FR2603738A1 - Procede de formation d'une structure multicouche pour le cablage dans des domaines electronique ou optique - Google Patents
Procede de formation d'une structure multicouche pour le cablage dans des domaines electronique ou optiqueInfo
- Publication number
- FR2603738A1 FR2603738A1 FR8705920A FR8705920A FR2603738A1 FR 2603738 A1 FR2603738 A1 FR 2603738A1 FR 8705920 A FR8705920 A FR 8705920A FR 8705920 A FR8705920 A FR 8705920A FR 2603738 A1 FR2603738 A1 FR 2603738A1
- Authority
- FR
- France
- Prior art keywords
- forming
- wiring
- electronic
- multilayer structure
- materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02425—Conductive materials, e.g. metallic silicides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
L'INVENTION CONCERNE UN PROCEDE POUR FORMER UNE STRUCTURE MULTICOUCHE PAR EGALISATION D'UNE SURFACE DEPOSEE INEGALE DE CETTE STRUCTURE. ELLE CONSISTE A FORMER, AVEC DES MATIERES DE TYPES DIFFERENTS, DES PARTIES INFERIEURE ET SUPERIEURE SUR LA SURFACE DEPOSEE, ET A DEPOSER SELECTIVEMENT UNE MATIERE 15 SUR LES PARTIES INFERIEURES SEULES EN UTILISANT LA DIFFERENCE DE DENSITE DE NUCLEATION ENTRE LES MATIERES DEPOSEES, DU FAIT DES TYPES DE MATIERES DE LA SURFACE DEPOSEE, DE FACON QUE LA SURFACE FINALE SOIT EGALISEE. DOMAINE D'APPLICATION : PRODUCTION DE CIRCUITS INTEGRES A SEMICONDUCTEURS, DE CIRCUITS INTEGRES OPTIQUES, ETC.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61096866A JPH0828357B2 (ja) | 1986-04-28 | 1986-04-28 | 多層構造の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2603738A1 true FR2603738A1 (fr) | 1988-03-11 |
FR2603738B1 FR2603738B1 (fr) | 1990-09-07 |
Family
ID=14176361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8705920A Expired - Lifetime FR2603738B1 (fr) | 1986-04-28 | 1987-04-27 | Procede de formation d'une structure multicouche pour le cablage dans des domaines electronique ou optique |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH0828357B2 (fr) |
DE (1) | DE3713992A1 (fr) |
FR (1) | FR2603738B1 (fr) |
GB (1) | GB2189935B (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0307109A1 (fr) * | 1987-08-24 | 1989-03-15 | Canon Kabushiki Kaisha | Méthode pour former un cristal semi-conducteur et cristal semi-conducteur produit par cette méthode |
GB2216336A (en) * | 1988-03-30 | 1989-10-04 | Philips Nv | Forming insulating layers on substrates |
US5593919A (en) * | 1995-09-05 | 1997-01-14 | Motorola Inc. | Process for forming a semiconductor device including conductive members |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3403439A (en) * | 1966-04-29 | 1968-10-01 | Texas Instruments Inc | Electrical isolation of circuit components of monolithic integrated circuits |
GB1250201A (fr) * | 1967-11-22 | 1971-10-20 | ||
GB1261789A (en) * | 1963-01-23 | 1972-01-26 | Rca Corp | Epitaxial gallium arsenide diodes |
FR2588416A1 (fr) * | 1985-10-07 | 1987-04-10 | Canon Kk | Procede de formation selective d'un film depose |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4948286A (fr) * | 1972-09-08 | 1974-05-10 | ||
JPS58200557A (ja) * | 1982-05-18 | 1983-11-22 | Nec Corp | 多層配線の形成方法 |
JPS628543A (ja) * | 1985-07-05 | 1987-01-16 | Fujitsu Ltd | 燐珪酸ガラスの選択成長方法 |
-
1986
- 1986-04-28 JP JP61096866A patent/JPH0828357B2/ja not_active Expired - Fee Related
-
1987
- 1987-04-23 GB GB8709569A patent/GB2189935B/en not_active Expired - Lifetime
- 1987-04-27 FR FR8705920A patent/FR2603738B1/fr not_active Expired - Lifetime
- 1987-04-27 DE DE19873713992 patent/DE3713992A1/de active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1261789A (en) * | 1963-01-23 | 1972-01-26 | Rca Corp | Epitaxial gallium arsenide diodes |
US3403439A (en) * | 1966-04-29 | 1968-10-01 | Texas Instruments Inc | Electrical isolation of circuit components of monolithic integrated circuits |
GB1250201A (fr) * | 1967-11-22 | 1971-10-20 | ||
FR2588416A1 (fr) * | 1985-10-07 | 1987-04-10 | Canon Kk | Procede de formation selective d'un film depose |
Non-Patent Citations (3)
Title |
---|
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 16, no. 9, février 1974, page 2871, Armonk, NY, US; A. GAIND et al.: "Doped polysilicon isolation process" * |
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 130, no. 7, juillet 1983, pages 1571-1580, Manchester, US; L. JASTRZEBSKI et al.: "Growth process of silicon over SiO2 BY CVD: epitaxial lateral overgrowth technique" * |
PHILIPS TECHNICAL REVIEW, vol. 41, no. 2, 1983/84, pages 60-69, Eindhoven, NL; J. BLOEM et al.: "Nucleation and growth of silicon films by chemical vapour deposition" * |
Also Published As
Publication number | Publication date |
---|---|
JPS62254447A (ja) | 1987-11-06 |
DE3713992C2 (fr) | 1990-10-18 |
DE3713992A1 (de) | 1987-10-29 |
GB2189935A (en) | 1987-11-04 |
GB8709569D0 (en) | 1987-05-28 |
GB2189935B (en) | 1990-03-14 |
JPH0828357B2 (ja) | 1996-03-21 |
FR2603738B1 (fr) | 1990-09-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |