FR2659344A1 - Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre. - Google Patents

Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre. Download PDF

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Publication number
FR2659344A1
FR2659344A1 FR9003037A FR9003037A FR2659344A1 FR 2659344 A1 FR2659344 A1 FR 2659344A1 FR 9003037 A FR9003037 A FR 9003037A FR 9003037 A FR9003037 A FR 9003037A FR 2659344 A1 FR2659344 A1 FR 2659344A1
Authority
FR
France
Prior art keywords
elements
vacuum
bonded
pressure
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR9003037A
Other languages
English (en)
French (fr)
Other versions
FR2659344B1 (enExample
Inventor
Dieumegard Michel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR9003037A priority Critical patent/FR2659344A1/fr
Publication of FR2659344A1 publication Critical patent/FR2659344A1/fr
Application granted granted Critical
Publication of FR2659344B1 publication Critical patent/FR2659344B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
    • H01L2224/75101—Chamber
    • H01L2224/75102—Vacuum chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75317—Removable auxiliary member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
FR9003037A 1990-03-09 1990-03-09 Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre. Granted FR2659344A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9003037A FR2659344A1 (fr) 1990-03-09 1990-03-09 Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9003037A FR2659344A1 (fr) 1990-03-09 1990-03-09 Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre.

Publications (2)

Publication Number Publication Date
FR2659344A1 true FR2659344A1 (fr) 1991-09-13
FR2659344B1 FR2659344B1 (enExample) 1995-01-06

Family

ID=9394579

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9003037A Granted FR2659344A1 (fr) 1990-03-09 1990-03-09 Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre.

Country Status (1)

Country Link
FR (1) FR2659344A1 (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996030937A1 (en) * 1995-03-27 1996-10-03 Micron Technology, Inc. A curing method and equipment design for epoxy mounted flip chip devices
EP0750550A4 (enExample) * 1995-01-13 1997-02-12
EP0803414A1 (de) * 1996-04-23 1997-10-29 Itt Manufacturing Enterprises, Inc. Vorrichtung zum blasenfreien Fixieren von zu klebenden Komponenten
DE19755088A1 (de) * 1997-12-11 1999-06-17 Daimler Chrysler Ag Kalibriervorrichtung zum Verkleben von Scheiben
FR2798935A1 (fr) * 1999-09-29 2001-03-30 Siemens Ag Procede de collage
WO2003074333A1 (de) * 2002-03-05 2003-09-12 Robert Bosch Gmbh Vorrichtung und verfahren zur fixierung eines sensormittels
DE10102848B4 (de) * 2000-05-31 2004-04-15 Sebastian Erb Verfahren zum formschlüssigen und blasenfreien Verkleben von bestückten oder unbestückten gedruckten Schaltung mit planen Kühlkörpern unter Verwendung von Klebefolien
FR2873499A1 (fr) * 2004-07-23 2006-01-27 Thales Sa Procede d'encollage ou d'assemblage de plusieurs elements
EP1705969A3 (en) * 2005-01-27 2008-07-02 Delphi Technologies, Inc. Electronic assembly having a substrate laminated within a backplate cavity
DE102009049386A1 (de) * 2009-10-14 2011-04-21 Scheugenpflug Ag Verfahren und Vorrichtung zum Verkleben mit Hilfe von Vakuum
EP2521430A1 (de) * 2011-05-06 2012-11-07 Pierburg Pump Technology GmbH Verfahren zur Befestigung einer Leiterplatte auf einem Körper sowie elektromotorisch angetriebene Pumpe

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536341A (en) * 1976-07-06 1978-01-20 Nitto Electric Ind Co Ltd Method for vacuum pressure application
JPS63238182A (ja) * 1987-03-26 1988-10-04 Chiyouwa Kogyo Kk 接着シ−トの貼着方法および装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536341A (en) * 1976-07-06 1978-01-20 Nitto Electric Ind Co Ltd Method for vacuum pressure application
JPS63238182A (ja) * 1987-03-26 1988-10-04 Chiyouwa Kogyo Kk 接着シ−トの貼着方法および装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, vol. 13, no. 39 (C-563)[3387], 27 janvier 1989; & JP-A-63 238 182 (CHIYOUWA KOGYO K.K.) 10-04-1988 *
PATENT ABSTRACTS OF JAPAN, vol. 2, no. 48, page 87 C 78; & JP-A-53 6341 (NITTO DENKI KOGYO) 20-01-1978 *

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0750550A4 (enExample) * 1995-01-13 1997-02-12
US5605547A (en) * 1995-03-27 1997-02-25 Micron Technology, Inc. Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor
WO1996030937A1 (en) * 1995-03-27 1996-10-03 Micron Technology, Inc. A curing method and equipment design for epoxy mounted flip chip devices
EP0803414A1 (de) * 1996-04-23 1997-10-29 Itt Manufacturing Enterprises, Inc. Vorrichtung zum blasenfreien Fixieren von zu klebenden Komponenten
DE19755088A1 (de) * 1997-12-11 1999-06-17 Daimler Chrysler Ag Kalibriervorrichtung zum Verkleben von Scheiben
FR2798935A1 (fr) * 1999-09-29 2001-03-30 Siemens Ag Procede de collage
DE10102848B4 (de) * 2000-05-31 2004-04-15 Sebastian Erb Verfahren zum formschlüssigen und blasenfreien Verkleben von bestückten oder unbestückten gedruckten Schaltung mit planen Kühlkörpern unter Verwendung von Klebefolien
US7104149B2 (en) 2002-03-05 2006-09-12 Robert Bosch Gmbh Device and method for fixing a sensing means
WO2003074333A1 (de) * 2002-03-05 2003-09-12 Robert Bosch Gmbh Vorrichtung und verfahren zur fixierung eines sensormittels
FR2873499A1 (fr) * 2004-07-23 2006-01-27 Thales Sa Procede d'encollage ou d'assemblage de plusieurs elements
EP1622437A1 (fr) 2004-07-23 2006-02-01 Thales Procédé d'encollage ou d'assemblage de plusieurs éléments
EP1705969A3 (en) * 2005-01-27 2008-07-02 Delphi Technologies, Inc. Electronic assembly having a substrate laminated within a backplate cavity
US7416011B2 (en) 2005-01-27 2008-08-26 Delphi Technologies, Inc. Electronic assembly having a substrate laminated within a backplate cavity
DE102009049386A1 (de) * 2009-10-14 2011-04-21 Scheugenpflug Ag Verfahren und Vorrichtung zum Verkleben mit Hilfe von Vakuum
DE102009049386B4 (de) 2009-10-14 2018-06-28 Pierburg Pump Technology Gmbh Verfahren und Vorrichtung zum Verkleben mit Hilfe von Vakuum
EP2521430A1 (de) * 2011-05-06 2012-11-07 Pierburg Pump Technology GmbH Verfahren zur Befestigung einer Leiterplatte auf einem Körper sowie elektromotorisch angetriebene Pumpe
WO2012152627A1 (de) * 2011-05-06 2012-11-15 Pierburg Pump Technology Gmbh Verfahren zur befestigung einer leiterplatte auf einem körper sowie elektromotorisch angetriebene pumpe

Also Published As

Publication number Publication date
FR2659344B1 (enExample) 1995-01-06

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