FR2797140B1 - Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions - Google Patents
Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexionsInfo
- Publication number
- FR2797140B1 FR2797140B1 FR9909938A FR9909938A FR2797140B1 FR 2797140 B1 FR2797140 B1 FR 2797140B1 FR 9909938 A FR9909938 A FR 9909938A FR 9909938 A FR9909938 A FR 9909938A FR 2797140 B1 FR2797140 B1 FR 2797140B1
- Authority
- FR
- France
- Prior art keywords
- connections
- substrate
- manufacturing
- substrate provided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1338—Chemical vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9909938A FR2797140B1 (fr) | 1999-07-30 | 1999-07-30 | Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions |
US10/030,157 US6756304B1 (en) | 1999-07-30 | 2000-07-18 | Method for producing via-connections in a substrate and substrate equipped with same |
EP00953255A EP1210733A1 (fr) | 1999-07-30 | 2000-07-18 | Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions |
PCT/FR2000/002065 WO2001009944A1 (fr) | 1999-07-30 | 2000-07-18 | Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9909938A FR2797140B1 (fr) | 1999-07-30 | 1999-07-30 | Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2797140A1 FR2797140A1 (fr) | 2001-02-02 |
FR2797140B1 true FR2797140B1 (fr) | 2001-11-02 |
Family
ID=9548724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9909938A Expired - Lifetime FR2797140B1 (fr) | 1999-07-30 | 1999-07-30 | Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions |
Country Status (4)
Country | Link |
---|---|
US (1) | US6756304B1 (fr) |
EP (1) | EP1210733A1 (fr) |
FR (1) | FR2797140B1 (fr) |
WO (1) | WO2001009944A1 (fr) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITTO20010050A1 (it) * | 2001-01-23 | 2002-07-23 | St Microelectronics Srl | Dispositivo integrato a semiconduttori includente interconnessioni adalta tensione attraversanti regioni a bassa tensione. |
DE10205026C1 (de) * | 2002-02-07 | 2003-05-28 | Bosch Gmbh Robert | Halbleitersubstrat mit einem elektrisch isolierten Bereich, insbesondere zur Vertikalintegration |
WO2004001849A2 (fr) | 2002-04-30 | 2003-12-31 | Hrl Laboratories, Llc | Nanoresonateurs a base de quartz et procede de fabrication de ceux-ci |
FR2846792A1 (fr) * | 2002-10-30 | 2004-05-07 | Commissariat Energie Atomique | Composant microelectrique radiofrequence et procede de realisation |
SE526366C3 (sv) * | 2003-03-21 | 2005-10-26 | Silex Microsystems Ab | Elektriska anslutningar i substrat |
US7994877B1 (en) | 2008-11-10 | 2011-08-09 | Hrl Laboratories, Llc | MEMS-based quartz hybrid filters and a method of making the same |
US8766745B1 (en) | 2007-07-25 | 2014-07-01 | Hrl Laboratories, Llc | Quartz-based disk resonator gyro with ultra-thin conductive outer electrodes and method of making same |
DE102005011588A1 (de) | 2005-03-14 | 2006-09-21 | CiS Institut für Mikrosensorik gGmbH | Vorrichtung, insbesondere zur Messung der Feuchte, mit korrosionsgeschützen Anschlüssen |
US20070042563A1 (en) * | 2005-08-19 | 2007-02-22 | Honeywell International Inc. | Single crystal based through the wafer connections technical field |
US7185695B1 (en) * | 2005-09-01 | 2007-03-06 | United Technologies Corporation | Investment casting pattern manufacture |
EP2002477B1 (fr) * | 2006-03-27 | 2011-12-21 | Philips Intellectual Property & Standards GmbH | Méthode de fabrication d'une interconnxion transversale sur substrat faiblement ohmique pour des plaquettes à semi-conducteur |
US7555824B2 (en) | 2006-08-09 | 2009-07-07 | Hrl Laboratories, Llc | Method for large scale integration of quartz-based devices |
WO2008033870A2 (fr) | 2006-09-11 | 2008-03-20 | Lumexis Corporation | Système de distribution par fibres de type fibre jusqu'au siège |
WO2008035261A1 (fr) * | 2006-09-22 | 2008-03-27 | Nxp B.V. | Composant électronique et son procédé de réalisation |
US7884930B2 (en) * | 2007-06-14 | 2011-02-08 | Hrl Laboratories, Llc | Integrated quartz biological sensor and method |
US20100020311A1 (en) * | 2007-06-14 | 2010-01-28 | Hrl Laboratories, Llc | Integrated quartz biological sensor and method |
DE102007034306B3 (de) | 2007-07-24 | 2009-04-02 | Austriamicrosystems Ag | Halbleitersubstrat mit Durchkontaktierung und Verfahren zur Herstellung eines Halbleitersubstrates mit Durchkontaktierung |
US10266398B1 (en) | 2007-07-25 | 2019-04-23 | Hrl Laboratories, Llc | ALD metal coatings for high Q MEMS structures |
US8151640B1 (en) | 2008-02-05 | 2012-04-10 | Hrl Laboratories, Llc | MEMS on-chip inertial navigation system with error correction |
US7802356B1 (en) | 2008-02-21 | 2010-09-28 | Hrl Laboratories, Llc | Method of fabricating an ultra thin quartz resonator component |
