FR2746985B1 - Resonateur piezoelectrique - Google Patents

Resonateur piezoelectrique

Info

Publication number
FR2746985B1
FR2746985B1 FR9703679A FR9703679A FR2746985B1 FR 2746985 B1 FR2746985 B1 FR 2746985B1 FR 9703679 A FR9703679 A FR 9703679A FR 9703679 A FR9703679 A FR 9703679A FR 2746985 B1 FR2746985 B1 FR 2746985B1
Authority
FR
France
Prior art keywords
piezoelectric resonator
resonator
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9703679A
Other languages
English (en)
Other versions
FR2746985A1 (fr
Inventor
Takashi Yamamoto
Tetsuo Takeshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of FR2746985A1 publication Critical patent/FR2746985A1/fr
Application granted granted Critical
Publication of FR2746985B1 publication Critical patent/FR2746985B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/58—Multiple crystal filters
    • H03H9/60—Electric coupling means therefor
    • H03H9/605—Electric coupling means therefor consisting of a ladder configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
FR9703679A 1996-04-01 1997-03-26 Resonateur piezoelectrique Expired - Fee Related FR2746985B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10623096A JP3218971B2 (ja) 1996-04-01 1996-04-01 ラダー形フィルタ

Publications (2)

Publication Number Publication Date
FR2746985A1 FR2746985A1 (fr) 1997-10-03
FR2746985B1 true FR2746985B1 (fr) 1998-12-11

Family

ID=14428331

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9703679A Expired - Fee Related FR2746985B1 (fr) 1996-04-01 1997-03-26 Resonateur piezoelectrique

Country Status (5)

Country Link
US (1) US5844452A (fr)
JP (1) JP3218971B2 (fr)
KR (1) KR100229998B1 (fr)
CN (1) CN1073305C (fr)
FR (1) FR2746985B1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69630827T2 (de) * 1995-01-19 2004-05-19 Matsushita Electric Industrial Co., Ltd., Kadoma Piezoelektrisches Filter, sein Herstellungsverfahren und Zwischenfrequenzfilter
US6016024A (en) * 1996-04-05 2000-01-18 Murata Manufacturing Co., Ltd. Piezoelectric component
JPH1079639A (ja) * 1996-07-10 1998-03-24 Murata Mfg Co Ltd 圧電共振子およびそれを用いた電子部品
JPH10107579A (ja) * 1996-08-06 1998-04-24 Murata Mfg Co Ltd 圧電部品
JPH118526A (ja) * 1997-04-25 1999-01-12 Murata Mfg Co Ltd 圧電共振子およびそれを用いた電子部品
JP2001036376A (ja) * 1999-07-23 2001-02-09 Murata Mfg Co Ltd 圧電共振子及び圧電部品
DE10039646A1 (de) * 1999-08-18 2001-03-08 Murata Manufacturing Co Leitende Abdeckung, Elektronisches Bauelement und Verfahren zur Bildung einer isolierenden Schicht der leitenden Abdeckung
US6903489B2 (en) 2000-07-25 2005-06-07 Tdk Corporation Piezoelectric resonator, piezoelectric resonator component and method of making the same
JP3438711B2 (ja) * 2000-09-06 2003-08-18 セイコーエプソン株式会社 圧電デバイス及びその製造方法
DE10104610B4 (de) * 2001-02-02 2013-05-08 Robert Bosch Gmbh Ultraschall-Sensoranordnung für horizontal polarisierte Transversalwellen
US6483229B2 (en) * 2001-03-05 2002-11-19 Agilent Technologies, Inc. Method of providing differential frequency adjusts in a thin film bulk acoustic resonator (FBAR) filter and apparatus embodying the method
JP2003298392A (ja) * 2002-03-29 2003-10-17 Fujitsu Media Device Kk フィルタチップ及びフィルタ装置
JP2009281786A (ja) * 2008-05-20 2009-12-03 Nippon Dempa Kogyo Co Ltd 圧電センサ及び感知装置
US8291559B2 (en) * 2009-02-24 2012-10-23 Epcos Ag Process for adapting resonance frequency of a BAW resonator
FR2953679B1 (fr) * 2009-12-04 2012-06-01 Thales Sa Boitier electronique hermetique et procede d'assemblage hermetique d'un boitier

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5595416A (en) * 1979-01-11 1980-07-19 Noto Denshi Kogyo Kk Ladder type piezoelectric filter
FR2458150A1 (fr) * 1979-05-31 1980-12-26 Ebauches Sa Resonateur a cristal taille pour fonctionner en cisaillement d'epaisseur
DE2925893A1 (de) * 1979-06-27 1981-01-08 Standard Elektrik Lorenz Ag Aus keramikresonatoren aufgebautes filter
JPS639141Y2 (fr) * 1980-10-22 1988-03-18
EP0088548B1 (fr) * 1982-02-22 1988-06-08 Fujitsu Limited Résonateurs piézoélectriques
JPS63253711A (ja) * 1987-04-09 1988-10-20 Kyocera Corp 梯子型圧電フイルタ
JPH04284015A (ja) * 1991-03-13 1992-10-08 Murata Mfg Co Ltd ラダー型フィルタ
US5400001A (en) * 1992-09-21 1995-03-21 Matsushita Electric Industrial Co., Ltd. Piezoelectric resonator and piezoelectric filter
JPH07240661A (ja) * 1994-02-25 1995-09-12 Ngk Spark Plug Co Ltd 高周波用ラダー型圧電フィルタ
JP3221253B2 (ja) * 1994-09-13 2001-10-22 株式会社村田製作所 複合電子部品の製造方法

Also Published As

Publication number Publication date
JP3218971B2 (ja) 2001-10-15
JPH09270668A (ja) 1997-10-14
FR2746985A1 (fr) 1997-10-03
CN1168569A (zh) 1997-12-24
CN1073305C (zh) 2001-10-17
KR100229998B1 (ko) 1999-11-15
US5844452A (en) 1998-12-01

Similar Documents

Publication Publication Date Title
DE69520903T2 (de) Resonatorvorrichtung
DE59712158D1 (de) Piezoelektrischer aktuator
DE69927551D1 (de) Resonatorstrukturen
DE69706009T2 (de) Oszillator
DE60036264D1 (de) Piezoelektrischer Resonator
FR2746985B1 (fr) Resonateur piezoelectrique
DE59805493D1 (de) Laserresonator
DE69522134D1 (de) Piezoelektrischer Vibrator
DE69727738D1 (de) Piezoelektrisches Bauelement
NL1010853A1 (nl) Piezo-elektrische resonator.
FR2743225B1 (fr) Resonateur piezoelectrique
DE69702724T2 (de) Vibrator
DE69724869D1 (de) Piezoelektrisches Bauelement
DE69716846D1 (de) Oberflächenwellen-Resonatorfilter
DE59509613D1 (de) Resonator-Schalldämpfer
DE69621748D1 (de) Resonator
DE69725372D1 (de) Piezoelektrischer Resonator
NO996138D0 (no) Kontinuerlig justerbar resonator
NO984635D0 (no) Piezoelektrisk komponent
DE69501026T2 (de) Piezoelektrisches Porzellan
DE69508143T2 (de) Piezoelektrischer Vibrator
ATA160896A (de) Akustikelement
FI964320A0 (fi) Resonaattorisuodatin
DE29622890U1 (de) Schwingelement
KR960023130U (ko) 레저네이터 케이스

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20111130