FR2797140B1 - Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions - Google Patents

Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions

Info

Publication number
FR2797140B1
FR2797140B1 FR9909938A FR9909938A FR2797140B1 FR 2797140 B1 FR2797140 B1 FR 2797140B1 FR 9909938 A FR9909938 A FR 9909938A FR 9909938 A FR9909938 A FR 9909938A FR 2797140 B1 FR2797140 B1 FR 2797140B1
Authority
FR
France
Prior art keywords
connections
substrate
manufacturing
substrate provided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9909938A
Other languages
English (en)
Other versions
FR2797140A1 (fr
Inventor
Philippe Robert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Avionics SAS
Original Assignee
Thales Avionics SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Avionics SAS filed Critical Thales Avionics SAS
Priority to FR9909938A priority Critical patent/FR2797140B1/fr
Priority to US10/030,157 priority patent/US6756304B1/en
Priority to EP00953255A priority patent/EP1210733A1/fr
Priority to PCT/FR2000/002065 priority patent/WO2001009944A1/fr
Publication of FR2797140A1 publication Critical patent/FR2797140A1/fr
Application granted granted Critical
Publication of FR2797140B1 publication Critical patent/FR2797140B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1338—Chemical vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR9909938A 1999-07-30 1999-07-30 Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions Expired - Lifetime FR2797140B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR9909938A FR2797140B1 (fr) 1999-07-30 1999-07-30 Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions
US10/030,157 US6756304B1 (en) 1999-07-30 2000-07-18 Method for producing via-connections in a substrate and substrate equipped with same
EP00953255A EP1210733A1 (fr) 1999-07-30 2000-07-18 Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions
PCT/FR2000/002065 WO2001009944A1 (fr) 1999-07-30 2000-07-18 Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9909938A FR2797140B1 (fr) 1999-07-30 1999-07-30 Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions

Publications (2)

Publication Number Publication Date
FR2797140A1 FR2797140A1 (fr) 2001-02-02
FR2797140B1 true FR2797140B1 (fr) 2001-11-02

Family

ID=9548724

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9909938A Expired - Lifetime FR2797140B1 (fr) 1999-07-30 1999-07-30 Procede de fabrication de connexions traversantes dans un substrat et substrat equipe de telles connexions

Country Status (4)

Country Link
US (1) US6756304B1 (fr)
EP (1) EP1210733A1 (fr)
FR (1) FR2797140B1 (fr)
WO (1) WO2001009944A1 (fr)

