FR2788376B1 - Boitier pour element photosemi-conducteur - Google Patents

Boitier pour element photosemi-conducteur

Info

Publication number
FR2788376B1
FR2788376B1 FR9912056A FR9912056A FR2788376B1 FR 2788376 B1 FR2788376 B1 FR 2788376B1 FR 9912056 A FR9912056 A FR 9912056A FR 9912056 A FR9912056 A FR 9912056A FR 2788376 B1 FR2788376 B1 FR 2788376B1
Authority
FR
France
Prior art keywords
driver
housing
photo element
photo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9912056A
Other languages
English (en)
Other versions
FR2788376A1 (fr
Inventor
Mitsuo Yanagisawa
Hisaki Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10274046A external-priority patent/JP2000106405A/ja
Priority claimed from JP10274040A external-priority patent/JP2000106445A/ja
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of FR2788376A1 publication Critical patent/FR2788376A1/fr
Application granted granted Critical
Publication of FR2788376B1 publication Critical patent/FR2788376B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4272—Cooling with mounting substrates of high thermal conductivity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4271—Cooling with thermo electric cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
FR9912056A 1998-09-28 1999-09-28 Boitier pour element photosemi-conducteur Expired - Lifetime FR2788376B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10274046A JP2000106405A (ja) 1998-09-28 1998-09-28 光半導体素子収納用パッケージ
JP10274040A JP2000106445A (ja) 1998-09-28 1998-09-28 光半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
FR2788376A1 FR2788376A1 (fr) 2000-07-13
FR2788376B1 true FR2788376B1 (fr) 2005-08-05

Family

ID=26550874

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9912056A Expired - Lifetime FR2788376B1 (fr) 1998-09-28 1999-09-28 Boitier pour element photosemi-conducteur

Country Status (2)

Country Link
US (1) US6426591B1 (fr)
FR (1) FR2788376B1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003050341A (ja) * 2001-08-06 2003-02-21 Yamaha Corp 光学部品複合体およびその製造方法
US6920161B2 (en) 2002-01-18 2005-07-19 Oepic Semiconductors, Inc. High-speed TO-can optoelectronic packages
EP1347323A1 (fr) * 2002-03-19 2003-09-24 Corning Incorporated Boítier photonique basé sur un substrat multi-fonctions
US6860652B2 (en) * 2003-05-23 2005-03-01 Intel Corporation Package for housing an optoelectronic assembly
US7255494B2 (en) * 2003-05-23 2007-08-14 Intel Corporation Low-profile package for housing an optoelectronic assembly
US20050018994A1 (en) * 2003-07-24 2005-01-27 Oepic, Inc. Active and passive to-can extension boards
JP2008181951A (ja) * 2007-01-23 2008-08-07 Nec Electronics Corp 固体撮像装置
WO2012165647A1 (fr) * 2011-06-01 2012-12-06 Canon Kabushiki Kaisha Dispositif à semi-conducteurs
US20140238726A1 (en) * 2013-02-28 2014-08-28 Cooper Technologies Company External moisture barrier package for circuit board electrical component
JP6742684B2 (ja) * 2014-09-30 2020-08-19 日亜化学工業株式会社 光部品及びその製造方法ならびに発光装置及びその製造方法
JP7398877B2 (ja) * 2019-04-18 2023-12-15 新光電気工業株式会社 半導体装置用ステム及び半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843355B2 (ja) * 1976-12-20 1983-09-26 日本特殊陶業株式会社 セラミツクと低膨張性金属部材の封止構造体
JPS5581438A (en) * 1978-12-16 1980-06-19 Futaba Corp Manufacturing method of fluorescent display tube grid
JP2716122B2 (ja) 1987-03-09 1998-02-18 日本電気株式会社 アイソレータ内蔵型半導体レーザモジュール
US5111522A (en) 1991-02-19 1992-05-05 At&T Bell Laboratories Optical package with reduced deflection of the optical signal path
JPH05335602A (ja) * 1992-05-28 1993-12-17 Kyocera Corp 光半導体素子収納用パッケージ
JPH08148594A (ja) * 1994-11-25 1996-06-07 Kyocera Corp 光半導体素子収納用パッケージ
JP3285766B2 (ja) * 1996-07-26 2002-05-27 京セラ株式会社 光半導体素子収納用パッケージ
JP3336199B2 (ja) * 1996-07-31 2002-10-21 京セラ株式会社 光半導体素子収納用パッケージ
JP3285765B2 (ja) * 1996-07-26 2002-05-27 京セラ株式会社 光半導体素子収納用パッケージ
US6036375A (en) * 1996-07-26 2000-03-14 Kyocera Corporation Optical semiconductor device housing package
JP3297617B2 (ja) * 1996-12-12 2002-07-02 京セラ株式会社 光半導体素子収納用パッケージ

Also Published As

Publication number Publication date
US6426591B1 (en) 2002-07-30
FR2788376A1 (fr) 2000-07-13

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