FR2767193B1 - Dispositif de detection de pression comportant un diaphragme metallique - Google Patents
Dispositif de detection de pression comportant un diaphragme metalliqueInfo
- Publication number
- FR2767193B1 FR2767193B1 FR9809492A FR9809492A FR2767193B1 FR 2767193 B1 FR2767193 B1 FR 2767193B1 FR 9809492 A FR9809492 A FR 9809492A FR 9809492 A FR9809492 A FR 9809492A FR 2767193 B1 FR2767193 B1 FR 2767193B1
- Authority
- FR
- France
- Prior art keywords
- sensing device
- pressure sensing
- metal diaphragm
- diaphragm
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19997297 | 1997-07-25 | ||
JP15791598A JP4161410B2 (ja) | 1997-07-25 | 1998-06-05 | 圧力検出装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2767193A1 FR2767193A1 (fr) | 1999-02-12 |
FR2767193B1 true FR2767193B1 (fr) | 2001-04-06 |
Family
ID=26485200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9809492A Expired - Fee Related FR2767193B1 (fr) | 1997-07-25 | 1998-07-24 | Dispositif de detection de pression comportant un diaphragme metallique |
Country Status (4)
Country | Link |
---|---|
US (1) | US6595065B2 (fr) |
JP (1) | JP4161410B2 (fr) |
DE (1) | DE19833712B8 (fr) |
FR (1) | FR2767193B1 (fr) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6751562B1 (en) | 2000-11-28 | 2004-06-15 | Power Measurement Ltd. | Communications architecture for intelligent electronic devices |
JP2001343300A (ja) * | 2000-06-05 | 2001-12-14 | Denso Corp | 圧力検出装置 |
DE10114862B9 (de) | 2001-03-26 | 2007-04-26 | First Sensor Technology Gmbh | Drucksensoreinrichtung |
DE10134586A1 (de) * | 2001-07-17 | 2003-02-06 | Siemens Ag | Sensoreinrichtung zum Erfassen einer Dehnungsbeanspruchung |
DE10135806A1 (de) * | 2001-07-23 | 2003-02-13 | Zeiss Carl | Spiegel zur Reflexion elektromagnetischer Strahlung und Beleuchtungs- bzw. Abbildungsverfahren unter Einsatz desselben |
DE10153424A1 (de) * | 2001-11-03 | 2003-05-15 | Kmw Duennschichttechnik Und Mi | Druckaufnehmer, insbesondere zur Zylinderdruckmessung bei Motoren und Verfahren zur Herstellung desselben |
DE10156406A1 (de) * | 2001-11-16 | 2003-06-05 | Bosch Gmbh Robert | Verfahren zur Herstellung von Verformungssensoren mit einem Dehnungsmessstreifen sowie zur Herstellung von Dehnungsmessstreifen und Verformungssensoren sowie Dehnungsmessstreifen |
JP3915586B2 (ja) * | 2002-04-24 | 2007-05-16 | 株式会社デンソー | 力学量検出装置の製造方法 |
JP3891037B2 (ja) | 2002-05-21 | 2007-03-07 | 株式会社デンソー | 半導体圧力センサおよび半導体圧力センサ用の半導体ウェハ |
DE10225549B4 (de) * | 2002-06-06 | 2007-12-06 | Siemens Ag | Verfahren und Anordnung zum Erfassen von mechanischen Krafteinwirkungen auf einen Bauelementträger für elektrische Bauelemente |
US20040045351A1 (en) * | 2002-09-05 | 2004-03-11 | Skinner Neal G. | Downhole force and torque sensing system and method |
DE10241450A1 (de) | 2002-09-06 | 2004-03-18 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Bauteils mit einem Sensorelement, insbesondere eines Verformungssensors |
JP3915715B2 (ja) * | 2003-03-07 | 2007-05-16 | 株式会社デンソー | 半導体圧力センサ |
JP2004279089A (ja) * | 2003-03-13 | 2004-10-07 | Denso Corp | 半導体圧力センサ |
JP2004279090A (ja) * | 2003-03-13 | 2004-10-07 | Denso Corp | 半導体圧力センサの製造方法 |
JP4329478B2 (ja) * | 2003-10-06 | 2009-09-09 | 株式会社日立製作所 | 力学量測定装置 |