ES2715850T3 (es) | 2009-08-06 | 2019-06-06 | Global Eagle Entertainment Inc | Sistema de entretenimiento en vuelo de interconexión en red en serie de fibra hasta el asiento |
WO2011020071A1 (fr) | 2009-08-14 | 2011-02-17 | Lumexis Corp. | Dispositif de connexion d'unité d'affichage vidéo pour un système fibre à l'écran de divertissement à bord |
US8416698B2 (en) | 2009-08-20 | 2013-04-09 | Lumexis Corporation | Serial networking fiber optic inflight entertainment system network configuration |
US8176607B1 (en) | 2009-10-08 | 2012-05-15 | Hrl Laboratories, Llc | Method of fabricating quartz resonators |
US8912711B1 (en) | 2010-06-22 | 2014-12-16 | Hrl Laboratories, Llc | Thermal stress resistant resonator, and a method for fabricating same |
US20140093643A1 (en) * | 2012-09-28 | 2014-04-03 | Tyco Electronics Services Gmbh | Method and system of depositing a viscous material into a surface cavity |
US9250074B1 (en) | 2013-04-12 | 2016-02-02 | Hrl Laboratories, Llc | Resonator assembly comprising a silicon resonator and a quartz resonator |
DE102013208816A1 (de) * | 2013-05-14 | 2014-11-20 | Robert Bosch Gmbh | Verfahren zum Erzeugen eines Durchkontakts in einem CMOS-Substrat |
US9599470B1 (en) | 2013-09-11 | 2017-03-21 | Hrl Laboratories, Llc | Dielectric high Q MEMS shell gyroscope structure |
US9977097B1 (en) | 2014-02-21 | 2018-05-22 | Hrl Laboratories, Llc | Micro-scale piezoelectric resonating magnetometer |
US9991863B1 (en) | 2014-04-08 | 2018-06-05 | Hrl Laboratories, Llc | Rounded and curved integrated tethers for quartz resonators |
US10308505B1 (en) | 2014-08-11 | 2019-06-04 | Hrl Laboratories, Llc | Method and apparatus for the monolithic encapsulation of a micro-scale inertial navigation sensor suite |
US10031191B1 (en) | 2015-01-16 | 2018-07-24 | Hrl Laboratories, Llc | Piezoelectric magnetometer capable of sensing a magnetic field in multiple vectors |
US10110198B1 (en) | 2015-12-17 | 2018-10-23 | Hrl Laboratories, Llc | Integrated quartz MEMS tuning fork resonator/oscillator |
US10175307B1 (en) | 2016-01-15 | 2019-01-08 | Hrl Laboratories, Llc | FM demodulation system for quartz MEMS magnetometer |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4566186A (en) * | 1984-06-29 | 1986-01-28 | Tektronix, Inc. | Multilayer interconnect circuitry using photoimageable dielectric |
JPS63193545A (ja) * | 1987-02-06 | 1988-08-10 | Toshiba Corp | 半導体集積回路の製造方法 |
EP0316799B1 (fr) * | 1987-11-13 | 1994-07-27 | Nissan Motor Co., Ltd. | Dispositif semi-conducteur |
US4978639A (en) * | 1989-01-10 | 1990-12-18 | Avantek, Inc. | Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips |
US5056216A (en) * | 1990-01-26 | 1991-10-15 | Sri International | Method of forming a plurality of solder connections |
US5343071A (en) * | 1993-04-28 | 1994-08-30 | Raytheon Company | Semiconductor structures having dual surface via holes |
US5674785A (en) * | 1995-11-27 | 1997-10-07 | Micron Technology, Inc. | Method of producing a single piece package for semiconductor die |
US6013948A (en) * | 1995-11-27 | 2000-01-11 | Micron Technology, Inc. | Stackable chip scale semiconductor package with mating contacts on opposed surfaces |
CN1187800C (zh) | 1997-04-03 | 2005-02-02 | 株式会社山武 | 电路板以及检测器及其制造方法 |
FR2770339B1 (fr) * | 1997-10-27 | 2003-06-13 | Commissariat Energie Atomique | Structure munie de contacts electriques formes a travers le substrat de cette structure et procede d'obtention d'une telle structure |
EP0926726A1 (fr) * | 1997-12-16 | 1999-06-30 | STMicroelectronics S.r.l. | Procédé de fabrication et dispositif électronique avec des contacts à travers le substrat pour la liaison à un tableau |
EP0971403A1 (fr) * | 1998-07-07 | 2000-01-12 | Interuniversitair Microelektronica Centrum Vzw | Procédé de fabrication de piliers métalliques contenant du cuivre |
US6475889B1 (en) * | 2000-04-11 | 2002-11-05 | Cree, Inc. | Method of forming vias in silicon carbide and resulting devices and circuits |
-
1999
- 1999-07-30 FR FR9909938A patent/FR2797140B1/fr not_active Expired - Lifetime
-
2000
- 2000-07-18 EP EP00953255A patent/EP1210733A1/fr not_active Withdrawn
- 2000-07-18 WO PCT/FR2000/002065 patent/WO2001009944A1/fr active Application Filing
- 2000-07-18 US US10/030,157 patent/US6756304B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2001009944A1 (fr) | 2001-02-08 |
FR2797140A1 (fr) | 2001-02-02 |
US6756304B1 (en) | 2004-06-29 |
EP1210733A1 (fr) | 2002-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 18 |
|
PLFP | Fee payment |
Year of fee payment: 19 |
|
PLFP | Fee payment |
Year of fee payment: 20 |