FR2714523B1 - Procédé d'empêchement de la détérioration de la qualité de film d'un film conducteur transparent, dispositif à semiconducteur et son procédé de fabrication. - Google Patents

Procédé d'empêchement de la détérioration de la qualité de film d'un film conducteur transparent, dispositif à semiconducteur et son procédé de fabrication.

Info

Publication number
FR2714523B1
FR2714523B1 FR9411304A FR9411304A FR2714523B1 FR 2714523 B1 FR2714523 B1 FR 2714523B1 FR 9411304 A FR9411304 A FR 9411304A FR 9411304 A FR9411304 A FR 9411304A FR 2714523 B1 FR2714523 B1 FR 2714523B1
Authority
FR
France
Prior art keywords
conductive film
manufacturing
semiconductor device
transparent conductive
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9411304A
Other languages
English (en)
Other versions
FR2714523A1 (fr
Inventor
Yutaka C O Fujitsu Li Takizawa
Ken-Ichi C O Fujitsu Lim Yanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of FR2714523A1 publication Critical patent/FR2714523A1/fr
Application granted granted Critical
Publication of FR2714523B1 publication Critical patent/FR2714523B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639—Preparation of substrate for selective deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639—Preparation of substrate for selective deposition
    • H01L21/02645—Seed materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Photovoltaic Devices (AREA)
  • Chemical Vapour Deposition (AREA)
FR9411304A 1993-12-27 1994-09-22 Procédé d'empêchement de la détérioration de la qualité de film d'un film conducteur transparent, dispositif à semiconducteur et son procédé de fabrication. Expired - Fee Related FR2714523B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33066193 1993-12-27
JP04952894A JP3272532B2 (ja) 1993-12-27 1994-03-18 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
FR2714523A1 FR2714523A1 (fr) 1995-06-30
FR2714523B1 true FR2714523B1 (fr) 1999-04-16

Family

ID=26389931

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9411304A Expired - Fee Related FR2714523B1 (fr) 1993-12-27 1994-09-22 Procédé d'empêchement de la détérioration de la qualité de film d'un film conducteur transparent, dispositif à semiconducteur et son procédé de fabrication.

Country Status (3)

Country Link
US (3) US5429983A (fr)
JP (1) JP3272532B2 (fr)
FR (1) FR2714523B1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3315834B2 (ja) * 1995-05-31 2002-08-19 富士通株式会社 薄膜トランジスタマトリクス装置及びその製造方法
US6025269A (en) * 1996-10-15 2000-02-15 Micron Technology, Inc. Method for depositioning a substantially void-free aluminum film over a refractory metal nitride layer
JP3796030B2 (ja) * 1997-11-16 2006-07-12 キヤノンアネルバ株式会社 薄膜作成装置
US6579749B2 (en) * 1998-11-17 2003-06-17 Nec Corporation Fabrication method and fabrication apparatus for thin film transistor
KR100344777B1 (ko) * 2000-02-28 2002-07-20 엘지.필립스 엘시디 주식회사 박막트랜지스터를 포함하는 소자 제조방법
AU2001285055A1 (en) * 2000-08-18 2002-03-04 Midwest Research Institute High carrier concentration p-type transparent conducting oxide films
US6930025B2 (en) * 2001-02-01 2005-08-16 Canon Kabushiki Kaisha Transparent conductive film formation process, photovoltaic device production process, transparent conductive film, and photovoltaic device
US7517784B2 (en) * 2001-08-17 2009-04-14 Alliance For Sustainable Energy, Llc Method for producing high carrier concentration p-Type transparent conducting oxides
JP4739356B2 (ja) * 2008-01-28 2011-08-03 純一 半那 導電性パターン
US8980066B2 (en) * 2008-03-14 2015-03-17 Applied Materials, Inc. Thin film metal oxynitride semiconductors
US8896065B2 (en) * 2008-04-14 2014-11-25 Sharp Laboratories Of America, Inc. Top gate thin film transistor with independent field control for off-current suppression
KR102096109B1 (ko) 2009-07-03 2020-04-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
WO2011106451A1 (fr) * 2010-02-23 2011-09-01 Life Technologies Corporation Procédés de traitement de surfaces d'oxyde métallique, et surfaces obtenues par ces procédés
WO2012029596A1 (fr) 2010-09-03 2012-03-08 Semiconductor Energy Laboratory Co., Ltd. Procédé de fabrication d'un dispositif semi-conducteur
JP6053098B2 (ja) 2011-03-28 2016-12-27 株式会社半導体エネルギー研究所 半導体装置
JP5843734B2 (ja) * 2012-09-10 2016-01-13 三菱電機株式会社 光電変換素子およびその製造方法
TWI565080B (zh) * 2014-12-02 2017-01-01 國立中山大學 薄膜電晶體的製作方法
JP6832776B2 (ja) * 2017-03-30 2021-02-24 東京エレクトロン株式会社 選択成長方法
DE102018124576A1 (de) 2018-10-05 2020-04-09 Osram Opto Semiconductors Gmbh Verfahren zur herstellung eines halbleiterbauelements mit durchführung einer plasmabehandlung und halbleiterbauelement

