FR2755151B1 - Procede et appareil pour rectifier des lignes conductrices sur un substrat - Google Patents
Procede et appareil pour rectifier des lignes conductrices sur un substratInfo
- Publication number
- FR2755151B1 FR2755151B1 FR9713806A FR9713806A FR2755151B1 FR 2755151 B1 FR2755151 B1 FR 2755151B1 FR 9713806 A FR9713806 A FR 9713806A FR 9713806 A FR9713806 A FR 9713806A FR 2755151 B1 FR2755151 B1 FR 2755151B1
- Authority
- FR
- France
- Prior art keywords
- substrate
- conductive lines
- grinding conductive
- grinding
- lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/105—Using an electrical field; Special methods of applying an electric potential
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/741,479 US5935462A (en) | 1994-10-24 | 1996-10-30 | Repair of metal lines by electrostatically assisted laser ablative deposition |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2755151A1 FR2755151A1 (fr) | 1998-04-30 |
FR2755151B1 true FR2755151B1 (fr) | 2003-07-04 |
Family
ID=24980879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9713806A Expired - Fee Related FR2755151B1 (fr) | 1996-10-30 | 1997-10-29 | Procede et appareil pour rectifier des lignes conductrices sur un substrat |
Country Status (3)
Country | Link |
---|---|
US (1) | US5935462A (fr) |
JP (1) | JPH10152770A (fr) |
FR (1) | FR2755151B1 (fr) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6709720B2 (en) | 1997-03-21 | 2004-03-23 | Kabushiki Kaisha Yaskawa Denki | Marking method and marking material |
US6159832A (en) * | 1998-03-18 | 2000-12-12 | Mayer; Frederick J. | Precision laser metallization |
US6120857A (en) * | 1998-05-18 | 2000-09-19 | The Regents Of The University Of California | Low work function surface layers produced by laser ablation using short-wavelength photons |
CN1406131A (zh) * | 2000-12-25 | 2003-03-26 | 株式会社资生堂 | 活化交感神经的香料组合物 |
US6835426B2 (en) * | 2001-01-19 | 2004-12-28 | Potomac Photonics, Inc. | Method and apparatus for pulse-position synchronization in miniature structures manufacturing processes |
JP4006994B2 (ja) * | 2001-12-18 | 2007-11-14 | 株式会社リコー | 立体構造体の加工方法、立体形状品の製造方法及び立体構造体 |
US6796636B2 (en) * | 2002-12-17 | 2004-09-28 | Lexmark International, Inc. | Two shot molded inkjet printhead lid for laser welding |
US7994021B2 (en) * | 2006-07-28 | 2011-08-09 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
US7943287B2 (en) * | 2006-07-28 | 2011-05-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device |
TWI412079B (zh) * | 2006-07-28 | 2013-10-11 | Semiconductor Energy Lab | 製造顯示裝置的方法 |
US8563431B2 (en) * | 2006-08-25 | 2013-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
US8148259B2 (en) | 2006-08-30 | 2012-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
US20080083115A1 (en) * | 2006-10-05 | 2008-04-10 | Shih-Ping Hsu | Method for repairing metal finish layer on surface of electrical connection pad of circuit board |
TWI375498B (en) * | 2007-11-21 | 2012-10-21 | Ind Tech Res Inst | High perfromance laser-assisted transferring system and transfer component |
DE102008057228A1 (de) * | 2008-01-17 | 2009-07-23 | Schmid Technology Gmbh | Verfahren und Vorrichtung zur Herstellung einer Solarzelle |
EP2660352A1 (fr) * | 2012-05-02 | 2013-11-06 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Feuille donneuse et procédé de fabrication de transfert avant induit par la lumière |
CN104759753B (zh) * | 2015-03-30 | 2016-08-31 | 江苏大学 | 多系统自动化协调工作提高激光诱导空化强化的方法 |
EP3322835A4 (fr) * | 2015-07-09 | 2019-02-27 | Orbotech Ltd. | Commande d'angle d'éjection de transfert vers l'avant induit par laser (lift) |
CN105195902B (zh) * | 2015-10-15 | 2017-06-06 | 浙江欧威科技有限公司 | Pcb干膜线路数字化割膜机 |
US11958242B2 (en) * | 2020-02-19 | 2024-04-16 | Ricoh Company, Ltd. | Three-dimensional modeling apparatus and three-dimensional modeling method |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1138084A (en) * | 1966-07-22 | 1968-12-27 | Standard Telephones Cables Ltd | Method of vapour depositing a material in the form of a pattern |
US3757078A (en) * | 1971-08-19 | 1973-09-04 | Gen Dynamics Corp | Apparatus for refocusing reflected energy at a target focal point |
US3781978A (en) * | 1972-05-16 | 1974-01-01 | Gen Electric | Process of making thermoelectrostatic bonded semiconductor devices |
DE2523982C3 (de) * | 1975-05-30 | 1979-05-17 | Ibm Deutschland Gmbh, 7000 Stuttgart | Verfahren und Einrichtung zur maskenlosen Bedampfung, sowie Verwendung des Verfahrens |
US4294602A (en) * | 1979-08-09 | 1981-10-13 | The Boeing Company | Electro-optically assisted bonding |
