FR2626261B1 - APPARATUS FOR LIFTING SILICON WAFERS, ESPECIALLY - Google Patents
APPARATUS FOR LIFTING SILICON WAFERS, ESPECIALLYInfo
- Publication number
- FR2626261B1 FR2626261B1 FR8801261A FR8801261A FR2626261B1 FR 2626261 B1 FR2626261 B1 FR 2626261B1 FR 8801261 A FR8801261 A FR 8801261A FR 8801261 A FR8801261 A FR 8801261A FR 2626261 B1 FR2626261 B1 FR 2626261B1
- Authority
- FR
- France
- Prior art keywords
- silicon wafers
- lifting silicon
- lifting
- wafers
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 235000012431 wafers Nutrition 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8801261A FR2626261B1 (en) | 1988-01-26 | 1988-01-26 | APPARATUS FOR LIFTING SILICON WAFERS, ESPECIALLY |
KR1019890000779A KR890012369A (en) | 1988-01-26 | 1989-01-25 | Silicon Wafer Lifter |
JP1016056A JPH01280331A (en) | 1988-01-26 | 1989-01-25 | Silicon wafer lifter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8801261A FR2626261B1 (en) | 1988-01-26 | 1988-01-26 | APPARATUS FOR LIFTING SILICON WAFERS, ESPECIALLY |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2626261A1 FR2626261A1 (en) | 1989-07-28 |
FR2626261B1 true FR2626261B1 (en) | 1992-08-14 |
Family
ID=9362909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8801261A Expired - Fee Related FR2626261B1 (en) | 1988-01-26 | 1988-01-26 | APPARATUS FOR LIFTING SILICON WAFERS, ESPECIALLY |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH01280331A (en) |
KR (1) | KR890012369A (en) |
FR (1) | FR2626261B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9257319B2 (en) | 2011-06-03 | 2016-02-09 | Tel Nexx, Inc. | Parallel single substrate processing system with alignment features on a process section frame |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2888409B2 (en) * | 1993-12-14 | 1999-05-10 | 信越半導体株式会社 | Wafer cleaning tank |
JPH10223585A (en) | 1997-02-04 | 1998-08-21 | Canon Inc | Device and method for treating wafer and manufacture of soi wafer |
US6391067B2 (en) * | 1997-02-04 | 2002-05-21 | Canon Kabushiki Kaisha | Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus |
SG63810A1 (en) * | 1997-02-21 | 1999-03-30 | Canon Kk | Wafer processing apparatus wafer processing method and semiconductor substrate fabrication method |
US6767840B1 (en) | 1997-02-21 | 2004-07-27 | Canon Kabushiki Kaisha | Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method |
JPH11121585A (en) * | 1997-10-17 | 1999-04-30 | Olympus Optical Co Ltd | Wafer carrier |
US6055694A (en) * | 1998-11-30 | 2000-05-02 | Tsk America, Inc. | Wafer scrubbing machine |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4436474A (en) * | 1982-01-04 | 1984-03-13 | Western Electric Co., Inc. | Selecting articles from an array thereof |
US4701096A (en) * | 1986-03-05 | 1987-10-20 | Btu Engineering Corporation | Wafer handling station |
-
1988
- 1988-01-26 FR FR8801261A patent/FR2626261B1/en not_active Expired - Fee Related
-
1989
- 1989-01-25 JP JP1016056A patent/JPH01280331A/en active Pending
- 1989-01-25 KR KR1019890000779A patent/KR890012369A/en not_active Application Discontinuation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9257319B2 (en) | 2011-06-03 | 2016-02-09 | Tel Nexx, Inc. | Parallel single substrate processing system with alignment features on a process section frame |
US9293356B2 (en) | 2011-06-03 | 2016-03-22 | Tel Nexx, Inc. | Parallel single substrate processing system |
US9449862B2 (en) | 2011-06-03 | 2016-09-20 | Tel Nexx, Inc. | Parallel single substrate processing system |
US9508582B2 (en) | 2011-06-03 | 2016-11-29 | Tel Nexx, Inc. | Parallel single substrate marangoni module |
Also Published As
Publication number | Publication date |
---|---|
JPH01280331A (en) | 1989-11-10 |
FR2626261A1 (en) | 1989-07-28 |
KR890012369A (en) | 1989-08-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3687795D1 (en) | SEMICONDUCTOR TREATMENT DEVICE. | |
KR880701461A (en) | Semiconductor device manufacturing process | |
KR900008635A (en) | Anti-fog device for semiconductor wafers | |
DE69024681D1 (en) | Grinding device for semiconductor wafers | |
DE3787769D1 (en) | Semiconductor laser device. | |
KR880701023A (en) | Semiconductor device manufacturing method | |
KR880004552A (en) | Semiconductor device manufacturing method | |
DE3786339D1 (en) | SEMICONDUCTOR LASER DEVICE. | |
KR880701457A (en) | Semiconductor device manufacturing method | |
DE3773957D1 (en) | SEMICONDUCTOR DEVICE. | |
DE3889354D1 (en) | Semiconductor device. | |
KR900700556A (en) | Silicon wafer polishing compound | |
DE3789832D1 (en) | Semiconductor laser device. | |
DE3776186D1 (en) | SEMICONDUCTOR LASER DEVICE. | |
FR2725960B1 (en) | WAFER SUPPORT, ESPECIALLY SEMICONDUCTOR SILICON | |
DE3751342D1 (en) | Semiconductor imaging device. | |
FR2626261B1 (en) | APPARATUS FOR LIFTING SILICON WAFERS, ESPECIALLY | |
KR880701017A (en) | Semiconductor device | |
DE69033794D1 (en) | Semiconductor device | |
DE69031609D1 (en) | Semiconductor device | |
DE59003052D1 (en) | Semiconductor device. | |
DE3787763D1 (en) | Compound semiconductor device. | |
KR900012355A (en) | Semiconductor device package | |
DE69029226D1 (en) | Semiconductor device | |
KR890005864A (en) | Semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |