FR2559955B1 - Boitier pour composant electronique integre par assemblage en surface comprenant des moyens de dissipation thermique integres - Google Patents

Boitier pour composant electronique integre par assemblage en surface comprenant des moyens de dissipation thermique integres

Info

Publication number
FR2559955B1
FR2559955B1 FR8502261A FR8502261A FR2559955B1 FR 2559955 B1 FR2559955 B1 FR 2559955B1 FR 8502261 A FR8502261 A FR 8502261A FR 8502261 A FR8502261 A FR 8502261A FR 2559955 B1 FR2559955 B1 FR 2559955B1
Authority
FR
France
Prior art keywords
housing
electronic component
assembly including
thermal dissipation
surface assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8502261A
Other languages
English (en)
French (fr)
Other versions
FR2559955A1 (fr
Inventor
Carlo Cognetti De Martiis
Giuseppe Marchisi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
ATES Componenti Elettronici SpA
SGS ATES Componenti Elettronici SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATES Componenti Elettronici SpA, SGS ATES Componenti Elettronici SpA filed Critical ATES Componenti Elettronici SpA
Publication of FR2559955A1 publication Critical patent/FR2559955A1/fr
Application granted granted Critical
Publication of FR2559955B1 publication Critical patent/FR2559955B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8502261A 1984-02-17 1985-02-15 Boitier pour composant electronique integre par assemblage en surface comprenant des moyens de dissipation thermique integres Expired FR2559955B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8419669A IT1213140B (it) 1984-02-17 1984-02-17 Componente elettronico integrato per assemblaggio di superficie.

Publications (2)

Publication Number Publication Date
FR2559955A1 FR2559955A1 (fr) 1985-08-23
FR2559955B1 true FR2559955B1 (fr) 1988-01-15

Family

ID=11160247

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8502261A Expired FR2559955B1 (fr) 1984-02-17 1985-02-15 Boitier pour composant electronique integre par assemblage en surface comprenant des moyens de dissipation thermique integres

Country Status (5)

Country Link
JP (1) JPS60233843A (de)
DE (1) DE3504949A1 (de)
FR (1) FR2559955B1 (de)
GB (1) GB2154791A (de)
IT (1) IT1213140B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04322452A (ja) * 1991-04-23 1992-11-12 Mitsubishi Electric Corp 半導体装置、半導体素子収納容器および半導体装置の製造方法
GB2292003A (en) * 1994-07-29 1996-02-07 Ibm Uk Direct chip attach
US5625226A (en) * 1994-09-19 1997-04-29 International Rectifier Corporation Surface mount package with improved heat transfer
JP2924854B2 (ja) * 1997-05-20 1999-07-26 日本電気株式会社 半導体装置、その製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1239634A (de) * 1968-10-02 1971-07-21
GB1289932A (de) * 1971-03-30 1972-09-20
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
GB2022317A (en) * 1978-05-31 1979-12-12 Burroughs Corp Method of forming a plastic cavity package for integrated circuit devices
US4420767A (en) * 1978-11-09 1983-12-13 Zilog, Inc. Thermally balanced leadless microelectronic circuit chip carrier
FR2488445A1 (fr) * 1980-08-06 1982-02-12 Efcis Boitier plastique pour circuits integres
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink

Also Published As

Publication number Publication date
JPS60233843A (ja) 1985-11-20
IT1213140B (it) 1989-12-14
GB2154791A (en) 1985-09-11
IT8419669A0 (it) 1984-02-17
FR2559955A1 (fr) 1985-08-23
GB8503303D0 (en) 1985-03-13
DE3504949A1 (de) 1985-08-22

Similar Documents

Publication Publication Date Title
DE3275789D1 (en) Substrate for mounting integrated circuit chips
BR8407142A (pt) Aparelho para montagem com fixadores
IT8219272A0 (it) Procedimento per il collegamento di componenti elettronici.
DE3675975D1 (de) Oberflaechenmontierungspackung fuer integrierte mikrowellenschaltung.
DE3475142D1 (en) Heat sink structure for an electronic package
FR2573948B1 (fr) Dispositif echangeur pour boitier electronique
FR2506112B1 (fr) Boitier pour dispositif electrique par exemple pour composant electronique
FR2569306B1 (fr) Dispositif de refroidissement pour circuits integres
DE3851985D1 (de) Wärmeleitende Packung für elektronische Bauelemente.
ES513838A0 (es) "dispositivo para montar e interconectar componentes electronicos".
GB2148051B (en) Housing arrangement for an electronic component operable at low temperatures
FR2575331B1 (fr) Boitier pour composant electronique
FR2503280B1 (fr) Ventilateur de type plat, notamment pour circuits electroniques
DE3689149D1 (de) Integrierte schaltungspackungen für oberflächenmontierung mit löttragenden leitern.
GB2199650B (en) Heat dissipating mounting for electronic components
GB2114943B (en) Motorcycle engine mounting
FR2507428B1 (fr) Machine de montage de composants electroniques sur des circuits
FR2559955B1 (fr) Boitier pour composant electronique integre par assemblage en surface comprenant des moyens de dissipation thermique integres
GB2095033B (en) Mounting integrated circuit packages
EP0123795A3 (en) Unitary heat sink for an electronic device module
GB2165704B (en) Heat dissipation for electronic components
GB8514012D0 (en) Mounting chips on substrate
GB2157077B (en) Heat sinks for minimizing noise in precision electronic components
ATA139781A (de) Gehaeuse fuer elektronische bauteile
JPS57109392A (en) Circuit mounting substrate

Legal Events

Date Code Title Description
D6 Patent endorsed licences of rights
ST Notification of lapse