FR2790136A1 - Dispositifs de protection de circuit electrique a monter en surface et leur procede de fabrication - Google Patents
Dispositifs de protection de circuit electrique a monter en surface et leur procede de fabrication Download PDFInfo
- Publication number
- FR2790136A1 FR2790136A1 FR0002207A FR0002207A FR2790136A1 FR 2790136 A1 FR2790136 A1 FR 2790136A1 FR 0002207 A FR0002207 A FR 0002207A FR 0002207 A FR0002207 A FR 0002207A FR 2790136 A1 FR2790136 A1 FR 2790136A1
- Authority
- FR
- France
- Prior art keywords
- substrate
- electrode
- disposed
- conductive
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Thermistors And Varistors (AREA)
- Emergency Protection Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12104399P | 1999-02-22 | 1999-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2790136A1 true FR2790136A1 (fr) | 2000-08-25 |
Family
ID=22394139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0002207A Withdrawn FR2790136A1 (fr) | 1999-02-22 | 2000-02-22 | Dispositifs de protection de circuit electrique a monter en surface et leur procede de fabrication |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP2000294406A (https=) |
| DE (1) | DE10007888A1 (https=) |
| FR (1) | FR2790136A1 (https=) |
| TW (1) | TW463443B (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004053899A1 (en) * | 2002-12-11 | 2004-06-24 | Bourns, Inc. | Conductive polymer device and method of manufacturing same |
| WO2004053898A3 (en) * | 2002-12-11 | 2004-10-21 | Bourns Inc | Encapsulated electronic device and method of manufacturing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103333385A (zh) * | 2013-05-29 | 2013-10-02 | 安徽荣玖光纤通信科技有限公司 | 一种铜导线ptc高分子导电材料及其制备方法 |
-
2000
- 2000-02-21 DE DE2000107888 patent/DE10007888A1/de not_active Withdrawn
- 2000-02-21 TW TW89102986A patent/TW463443B/zh not_active IP Right Cessation
- 2000-02-22 JP JP2000050491A patent/JP2000294406A/ja not_active Withdrawn
- 2000-02-22 FR FR0002207A patent/FR2790136A1/fr not_active Withdrawn
-
2004
- 2004-02-04 JP JP2004028565A patent/JP2004193626A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004053899A1 (en) * | 2002-12-11 | 2004-06-24 | Bourns, Inc. | Conductive polymer device and method of manufacturing same |
| WO2004053898A3 (en) * | 2002-12-11 | 2004-10-21 | Bourns Inc | Encapsulated electronic device and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| DE10007888A1 (de) | 2000-10-12 |
| JP2004193626A (ja) | 2004-07-08 |
| JP2000294406A (ja) | 2000-10-20 |
| TW463443B (en) | 2001-11-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |