FR2858912B1 - Module electronique forme de composants empiles et solidarises, composant, procede, moyens d'assemblage et machine d'assemblage correspondants - Google Patents

Module electronique forme de composants empiles et solidarises, composant, procede, moyens d'assemblage et machine d'assemblage correspondants

Info

Publication number
FR2858912B1
FR2858912B1 FR0309841A FR0309841A FR2858912B1 FR 2858912 B1 FR2858912 B1 FR 2858912B1 FR 0309841 A FR0309841 A FR 0309841A FR 0309841 A FR0309841 A FR 0309841A FR 2858912 B1 FR2858912 B1 FR 2858912B1
Authority
FR
France
Prior art keywords
assembly
solidarized
stacked
components
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0309841A
Other languages
English (en)
Other versions
FR2858912A1 (fr
Inventor
Bachir Kordjani
Jacky Jouan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sierra Wireless SA
Original Assignee
Wavecom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wavecom SA filed Critical Wavecom SA
Priority to FR0309841A priority Critical patent/FR2858912B1/fr
Priority to CN 200480022769 priority patent/CN1833319A/zh
Priority to PCT/FR2004/002134 priority patent/WO2005018290A2/fr
Publication of FR2858912A1 publication Critical patent/FR2858912A1/fr
Application granted granted Critical
Publication of FR2858912B1 publication Critical patent/FR2858912B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06551—Conductive connections on the side of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06593—Mounting aids permanently on device; arrangements for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/1064—Electrical connections provided on a side surface of one or more of the containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR0309841A 2003-08-11 2003-08-11 Module electronique forme de composants empiles et solidarises, composant, procede, moyens d'assemblage et machine d'assemblage correspondants Expired - Fee Related FR2858912B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0309841A FR2858912B1 (fr) 2003-08-11 2003-08-11 Module electronique forme de composants empiles et solidarises, composant, procede, moyens d'assemblage et machine d'assemblage correspondants
CN 200480022769 CN1833319A (zh) 2003-08-11 2004-08-11 由层叠并相互连接的元件构成的电子模块,以及相应的元件、方法、装配装置、和装配机器
PCT/FR2004/002134 WO2005018290A2 (fr) 2003-08-11 2004-08-11 Module electronique forme de composants empiles et solidarises, composant, procede, moyens d’assemblage et machine d’assemblage correspondants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0309841A FR2858912B1 (fr) 2003-08-11 2003-08-11 Module electronique forme de composants empiles et solidarises, composant, procede, moyens d'assemblage et machine d'assemblage correspondants

Publications (2)

Publication Number Publication Date
FR2858912A1 FR2858912A1 (fr) 2005-02-18
FR2858912B1 true FR2858912B1 (fr) 2006-12-01

Family

ID=34112720

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0309841A Expired - Fee Related FR2858912B1 (fr) 2003-08-11 2003-08-11 Module electronique forme de composants empiles et solidarises, composant, procede, moyens d'assemblage et machine d'assemblage correspondants

Country Status (3)

Country Link
CN (1) CN1833319A (fr)
FR (1) FR2858912B1 (fr)
WO (1) WO2005018290A2 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734825A (en) * 1986-09-05 1988-03-29 Motorola Inc. Integrated circuit stackable package
US5313096A (en) * 1992-03-16 1994-05-17 Dense-Pac Microsystems, Inc. IC chip package having chip attached to and wire bonded within an overlying substrate
US5266833A (en) * 1992-03-30 1993-11-30 Capps David F Integrated circuit bus structure
US5675180A (en) * 1994-06-23 1997-10-07 Cubic Memory, Inc. Vertical interconnect process for silicon segments
RU2119276C1 (ru) * 1997-11-03 1998-09-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный гибкий электронный модуль
US6308095B1 (en) * 1999-02-12 2001-10-23 Cardiac Pacemakers, Inc. System and method for arrhythmia discrimination
JP2000243900A (ja) * 1999-02-23 2000-09-08 Rohm Co Ltd 半導体チップおよびそれを用いた半導体装置、ならびに半導体チップの製造方法

Also Published As

Publication number Publication date
FR2858912A1 (fr) 2005-02-18
WO2005018290A2 (fr) 2005-02-24
WO2005018290A3 (fr) 2005-12-01
CN1833319A (zh) 2006-09-13

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Effective date: 20100430