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57193025A (en) * 1981-05-25 1982-11-27 Semiconductor Energy Lab Co Ltd Manufacture of film
IN157312B (fr) * 1982-01-12 1986-03-01 Rca Corp
JPS58175674A (ja) * 1982-04-08 1983-10-14 Fuji Xerox Co Ltd 熱磁気記録装置
JPS60213062A (ja) * 1984-04-09 1985-10-25 Hosiden Electronics Co Ltd 薄膜トランジスタの製造方法
US4592792A (en) * 1985-01-23 1986-06-03 Rca Corporation Method for forming uniformly thick selective epitaxial silicon
JPS6281057A (ja) * 1985-10-04 1987-04-14 Hosiden Electronics Co Ltd 透明導電膜
EP0217406B1 (fr) * 1985-10-04 1992-06-10 Hosiden Corporation Transistor à couche mince et méthode pour sa fabrication
JPS6296667A (ja) * 1985-10-22 1987-05-06 Seiko Epson Corp 薄膜作製方法
US4849797A (en) * 1987-01-23 1989-07-18 Hosiden Electronics Co., Ltd. Thin film transistor
CA1321121C (fr) * 1987-03-27 1993-08-10 Hiroyuki Tokunaga Methode de fabrication de semiconducteurs composites et dispositif a semiconducteur utilisant un semiconducteur composite fabrique selon cette methode
FI81926C (fi) * 1987-09-29 1990-12-10 Nokia Oy Ab Foerfarande foer uppbyggning av gaas-filmer pao si- och gaas-substrater.
US4873118A (en) * 1988-11-18 1989-10-10 Atlantic Richfield Company Oxygen glow treating of ZnO electrode for thin film silicon solar cell
US5141893A (en) * 1988-12-22 1992-08-25 Ford Microelectronics Growth of P type Group III-V compound semiconductor on Group IV semiconductor substrate
WO1991003834A1 (fr) * 1989-09-05 1991-03-21 Mcnc Procede pour deposer selectivement de la matiere sur des substrats
US5134091A (en) * 1989-09-29 1992-07-28 National Research Institute For Metals Quantum effective device and process for its production
US5242580A (en) * 1990-11-13 1993-09-07 Esso Resources Canada Limited Recovery of hydrocarbons from hydrocarbon contaminated sludge
US5242530A (en) * 1991-08-05 1993-09-07 International Business Machines Corporation Pulsed gas plasma-enhanced chemical vapor deposition of silicon
US5229332A (en) * 1992-02-25 1993-07-20 Texas Instruments Incorporated Method for the growth of epitaxial metal-insulator-metal-semiconductor structures

Also Published As

Publication number Publication date
US5429983A (en) 1995-07-04
JP3272532B2 (ja) 2002-04-08
JPH07235502A (ja) 1995-09-05
US5620924A (en) 1997-04-15
FR2714523A1 (fr) 1995-06-30
US5900646A (en) 1999-05-04

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Legal Events

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ST Notification of lapse

Effective date: 20060531