FR2883101B1 - Transistor mos nanometrique a rapport maximise entre courant a l'etat passant et courant a l'etat bloque - Google Patents
Transistor mos nanometrique a rapport maximise entre courant a l'etat passant et courant a l'etat bloqueInfo
- Publication number
- FR2883101B1 FR2883101B1 FR0550605A FR0550605A FR2883101B1 FR 2883101 B1 FR2883101 B1 FR 2883101B1 FR 0550605 A FR0550605 A FR 0550605A FR 0550605 A FR0550605 A FR 0550605A FR 2883101 B1 FR2883101 B1 FR 2883101B1
- Authority
- FR
- France
- Prior art keywords
- current
- nanometric
- maximized
- mos transistor
- state rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78639—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a drain or source connected to a bulk conducting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Materials Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Thin Film Transistor (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0550605A FR2883101B1 (fr) | 2005-03-08 | 2005-03-08 | Transistor mos nanometrique a rapport maximise entre courant a l'etat passant et courant a l'etat bloque |
US11/885,900 US20110079769A1 (en) | 2005-03-08 | 2006-03-07 | Nanometric MOS Transistor With Maximized Ration Between On-State Current and Off-State Current |
PCT/FR2006/050200 WO2006095112A1 (fr) | 2005-03-08 | 2006-03-07 | Transistor mos nanometrique a rapport maximise entre courant a l'etat passant et courant a l'etat bloque |
JP2008500244A JP2008533714A (ja) | 2005-03-08 | 2006-03-07 | オン状態での電流とオフ状態での電流との比を最大にするナノメータmosトランジスタ |
EP06726224A EP1859485A1 (fr) | 2005-03-08 | 2006-03-07 | Transistor mos nanometrique a rapport maximise entre courant a l'etat passant et courant a l'etat bloque |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0550605A FR2883101B1 (fr) | 2005-03-08 | 2005-03-08 | Transistor mos nanometrique a rapport maximise entre courant a l'etat passant et courant a l'etat bloque |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2883101A1 FR2883101A1 (fr) | 2006-09-15 |
FR2883101B1 true FR2883101B1 (fr) | 2007-06-08 |
Family
ID=35385764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0550605A Expired - Fee Related FR2883101B1 (fr) | 2005-03-08 | 2005-03-08 | Transistor mos nanometrique a rapport maximise entre courant a l'etat passant et courant a l'etat bloque |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110079769A1 (fr) |
EP (1) | EP1859485A1 (fr) |
JP (1) | JP2008533714A (fr) |
FR (1) | FR2883101B1 (fr) |
WO (1) | WO2006095112A1 (fr) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2749977B1 (fr) * | 1996-06-14 | 1998-10-09 | Commissariat Energie Atomique | Transistor mos a puits quantique et procedes de fabrication de celui-ci |
JP2003264290A (ja) * | 2002-03-08 | 2003-09-19 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP4920872B2 (ja) * | 2002-03-28 | 2012-04-18 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | ナノワイヤの製造方法 |
US6833556B2 (en) * | 2002-08-12 | 2004-12-21 | Acorn Technologies, Inc. | Insulated gate field effect transistor having passivated schottky barriers to the channel |
JP2005012110A (ja) * | 2003-06-20 | 2005-01-13 | Handotai Rikougaku Kenkyu Center:Kk | 極微細mosfet |
US7015147B2 (en) * | 2003-07-22 | 2006-03-21 | Sharp Laboratories Of America, Inc. | Fabrication of silicon-on-nothing (SON) MOSFET fabrication using selective etching of Si1-xGex layer |
-
2005
- 2005-03-08 FR FR0550605A patent/FR2883101B1/fr not_active Expired - Fee Related
-
2006
- 2006-03-07 WO PCT/FR2006/050200 patent/WO2006095112A1/fr not_active Application Discontinuation
- 2006-03-07 JP JP2008500244A patent/JP2008533714A/ja not_active Abandoned
- 2006-03-07 EP EP06726224A patent/EP1859485A1/fr not_active Withdrawn
- 2006-03-07 US US11/885,900 patent/US20110079769A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2006095112A1 (fr) | 2006-09-14 |
EP1859485A1 (fr) | 2007-11-28 |
US20110079769A1 (en) | 2011-04-07 |
FR2883101A1 (fr) | 2006-09-15 |
JP2008533714A (ja) | 2008-08-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20121130 |