US4349583A (en) * | 1981-07-28 | 1982-09-14 | International Business Machines Corporation | Laser enhanced maskless method for plating and simultaneous plating and etching of patterns |
US4622058A (en) * | 1984-06-22 | 1986-11-11 | International Business Machines Corporation | Formation of a multi-layer glass-metallized structure formed on and interconnected to multi-layered-metallized ceramic substrate |
JPS6240986A (ja) * | 1985-08-20 | 1987-02-21 | Fuji Electric Corp Res & Dev Ltd | レ−ザ−加工方法 |
FR2594853A1 (fr) * | 1986-02-25 | 1987-08-28 | Commissariat Energie Atomique | Procede et dispositif de traitement d'un materiau par effet thermo-ionique en vue d'en modifier ses proprietes physico-chimiques |
US4725877A (en) * | 1986-04-11 | 1988-02-16 | American Telephone And Telegraph Company, At&T Bell Laboratories | Metallized semiconductor device including an interface layer |
US4752455A (en) * | 1986-05-27 | 1988-06-21 | Kms Fusion, Inc. | Pulsed laser microfabrication |
US4970196A (en) * | 1987-01-15 | 1990-11-13 | The Johns Hopkins University | Method and apparatus for the thin film deposition of materials with a high power pulsed laser |
FR2624041A1 (fr) * | 1987-12-02 | 1989-06-09 | Otic Fischer & Porter | Procede de soudage au moyen d'un faisceau laser, notamment applicable au soudage de pieces en verre |
US4895735A (en) * | 1988-03-01 | 1990-01-23 | Texas Instruments Incorporated | Radiation induced pattern deposition |
US4987007A (en) * | 1988-04-18 | 1991-01-22 | Board Of Regents, The University Of Texas System | Method and apparatus for producing a layer of material from a laser ion source |
US4933204A (en) * | 1988-09-23 | 1990-06-12 | Rockwell International Corporation | Method of producing a gold film |
US4987006A (en) * | 1990-03-26 | 1991-01-22 | Amp Incorporated | Laser transfer deposition |
US5057184A (en) * | 1990-04-06 | 1991-10-15 | International Business Machines Corporation | Laser etching of materials in liquids |
JP2742631B2 (ja) * | 1990-07-24 | 1998-04-22 | トヨタ自動車株式会社 | 非晶質磁性膜の製造方法 |
US5079070A (en) * | 1990-10-11 | 1992-01-07 | International Business Machines Corporation | Repair of open defects in thin film conductors |
US5153408A (en) * | 1990-10-31 | 1992-10-06 | International Business Machines Corporation | Method and structure for repairing electrical lines |
US5177594A (en) * | 1991-01-09 | 1993-01-05 | International Business Machines Corporation | Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance |
US5173441A (en) * | 1991-02-08 | 1992-12-22 | Micron Technology, Inc. | Laser ablation deposition process for semiconductor manufacture |
JP2917587B2 (ja) * | 1991-06-12 | 1999-07-12 | 住友電気工業株式会社 | 複合酸化物超電導薄膜の成膜方法 |
US5175504A (en) * | 1991-06-17 | 1992-12-29 | Photon Dynamics, Inc. | Method and apparatus for automatically inspecting and repairing a simple matrix circuit panel |
US5235272A (en) * | 1991-06-17 | 1993-08-10 | Photon Dynamics, Inc. | Method and apparatus for automatically inspecting and repairing an active matrix LCD panel |
US5141602A (en) * | 1991-06-18 | 1992-08-25 | International Business Machines Corporation | High-productivity method and apparatus for making customized interconnections |
US5246745A (en) * | 1991-12-23 | 1993-09-21 | International Business Machines Corporation | Laser-induced chemical vapor deposition of thin-film conductors |
DE4232373A1 (de) * | 1992-09-03 | 1994-03-10 | Deutsche Forsch Luft Raumfahrt | Verfahren zum Auftragen strukturierter Schichten |
US5495089A (en) * | 1993-06-04 | 1996-02-27 | Digital Equipment Corporation | Laser soldering surface mount components of a printed circuit board |
JPH0737911A (ja) * | 1993-07-19 | 1995-02-07 | Mitsubishi Electric Corp | 半導体素子のダイボンド装置、及びダイボンド方法 |
US5508065A (en) * | 1994-10-14 | 1996-04-16 | Regents Of The University Of California | Method for materials deposition by ablation transfer processing |
US5567336A (en) * | 1994-10-24 | 1996-10-22 | Matsushita Electric Industrial Co., Ltd. | Laser ablation forward metal deposition with electrostatic assisted bonding |
US5683601A (en) * | 1994-10-24 | 1997-11-04 | Panasonic Technologies, Inc. | Laser ablation forward metal deposition with electrostatic assisted bonding |
-
1996
- 1996-10-30 US US08/741,479 patent/US5935462A/en not_active Expired - Fee Related
-
1997
- 1997-10-29 FR FR9713806A patent/FR2755151B1/fr not_active Expired - Fee Related
- 1997-10-30 JP JP9299149A patent/JPH10152770A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2755151A1 (fr) | 1998-04-30 |
JPH10152770A (ja) | 1998-06-09 |
US5935462A (en) | 1999-08-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20080630 |