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ITTO20010050A1 (it) * 2001-01-23 2002-07-23 St Microelectronics Srl Dispositivo integrato a semiconduttori includente interconnessioni adalta tensione attraversanti regioni a bassa tensione.
DE10205026C1 (de) * 2002-02-07 2003-05-28 Bosch Gmbh Robert Halbleitersubstrat mit einem elektrisch isolierten Bereich, insbesondere zur Vertikalintegration
WO2004001849A2 (fr) 2002-04-30 2003-12-31 Hrl Laboratories, Llc Nanoresonateurs a base de quartz et procede de fabrication de ceux-ci
FR2846792A1 (fr) * 2002-10-30 2004-05-07 Commissariat Energie Atomique Composant microelectrique radiofrequence et procede de realisation
SE526366C3 (sv) * 2003-03-21 2005-10-26 Silex Microsystems Ab Elektriska anslutningar i substrat
US7994877B1 (en) 2008-11-10 2011-08-09 Hrl Laboratories, Llc MEMS-based quartz hybrid filters and a method of making the same
US8766745B1 (en) 2007-07-25 2014-07-01 Hrl Laboratories, Llc Quartz-based disk resonator gyro with ultra-thin conductive outer electrodes and method of making same
DE102005011588A1 (de) 2005-03-14 2006-09-21 CiS Institut für Mikrosensorik gGmbH Vorrichtung, insbesondere zur Messung der Feuchte, mit korrosionsgeschützen Anschlüssen
US20070042563A1 (en) * 2005-08-19 2007-02-22 Honeywell International Inc. Single crystal based through the wafer connections technical field
US7185695B1 (en) * 2005-09-01 2007-03-06 United Technologies Corporation Investment casting pattern manufacture
EP2002477B1 (fr) * 2006-03-27 2011-12-21 Philips Intellectual Property & Standards GmbH Méthode de fabrication d'une interconnxion transversale sur substrat faiblement ohmique pour des plaquettes à semi-conducteur
US7555824B2 (en) 2006-08-09 2009-07-07 Hrl Laboratories, Llc Method for large scale integration of quartz-based devices
WO2008033870A2 (fr) 2006-09-11 2008-03-20 Lumexis Corporation Système de distribution par fibres de type fibre jusqu'au siège
WO2008035261A1 (fr) * 2006-09-22 2008-03-27 Nxp B.V. Composant électronique et son procédé de réalisation
US7884930B2 (en) * 2007-06-14 2011-02-08 Hrl Laboratories, Llc Integrated quartz biological sensor and method
US20100020311A1 (en) * 2007-06-14 2010-01-28 Hrl Laboratories, Llc Integrated quartz biological sensor and method
DE102007034306B3 (de) 2007-07-24 2009-04-02 Austriamicrosystems Ag Halbleitersubstrat mit Durchkontaktierung und Verfahren zur Herstellung eines Halbleitersubstrates mit Durchkontaktierung
US10266398B1 (en) 2007-07-25 2019-04-23 Hrl Laboratories, Llc ALD metal coatings for high Q MEMS structures
US8151640B1 (en) 2008-02-05 2012-04-10 Hrl Laboratories, Llc MEMS on-chip inertial navigation system with error correction
US7802356B1 (en) 2008-02-21 2010-09-28 Hrl Laboratories, Llc Method of fabricating an ultra thin quartz resonator component
ES2715850T3 (es) 2009-08-06 2019-06-06 Global Eagle Entertainment Inc Sistema de entretenimiento en vuelo de interconexión en red en serie de fibra hasta el asiento
WO2011020071A1 (fr) 2009-08-14 2011-02-17 Lumexis Corp. Dispositif de connexion d'unité d'affichage vidéo pour un système fibre à l'écran de divertissement à bord
US8416698B2 (en) 2009-08-20 2013-04-09 Lumexis Corporation Serial networking fiber optic inflight entertainment system network configuration
US8176607B1 (en) 2009-10-08 2012-05-15 Hrl Laboratories, Llc Method of fabricating quartz resonators
US8912711B1 (en) 2010-06-22 2014-12-16 Hrl Laboratories, Llc Thermal stress resistant resonator, and a method for fabricating same
US20140093643A1 (en) * 2012-09-28 2014-04-03 Tyco Electronics Services Gmbh Method and system of depositing a viscous material into a surface cavity
US9250074B1 (en) 2013-04-12 2016-02-02 Hrl Laboratories, Llc Resonator assembly comprising a silicon resonator and a quartz resonator
DE102013208816A1 (de) * 2013-05-14 2014-11-20 Robert Bosch Gmbh Verfahren zum Erzeugen eines Durchkontakts in einem CMOS-Substrat
US9599470B1 (en) 2013-09-11 2017-03-21 Hrl Laboratories, Llc Dielectric high Q MEMS shell gyroscope structure
US9977097B1 (en) 2014-02-21 2018-05-22 Hrl Laboratories, Llc Micro-scale piezoelectric resonating magnetometer
US9991863B1 (en) 2014-04-08 2018-06-05 Hrl Laboratories, Llc Rounded and curved integrated tethers for quartz resonators
US10308505B1 (en) 2014-08-11 2019-06-04 Hrl Laboratories, Llc Method and apparatus for the monolithic encapsulation of a micro-scale inertial navigation sensor suite
US10031191B1 (en) 2015-01-16 2018-07-24 Hrl Laboratories, Llc Piezoelectric magnetometer capable of sensing a magnetic field in multiple vectors
US10110198B1 (en) 2015-12-17 2018-10-23 Hrl Laboratories, Llc Integrated quartz MEMS tuning fork resonator/oscillator
US10175307B1 (en) 2016-01-15 2019-01-08 Hrl Laboratories, Llc FM demodulation system for quartz MEMS magnetometer

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EP0316799B1 (fr) * 1987-11-13 1994-07-27 Nissan Motor Co., Ltd. Dispositif semi-conducteur
US4978639A (en) * 1989-01-10 1990-12-18 Avantek, Inc. Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips
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Also Published As

Publication number Publication date
WO2001009944A1 (fr) 2001-02-08
FR2797140A1 (fr) 2001-02-02
US6756304B1 (en) 2004-06-29
EP1210733A1 (fr) 2002-06-05

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