807191A FR 2940322 B1 FR2940322 B1 FR 2940322B1
Authority
FR
France
Prior art keywords
sas
unloading
loading
descent method
equipment therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0807191A
Other languages
English (en)
Other versions
FR2940322A1 (fr
Inventor
Julien Bounouar
Jean Marie Foray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Alcatel Lucent SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0807191A priority Critical patent/FR2940322B1/fr
Application filed by Alcatel Lucent SAS filed Critical Alcatel Lucent SAS
Priority to EP09805742A priority patent/EP2377151A1/fr
Priority to PCT/FR2009/052607 priority patent/WO2010070240A1/fr
Priority to US13/140,189 priority patent/US20120024394A1/en
Priority to KR1020117016652A priority patent/KR20110099041A/ko
Priority to CN2009801546617A priority patent/CN102282663A/zh
Priority to JP2011541570A priority patent/JP2012513111A/ja
Publication of FR2940322A1 publication Critical patent/FR2940322A1/fr
Application granted granted Critical
Publication of FR2940322B1 publication Critical patent/FR2940322B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0396—Involving pressure control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y10T137/86171—With pump bypass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Positive Displacement Air Blowers (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
FR0807191A 2008-12-19 2008-12-19 Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe Expired - Fee Related FR2940322B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR0807191A FR2940322B1 (fr) 2008-12-19 2008-12-19 Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe
PCT/FR2009/052607 WO2010070240A1 (fr) 2008-12-19 2009-12-18 Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe
US13/140,189 US20120024394A1 (en) 2008-12-19 2009-12-18 Method for lowering the pressure in a load lock and associated equipment
KR1020117016652A KR20110099041A (ko) 2008-12-19 2009-12-18 로드-언로드 로크 내의 압력을 강하시키기 위한 방법 및 이와 관련된 장비
EP09805742A EP2377151A1 (fr) 2008-12-19 2009-12-18 Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe
CN2009801546617A CN102282663A (zh) 2008-12-19 2009-12-18 用于降低装载锁中的压力的方法和相关设备
JP2011541570A JP2012513111A (ja) 2008-12-19 2009-12-18 チャージ−ディスチャージロック内の圧力を下げるための方法および関連装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0807191A FR2940322B1 (fr) 2008-12-19 2008-12-19 Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe

Publications (2)

Publication Number Publication Date
FR2940322A1 FR2940322A1 (fr) 2010-06-25
FR2940322B1 true FR2940322B1 (fr) 2011-02-11

Family

ID=40886212

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0807191A Expired - Fee Related FR2940322B1 (fr) 2008-12-19 2008-12-19 Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe

Country Status (7)

Country Link
US (1) US20120024394A1 (fr)
EP (1) EP2377151A1 (fr)
JP (1) JP2012513111A (fr)
KR (1) KR20110099041A (fr)
CN (1) CN102282663A (fr)
FR (1) FR2940322B1 (fr)
WO (1) WO2010070240A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2497957B (en) * 2011-12-23 2018-06-27 Edwards Ltd Vacuum pumping
FR3054005B1 (fr) * 2016-07-13 2018-08-24 Pfeiffer Vacuum Procede de descente en pression dans un sas de chargement et de dechargement et groupe de pompage associe
JP6738485B2 (ja) * 2016-08-26 2020-08-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 低圧リフトピンキャビティハードウェア
JP6535649B2 (ja) * 2016-12-12 2019-06-26 株式会社荏原製作所 基板処理装置、排出方法およびプログラム
US10224224B2 (en) * 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US20190145538A1 (en) * 2017-11-14 2019-05-16 Sur-Flo Meters & Controls Ltd Valve with Expandable Sleeve Fitted Over Perforated Walls of Inlet and Outlet Channels to Control Flow Therebetween

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3536418A (en) * 1969-02-13 1970-10-27 Onezime P Breaux Cryogenic turbo-molecular vacuum pump
JPH04326943A (ja) * 1991-04-25 1992-11-16 Hitachi Ltd 真空排気システム及び排気方法
FR2808098B1 (fr) * 2000-04-20 2002-07-19 Cit Alcatel Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes
FR2807951B1 (fr) 2000-04-20 2003-05-16 Cit Alcatel Procede et systeme de pompage des chambres de transfert d'equipement de semi-conducteur
JP3594947B2 (ja) * 2002-09-19 2004-12-02 東京エレクトロン株式会社 絶縁膜の形成方法、半導体装置の製造方法、基板処理装置
US20040261712A1 (en) * 2003-04-25 2004-12-30 Daisuke Hayashi Plasma processing apparatus
GB2407132A (en) * 2003-10-14 2005-04-20 Boc Group Plc Multiple vacuum pump system with additional pump for exhaust flow
FR2901546B1 (fr) * 2006-05-24 2010-10-15 Cit Alcatel Procede et dispositif de depollution d'environnement confine

Also Published As

Publication number Publication date
EP2377151A1 (fr) 2011-10-19
FR2940322A1 (fr) 2010-06-25
JP2012513111A (ja) 2012-06-07
KR20110099041A (ko) 2011-09-05
CN102282663A (zh) 2011-12-14
WO2010070240A1 (fr) 2010-06-24
US20120024394A1 (en) 2012-02-02

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Effective date: 20130830