FR2725185B1 - BASKET FOR WAFERS, ESPECIALLY OF SEMICONDUCTOR SILICON - Google Patents

BASKET FOR WAFERS, ESPECIALLY OF SEMICONDUCTOR SILICON

Info

Publication number
FR2725185B1
FR2725185B1 FR9506920A FR9506920A FR2725185B1 FR 2725185 B1 FR2725185 B1 FR 2725185B1 FR 9506920 A FR9506920 A FR 9506920A FR 9506920 A FR9506920 A FR 9506920A FR 2725185 B1 FR2725185 B1 FR 2725185B1
Authority
FR
France
Prior art keywords
basket
wafers
semiconductor silicon
silicon
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9506920A
Other languages
French (fr)
Other versions
FR2725185A1 (en
Inventor
Masato Hosoi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Publication of FR2725185A1 publication Critical patent/FR2725185A1/en
Application granted granted Critical
Publication of FR2725185B1 publication Critical patent/FR2725185B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67366Closed carriers characterised by materials, roughness, coatings or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67386Closed carriers characterised by the construction of the closed carrier
FR9506920A 1994-06-17 1995-06-12 BASKET FOR WAFERS, ESPECIALLY OF SEMICONDUCTOR SILICON Expired - Fee Related FR2725185B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15822894A JP2791971B2 (en) 1994-06-17 1994-06-17 Wafer basket in wafer storage container

Publications (2)

Publication Number Publication Date
FR2725185A1 FR2725185A1 (en) 1996-04-05
FR2725185B1 true FR2725185B1 (en) 1997-10-17

Family

ID=15667084

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9506920A Expired - Fee Related FR2725185B1 (en) 1994-06-17 1995-06-12 BASKET FOR WAFERS, ESPECIALLY OF SEMICONDUCTOR SILICON

Country Status (6)

Country Link
JP (1) JP2791971B2 (en)
KR (1) KR100332719B1 (en)
DE (1) DE19521575C2 (en)
FR (1) FR2725185B1 (en)
GB (1) GB2290414B (en)
TW (1) TW299485B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW296361B (en) * 1995-06-26 1997-01-21 Kakizaki Seisakusho Kk
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
GB2350604A (en) * 1999-06-03 2000-12-06 Horizon Biscuit Company Ltd Th Container
DE10046942A1 (en) * 2000-09-21 2002-04-25 Infineon Technologies Ag Process for transporting wafers
DE10104313C1 (en) * 2001-01-22 2002-08-08 Hunke & Jochheim Storage boxes for cassettes
TW511649U (en) * 2001-09-12 2002-11-21 Ind Tech Res Inst Wafer retainer
TWI239931B (en) 2003-05-19 2005-09-21 Miraial Co Ltd Lid unit for thin plate supporting container and thin plate supporting container
DE10337570A1 (en) * 2003-08-14 2005-03-17 Infineon Technologies Ag Wafer-handling device for laying in and transporting fragile objects like thin wafers has a transporting container and a supporting plate
JP4716928B2 (en) * 2006-06-07 2011-07-06 信越ポリマー株式会社 Wafer storage container
CN102339777B (en) * 2010-07-15 2013-09-11 家登精密工业股份有限公司 Wafer limiting piece of wafer box
DE102010040918B4 (en) * 2010-09-16 2013-10-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Container for stacking and transporting discs of brittle material
EP2682212B1 (en) 2011-02-28 2020-10-07 Tungaloy Corporation Guide pad and cutting tool
WO2012117817A1 (en) 2011-02-28 2012-09-07 株式会社タンガロイ Guide pad, cutting tool body, and cutting tool
KR101658631B1 (en) 2014-04-03 2016-09-22 형제기계공업 주식회사 Snow removal equipment using the partition
CN106784145B (en) * 2016-12-23 2018-03-06 中赣新能源股份有限公司 A kind of silicon chip inserted sheet method
CN116936432B (en) * 2023-09-14 2024-01-02 常州银河世纪微电子股份有限公司 Wafer storage box, taking and placing device using same and taking and placing method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5648126A (en) * 1979-09-26 1981-05-01 Nec Kyushu Ltd Auxiliary carrier for replacing wafers
JPS60160539U (en) * 1984-04-02 1985-10-25 ソニー株式会社 Container for storing semiconductor wafers, etc.
US4687097A (en) * 1984-12-11 1987-08-18 Empak, Inc. Wafer processing cassette
US4724963A (en) * 1985-02-20 1988-02-16 Empak, Inc. Wafer processing cassette
US4684021A (en) * 1986-06-23 1987-08-04 Fluoroware, Inc. Bottom loading wafer carrier box
JPH0284319U (en) * 1988-12-20 1990-06-29
US5154301A (en) * 1991-09-12 1992-10-13 Fluoroware, Inc. Wafer carrier
DE69307035T2 (en) * 1992-07-08 1997-07-03 Daifuku Kk Containers for disc-like objects

Also Published As

Publication number Publication date
GB2290414B (en) 1998-07-29
GB9512022D0 (en) 1995-08-09
FR2725185A1 (en) 1996-04-05
KR100332719B1 (en) 2002-10-31
DE19521575A1 (en) 1995-12-21
DE19521575C2 (en) 2002-04-18
KR960002468A (en) 1996-01-26
JPH088332A (en) 1996-01-12
JP2791971B2 (en) 1998-08-27
TW299485B (en) 1997-03-01
GB2290414A (en) 1995-12-20

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20110228