FR2772290B1 - Procede de nettoyage d'un polymere brome sur une plaquette de silicium - Google Patents
Procede de nettoyage d'un polymere brome sur une plaquette de siliciumInfo
- Publication number
- FR2772290B1 FR2772290B1 FR9716039A FR9716039A FR2772290B1 FR 2772290 B1 FR2772290 B1 FR 2772290B1 FR 9716039 A FR9716039 A FR 9716039A FR 9716039 A FR9716039 A FR 9716039A FR 2772290 B1 FR2772290 B1 FR 2772290B1
- Authority
- FR
- France
- Prior art keywords
- cleaning
- silicon wafer
- brominated polymer
- brominated
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/963—Removing process residues from vertical substrate surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9716039A FR2772290B1 (fr) | 1997-12-12 | 1997-12-12 | Procede de nettoyage d'un polymere brome sur une plaquette de silicium |
US09/209,166 US6248179B1 (en) | 1997-12-12 | 1998-12-10 | Method of removing polymeric material on a silicon water |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9716039A FR2772290B1 (fr) | 1997-12-12 | 1997-12-12 | Procede de nettoyage d'un polymere brome sur une plaquette de silicium |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2772290A1 FR2772290A1 (fr) | 1999-06-18 |
FR2772290B1 true FR2772290B1 (fr) | 2000-03-17 |
Family
ID=9514749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9716039A Expired - Fee Related FR2772290B1 (fr) | 1997-12-12 | 1997-12-12 | Procede de nettoyage d'un polymere brome sur une plaquette de silicium |
Country Status (2)
Country | Link |
---|---|
US (1) | US6248179B1 (fr) |
FR (1) | FR2772290B1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4011218B2 (ja) * | 1999-01-04 | 2007-11-21 | 株式会社東芝 | 基板処理装置及び基板処理方法 |
AU1604501A (en) * | 1999-11-15 | 2001-05-30 | Lucent Technologies Inc. | System and method for removal of material |
EP1347496A3 (fr) | 2002-03-12 | 2006-05-03 | Dainippon Screen Mfg. Co., Ltd. | Dispositif et procédé de traitement de substrat |
JP2008016660A (ja) * | 2006-07-06 | 2008-01-24 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
CN111482403B (zh) * | 2020-04-30 | 2022-06-17 | 张维萍 | 一种饱和蒸汽复合清洗方法 |
CN113539818B (zh) * | 2021-07-16 | 2024-05-03 | 长鑫存储技术有限公司 | 半导体结构的制造方法及半导体器件蚀刻设备 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4235011A (en) * | 1979-03-28 | 1980-11-25 | Honeywell Inc. | Semiconductor apparatus |
MY102517A (en) * | 1986-08-27 | 1992-07-31 | Conoco Specialty Prod | Cyclone separator |
US5181985A (en) * | 1988-06-01 | 1993-01-26 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Process for the wet-chemical surface treatment of semiconductor wafers |
US5158100A (en) * | 1989-05-06 | 1992-10-27 | Dainippon Screen Mfg. Co., Ltd. | Wafer cleaning method and apparatus therefor |
JP2583152B2 (ja) * | 1990-11-06 | 1997-02-19 | 大日本スクリーン製造株式会社 | 基板回転式表面処理方法 |
US5303671A (en) * | 1992-02-07 | 1994-04-19 | Tokyo Electron Limited | System for continuously washing and film-forming a semiconductor wafer |
JP3341033B2 (ja) * | 1993-06-22 | 2002-11-05 | 忠弘 大見 | 回転薬液洗浄方法及び洗浄装置 |
JP3080834B2 (ja) * | 1994-03-30 | 2000-08-28 | 株式会社東芝 | 半導体基板洗浄処理装置 |
KR0164007B1 (ko) * | 1994-04-06 | 1999-02-01 | 이시다 아키라 | 미세 패턴화된 레지스트막을 가지는 기판의 건조처리방법 및 장치 |
JP3250090B2 (ja) * | 1995-06-27 | 2002-01-28 | 東京エレクトロン株式会社 | 洗浄処理装置及び洗浄処理方法 |
US5746884A (en) * | 1996-08-13 | 1998-05-05 | Advanced Micro Devices, Inc. | Fluted via formation for superior metal step coverage |
US5925577A (en) * | 1997-02-19 | 1999-07-20 | Vlsi Technology, Inc. | Method for forming via contact hole in a semiconductor device |
US5956585A (en) * | 1997-02-19 | 1999-09-21 | Winbond Electronics Corporation | Method of forming a self-aligned damage-free buried contact |
US5817579A (en) * | 1997-04-09 | 1998-10-06 | Vanguard International Semiconductor Corporation | Two step plasma etch method for forming self aligned contact |
US5904154A (en) * | 1997-07-24 | 1999-05-18 | Vanguard International Semiconductor Corporation | Method for removing fluorinated photoresist layers from semiconductor substrates |
US5872061A (en) * | 1997-10-27 | 1999-02-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Plasma etch method for forming residue free fluorine containing plasma etched layers |
-
1997
- 1997-12-12 FR FR9716039A patent/FR2772290B1/fr not_active Expired - Fee Related
-
1998
- 1998-12-10 US US09/209,166 patent/US6248179B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2772290A1 (fr) | 1999-06-18 |
US6248179B1 (en) | 2001-06-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
ST | Notification of lapse |
Effective date: 20070831 |