FR2566682B1 - Dispositif pour proteger une surface d'un element lenticulaire en general, et d'une tranche de silicium en particulier, pendant que l'autre surface de celui-ci est soumise a un traitement chimique - Google Patents

Dispositif pour proteger une surface d'un element lenticulaire en general, et d'une tranche de silicium en particulier, pendant que l'autre surface de celui-ci est soumise a un traitement chimique

Info

Publication number
FR2566682B1
FR2566682B1 FR858509365A FR8509365A FR2566682B1 FR 2566682 B1 FR2566682 B1 FR 2566682B1 FR 858509365 A FR858509365 A FR 858509365A FR 8509365 A FR8509365 A FR 8509365A FR 2566682 B1 FR2566682 B1 FR 2566682B1
Authority
FR
France
Prior art keywords
protecting
subject
general
silicon wafer
chemical treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR858509365A
Other languages
English (en)
Other versions
FR2566682A1 (fr
Inventor
Martino Mauri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
ATES Componenti Elettronici SpA
SGS ATES Componenti Elettronici SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATES Componenti Elettronici SpA, SGS ATES Componenti Elettronici SpA filed Critical ATES Componenti Elettronici SpA
Publication of FR2566682A1 publication Critical patent/FR2566682A1/fr
Application granted granted Critical
Publication of FR2566682B1 publication Critical patent/FR2566682B1/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
FR858509365A 1984-06-27 1985-06-20 Dispositif pour proteger une surface d'un element lenticulaire en general, et d'une tranche de silicium en particulier, pendant que l'autre surface de celui-ci est soumise a un traitement chimique Expired FR2566682B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8421623A IT1213183B (it) 1984-06-27 1984-06-27 Dispositivo per la protezione di una superficie, durante il trattamento chimico dell'opposta superficie, di elementi lenticolari in genere e di fette di silicio in particolare.

Publications (2)

Publication Number Publication Date
FR2566682A1 FR2566682A1 (fr) 1986-01-03
FR2566682B1 true FR2566682B1 (fr) 1989-12-15

Family

ID=11184466

Family Applications (1)

Application Number Title Priority Date Filing Date
FR858509365A Expired FR2566682B1 (fr) 1984-06-27 1985-06-20 Dispositif pour proteger une surface d'un element lenticulaire en general, et d'une tranche de silicium en particulier, pendant que l'autre surface de celui-ci est soumise a un traitement chimique

Country Status (3)

Country Link
DE (1) DE3522465A1 (fr)
FR (1) FR2566682B1 (fr)
IT (1) IT1213183B (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5989943A (en) * 1989-09-07 1999-11-23 Quicklogic Corporation Method for fabrication of programmable interconnect structure
DE69108285T2 (de) * 1990-04-23 1995-12-14 Genus Inc Peripherieabdichtung für Halbleiterplättchen durch Gasinjektion.
US5843233A (en) * 1990-07-16 1998-12-01 Novellus Systems, Inc. Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus
US5620525A (en) * 1990-07-16 1997-04-15 Novellus Systems, Inc. Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate
US5578532A (en) * 1990-07-16 1996-11-26 Novellus Systems, Inc. Wafer surface protection in a gas deposition process
US5133284A (en) * 1990-07-16 1992-07-28 National Semiconductor Corp. Gas-based backside protection during substrate processing
JP3167317B2 (ja) * 1990-10-18 2001-05-21 株式会社東芝 基板処理装置及び同方法
US5427670A (en) * 1992-12-10 1995-06-27 U.S. Philips Corporation Device for the treatment of substrates at low temperature
ATE171306T1 (de) * 1993-02-08 1998-10-15 Sez Semiconduct Equip Zubehoer Träger für scheibenförmige gegenstände
WO1997003456A1 (fr) * 1995-07-12 1997-01-30 Sez Semiconductor-Equipment Zubehör Für Die Halbleiterfertigung Gesellschaft Mbh Support pour objets en forme de pastille, en particulier des pastilles de silicium
AT1527U1 (de) * 1995-07-12 1997-06-25 Sez Semiconduct Equip Zubehoer Träger für scheibenförmige gegenstände, insbesondere siliziumscheiben
AT405655B (de) * 1997-03-26 1999-10-25 Sez Semiconduct Equip Zubehoer Verfahren und vorrichtung zum einseitigen bearbeiten scheibenförmiger gegenstände
DE10122845C2 (de) * 2001-05-11 2003-04-03 Infineon Technologies Ag Verfahren zum Trennen einer Verbindung zwischen einem scheibenförmigen Gegenstand und einem Trägerwafer
DE102008062343B4 (de) * 2008-12-15 2013-05-29 Festo Ag & Co. Kg Nach dem Bernoulli-Prinzip arbeitender Sauggreifer
JP5944724B2 (ja) * 2012-04-12 2016-07-05 株式会社ディスコ チャックテーブル

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3036829A1 (de) * 1980-09-30 1982-05-13 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum aufnehmen von kristallscheiben

Also Published As

Publication number Publication date
IT1213183B (it) 1989-12-14
DE3522465C2 (fr) 1993-07-15
FR2566682A1 (fr) 1986-01-03
DE3522465A1 (de) 1986-01-09
IT8421623A0 (it) 1984-06-27

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