FR2753693B1 - Appareil d'alignement d'encoches de tranches - Google Patents
Appareil d'alignement d'encoches de tranchesInfo
- Publication number
- FR2753693B1 FR2753693B1 FR9711866A FR9711866A FR2753693B1 FR 2753693 B1 FR2753693 B1 FR 2753693B1 FR 9711866 A FR9711866 A FR 9711866A FR 9711866 A FR9711866 A FR 9711866A FR 2753693 B1 FR2753693 B1 FR 2753693B1
- Authority
- FR
- France
- Prior art keywords
- alignment apparatus
- notch alignment
- wafer notch
- wafer
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27132896A JP3478682B2 (ja) | 1996-04-17 | 1996-09-24 | ノッチ付きウェーハ整列装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2753693A1 FR2753693A1 (fr) | 1998-03-27 |
FR2753693B1 true FR2753693B1 (fr) | 1999-04-30 |
Family
ID=17498527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9711866A Expired - Fee Related FR2753693B1 (fr) | 1996-09-24 | 1997-09-24 | Appareil d'alignement d'encoches de tranches |
Country Status (3)
Country | Link |
---|---|
US (1) | US5853284A (fr) |
DE (1) | DE19741520B4 (fr) |
FR (1) | FR2753693B1 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5980195A (en) * | 1996-04-24 | 1999-11-09 | Tokyo Electron, Ltd. | Positioning apparatus for substrates to be processed |
KR100230987B1 (ko) * | 1996-10-04 | 1999-11-15 | 윤종용 | 광문자인식기가 부착된 반도체 웨이퍼 검사장치 |
JPH11121585A (ja) * | 1997-10-17 | 1999-04-30 | Olympus Optical Co Ltd | ウェハ搬送装置 |
JP3610426B2 (ja) * | 1998-06-04 | 2005-01-12 | 東京エレクトロン株式会社 | 基板姿勢制御装置 |
US6270307B1 (en) * | 1999-01-25 | 2001-08-07 | Chartered Semiconductor Manufacturing Company | Method for aligning wafers in a cassette |
JP3245833B2 (ja) * | 1999-07-08 | 2002-01-15 | 日本エー・エス・エム株式会社 | 半導体基板アライナー装置および方法 |
US6393337B1 (en) | 2000-01-13 | 2002-05-21 | Applied Materials, Inc. | Method and apparatus for orienting substrates |
KR100364601B1 (ko) | 2000-09-19 | 2002-12-16 | 삼성전자 주식회사 | 웨이퍼 플랫존 얼라이너 |
CH713466B1 (de) * | 2001-07-12 | 2018-08-15 | Murata Machinery Ltd | Vorrichtung und Verfahren zum harmonisierten Positionieren von Waferscheiben. |
US6920796B2 (en) * | 2003-11-13 | 2005-07-26 | Nan Ya Technology Corporation | Device used for detecting clamping force of processed object and method thereof |
JP2012178458A (ja) * | 2011-02-25 | 2012-09-13 | Fujitsu Ltd | 半導体装置の製造方法及び半導体基板の洗浄方法 |
CN104226659B (zh) * | 2013-06-11 | 2017-09-22 | 富泰华工业(深圳)有限公司 | 分离机构 |
CN115810572B (zh) * | 2022-11-23 | 2023-10-31 | 江苏亚电科技有限公司 | 一种晶圆理片装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02178947A (ja) * | 1988-12-29 | 1990-07-11 | Fujitsu Ltd | 半導体ウェーハのノッチ合わせ機構 |
US5183378A (en) * | 1990-03-20 | 1993-02-02 | Tokyo Electron Sagami Limited | Wafer counter having device for aligning wafers |
US5155888A (en) * | 1991-05-22 | 1992-10-20 | Mactronix | Semiconductor wafer lifter |
JPH05259264A (ja) * | 1992-03-11 | 1993-10-08 | Fujitsu Ltd | 半導体ウェーハ整列装置 |
TW275708B (fr) * | 1993-12-28 | 1996-05-11 | Tokyo Electron Co Ltd | |
US5662452A (en) * | 1996-08-26 | 1997-09-02 | H-Square Corporation | Apparatus and method of aligning notches using a free-floating rod |
-
1997
- 1997-09-10 US US08/926,607 patent/US5853284A/en not_active Expired - Fee Related
- 1997-09-20 DE DE19741520A patent/DE19741520B4/de not_active Expired - Fee Related
- 1997-09-24 FR FR9711866A patent/FR2753693B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE19741520B4 (de) | 2005-02-17 |
US5853284A (en) | 1998-12-29 |
FR2753693A1 (fr) | 1998-03-27 |
DE19741520A1 (de) | 1998-04-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20080531 |