FR2627007B1 - Condensateur de decouplage pour circuit integre - Google Patents

Condensateur de decouplage pour circuit integre

Info

Publication number
FR2627007B1
FR2627007B1 FR8801380A FR8801380A FR2627007B1 FR 2627007 B1 FR2627007 B1 FR 2627007B1 FR 8801380 A FR8801380 A FR 8801380A FR 8801380 A FR8801380 A FR 8801380A FR 2627007 B1 FR2627007 B1 FR 2627007B1
Authority
FR
France
Prior art keywords
integrated circuit
decoupling capacitor
decoupling
capacitor
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8801380A
Other languages
English (en)
Other versions
FR2627007A1 (fr
Inventor
Pascal Le Gal
Henri Laville
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eurofarad EFD SAS
Original Assignee
Eurofarad EFD SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eurofarad EFD SAS filed Critical Eurofarad EFD SAS
Priority to FR8801380A priority Critical patent/FR2627007B1/fr
Publication of FR2627007A1 publication Critical patent/FR2627007A1/fr
Application granted granted Critical
Publication of FR2627007B1 publication Critical patent/FR2627007B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
FR8801380A 1988-02-05 1988-02-05 Condensateur de decouplage pour circuit integre Expired - Fee Related FR2627007B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8801380A FR2627007B1 (fr) 1988-02-05 1988-02-05 Condensateur de decouplage pour circuit integre

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8801380A FR2627007B1 (fr) 1988-02-05 1988-02-05 Condensateur de decouplage pour circuit integre

Publications (2)

Publication Number Publication Date
FR2627007A1 FR2627007A1 (fr) 1989-08-11
FR2627007B1 true FR2627007B1 (fr) 1994-06-03

Family

ID=9362995

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8801380A Expired - Fee Related FR2627007B1 (fr) 1988-02-05 1988-02-05 Condensateur de decouplage pour circuit integre

Country Status (1)

Country Link
FR (1) FR2627007B1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1089925A (en) * 1965-10-08 1967-11-08 London Electrical Mfg Company Method of manufacturing mica or like capacitors
ES468041A1 (es) * 1977-03-22 1978-11-16 Novi Pb Sa Unos perfeccionamientos en la fabricacion de condensadores electricos.
GB2132030B (en) * 1981-09-07 1986-10-08 Stanley Bracey Electronic chip components
FR2550009B1 (fr) * 1983-07-29 1986-01-24 Inf Milit Spatiale Aeronaut Boitier de composant electronique muni d'un condensateur
JPS6081845A (ja) * 1983-10-12 1985-05-09 Nec Corp 半導体チツプキヤリア
FR2555394B1 (fr) * 1983-11-22 1986-03-28 Eurofarad Support pour composant rapide, notamment composant hyperfrequence, a elements de decouplage incorpores

Also Published As

Publication number Publication date
FR2627007A1 (fr) 1989-08-11

Similar Documents

Publication Publication Date Title
FR2596231B1 (fr) Boitier pour circuits electroniques
DE404295T1 (de) Kondensatoren fuer integrierte schaltungen.
KR900012357A (ko) 다층혼성집적회로
DE69033993D1 (de) Mehrschicht-Hybridschaltkreis
GB2202375B (en) Decoupling capacitor
GB8717633D0 (en) Decoupling capacitor
DE3886244T2 (de) Kapazitätsmessschaltung.
DE69031141D1 (de) Integrierte Hybridschaltungsanordnung
GB2244861B (en) Integrated circuit capacitor
FR2629665B1 (fr) Boitier pour circuit electronique
FR2596923B1 (fr) Connecteur pour support de circuit integre
DE69031142T2 (de) Integrierte Hybridschaltungsanordnung
KR900009397A (ko) 집적 회로용 트레이
FR2644631B1 (fr) Boitier pour circuit integre hyperfrequences
DE69024234T2 (de) Kondensator für eine integrierte Schaltung
DE3854437D1 (de) Chipkondensator.
FR2608840B1 (fr) Structure de refroidissement pour circuits integres
DE69029468D1 (de) Integrierte Schaltungsanordnung
FR2588419B1 (fr) Structure de montage pour puce de circuits integres
NO174410C (no) Pakkeoppbygging for elektroniske kretser
KR900012354A (ko) 공동내에 감결합 캐패시터를 갖는 패키지 집적회로
FR2649265B1 (fr) Circuit amplificateur-separateur pour la conversion ttl-cmos
FR2627007B1 (fr) Condensateur de decouplage pour circuit integre
DE59010443D1 (de) Integrierte Schaltungsanordnung
FR2616034B1 (fr) Boitier pour circuits electroniques

Legal Events

Date Code Title Description
ST Notification of lapse