JP4075776B2 (ja) * | 2003-11-13 | 2008-04-16 | 株式会社デンソー | 物理量センサおよび圧力センサ |
DE102004006201B4 (de) * | 2004-02-09 | 2011-12-08 | Robert Bosch Gmbh | Drucksensor mit Siliziumchip auf einer Stahlmembran |
DE102004032484B3 (de) | 2004-07-05 | 2005-11-24 | Infineon Technologies Ag | Sensor und Verfahren zum Herstellen eines Sensors |
DE102005017853A1 (de) * | 2005-04-18 | 2006-10-19 | Siemens Ag | Drucksensorvorrichtung |
DE102005043687A1 (de) * | 2005-09-14 | 2007-03-15 | Robert Bosch Gmbh | Sensoranordnung, insbesondere zur Druck- oder Kraftsensierung, und Verfahren zur Herstellung einer Sensoranordnung |
US7260996B2 (en) * | 2005-12-12 | 2007-08-28 | Signal Electronic Co., Ltd. | Pressure measuring apparatus and pressure sensor thereof |
JP5186725B2 (ja) * | 2006-03-15 | 2013-04-24 | 株式会社デンソー | 圧力センサ |
JP2008039760A (ja) * | 2006-07-14 | 2008-02-21 | Denso Corp | 圧力センサ |
DE102008000128B4 (de) * | 2007-01-30 | 2013-01-03 | Denso Corporation | Halbleitersensorvorrichtung und deren Herstellungsverfahren |
CN103052870B (zh) * | 2010-08-30 | 2014-10-08 | Ifm电子股份有限公司 | 具有诊断功能的电阻式压力测量单元 |
DE102010042536B4 (de) * | 2010-10-15 | 2020-07-16 | Ifm Electronic Gmbh | Diagnosefähige resistive Druckmesszelle |
ES2645377T3 (es) * | 2011-12-16 | 2017-12-05 | Arteche Lantegi Elkartea, S.A. | Divisor de tensión de alta tensión y conector que comprende dicho divisor |
JP5870837B2 (ja) * | 2012-05-10 | 2016-03-01 | 株式会社日本自動車部品総合研究所 | 圧力センサおよびその製造方法 |
JP5883771B2 (ja) * | 2012-11-26 | 2016-03-15 | 日立オートモティブシステムズ株式会社 | 圧力センサ |
US9250146B2 (en) * | 2013-02-12 | 2016-02-02 | Western New England University | Multidimensional strain gage |
US9146164B2 (en) * | 2013-03-07 | 2015-09-29 | Sensata Technologies, Inc. | Pressure transducer substrate with self alignment feature |
JP5975970B2 (ja) | 2013-11-20 | 2016-08-23 | 日立オートモティブシステムズ株式会社 | 圧力センサ |
US10139300B2 (en) * | 2013-12-25 | 2018-11-27 | Hitachi Automotive Systems, Ltd. | High pressure strain detection device with a base made of a first brittle material and a strain detection element bonded to the base via a second brittle material |
CN103968995B (zh) * | 2014-03-21 | 2016-03-30 | 佛山市天赢橡塑电器有限公司 | 基于弹性测压的流体压力传感器 |
JP2015224903A (ja) * | 2014-05-26 | 2015-12-14 | 株式会社東芝 | 圧力センサ、マイクロフォン、超音波センサ、血圧センサ及びタッチパネル |
JP2016111086A (ja) * | 2014-12-03 | 2016-06-20 | 株式会社デンソー | 半導体装置 |
JP6285889B2 (ja) * | 2015-04-22 | 2018-02-28 | 株式会社豊田中央研究所 | 力検知装置 |
CN107290099B (zh) | 2016-04-11 | 2021-06-08 | 森萨塔科技公司 | 压力传感器、用于压力传感器的插塞件和制造插塞件的方法 |
EP3236226B1 (fr) | 2016-04-20 | 2019-07-24 | Sensata Technologies, Inc. | Procédé de fabrication d'un capteur de pression |
GB2552025B (en) | 2016-07-08 | 2020-08-12 | Sovex Ltd | Boom conveyor |
JP6663314B2 (ja) * | 2016-07-08 | 2020-03-11 | アズビル株式会社 | 圧力センサ |
US20180180494A1 (en) * | 2016-12-22 | 2018-06-28 | Honeywell International Inc. | High Sensitivity Silicon Piezoresistor Force Sensor |
US10352792B2 (en) * | 2017-02-15 | 2019-07-16 | Texas Instruments Incorporated | Device and method for on-chip mechanical stress sensing |
US10545064B2 (en) | 2017-05-04 | 2020-01-28 | Sensata Technologies, Inc. | Integrated pressure and temperature sensor |
US10323998B2 (en) | 2017-06-30 | 2019-06-18 | Sensata Technologies, Inc. | Fluid pressure sensor |
US10724907B2 (en) | 2017-07-12 | 2020-07-28 | Sensata Technologies, Inc. | Pressure sensor element with glass barrier material configured for increased capacitive response |
US10557770B2 (en) | 2017-09-14 | 2020-02-11 | Sensata Technologies, Inc. | Pressure sensor with improved strain gauge |
DE102019129411A1 (de) * | 2019-09-12 | 2021-03-18 | Wika Alexander Wiegand Se & Co. Kg | Aufnehmerkörper mit einem Messelement und Herstellungsverfahren für einen Aufnehmerkörper |
US11885704B2 (en) | 2020-07-27 | 2024-01-30 | Precision Biomems Corporation | Flexible two-dimensional sheet array of electronic sensor devices |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4140023A (en) * | 1978-02-09 | 1979-02-20 | Bourns, Inc. | Differential pressure transducer |
US4439752A (en) | 1981-10-26 | 1984-03-27 | Honeywell Inc. | Semiconductor pressure transducer |
US4445385A (en) * | 1982-04-30 | 1984-05-01 | International Telephone & Telegraph Corporation | Static pressure sensor with glass bonded strain gauge transducers |
JPS58200735A (ja) | 1982-05-18 | 1983-11-22 | オリンパス光学工業株式会社 | 内視鏡用細胞診ブラシ |
JPS5934128A (ja) * | 1982-08-20 | 1984-02-24 | Yokogawa Hokushin Electric Corp | 圧力センサ− |
EP0195232B1 (fr) * | 1985-03-20 | 1991-12-11 | Hitachi, Ltd. | Capteur de la charge piézorésistif |
JPH0746065B2 (ja) | 1985-03-25 | 1995-05-17 | 株式会社日本自動車部品総合研究所 | 高圧用圧力検出器 |
US4683755A (en) * | 1985-11-15 | 1987-08-04 | Imo Delaval Inc. | Biaxial strain gage systems |
JPH0711461B2 (ja) * | 1986-06-13 | 1995-02-08 | 株式会社日本自動車部品総合研究所 | 圧力検出器 |
JPS63196081A (ja) | 1987-02-10 | 1988-08-15 | Nippon Denso Co Ltd | 半導体式圧力検出器 |
SU1615579A1 (ru) * | 1989-01-09 | 1990-12-23 | Предприятие П/Я А-1891 | Датчик давлени |
JPH0328732A (ja) * | 1989-06-26 | 1991-02-06 | Nippon Soken Inc | 圧力検出器およびその製造方法 |
US5289721A (en) | 1990-09-10 | 1994-03-01 | Nippondenso Co., Ltd. | Semiconductor pressure sensor |
JPH04267566A (ja) * | 1991-02-22 | 1992-09-24 | Fujikura Ltd | 高圧用半導体圧力センサ |
JPH0534226A (ja) * | 1991-08-02 | 1993-02-09 | Hitachi Constr Mach Co Ltd | 応力センサ及びその製造方法 |
JPH06132545A (ja) * | 1992-10-19 | 1994-05-13 | Mitsubishi Electric Corp | 圧力検出装置 |
US5581226A (en) | 1994-11-02 | 1996-12-03 | Motorola, Inc. | High pressure sensor structure and method |
JPH09232595A (ja) | 1996-02-26 | 1997-09-05 | Denso Corp | 圧力検出装置 |
US5867886A (en) * | 1997-10-20 | 1999-02-09 | Delco Electronics Corp. | Method of making a thick film pressure sensor |
-
1998
- 1998-06-05 JP JP15791598A patent/JP4161410B2/ja not_active Expired - Fee Related
- 1998-07-24 FR FR9809492A patent/FR2767193B1/fr not_active Expired - Fee Related
- 1998-07-27 DE DE19833712A patent/DE19833712B8/de not_active Expired - Fee Related
-
2000
- 2000-01-27 US US09/492,605 patent/US6595065B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE19833712B8 (de) | 2013-01-31 |
DE19833712B4 (de) | 2012-11-15 |
US6595065B2 (en) | 2003-07-22 |
US20010039837A1 (en) | 2001-11-15 |
JPH1194666A (ja) | 1999-04-09 |
DE19833712A1 (de) | 1999-01-28 |
FR2767193A1 (fr) | 1999-02-12 |
JP4161410B2 (ja) | 2008-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20160331 |