GB2157077B - Heat sinks for minimizing noise in precision electronic components - Google Patents

Heat sinks for minimizing noise in precision electronic components

Info

Publication number
GB2157077B
GB2157077B GB8423790A GB8423790A GB2157077B GB 2157077 B GB2157077 B GB 2157077B GB 8423790 A GB8423790 A GB 8423790A GB 8423790 A GB8423790 A GB 8423790A GB 2157077 B GB2157077 B GB 2157077B
Authority
GB
United Kingdom
Prior art keywords
electronic components
heat sinks
precision electronic
minimizing noise
minimizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8423790A
Other versions
GB2157077A (en
GB8423790D0 (en
Inventor
Rodney Thomas Burt
Robert Mark Stitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Tucson Corp
Original Assignee
Burr Brown Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burr Brown Corp filed Critical Burr Brown Corp
Publication of GB8423790D0 publication Critical patent/GB8423790D0/en
Publication of GB2157077A publication Critical patent/GB2157077A/en
Application granted granted Critical
Publication of GB2157077B publication Critical patent/GB2157077B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB8423790A 1984-04-05 1984-09-20 Heat sinks for minimizing noise in precision electronic components Expired GB2157077B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59702784A 1984-04-05 1984-04-05

Publications (3)

Publication Number Publication Date
GB8423790D0 GB8423790D0 (en) 1984-10-24
GB2157077A GB2157077A (en) 1985-10-16
GB2157077B true GB2157077B (en) 1987-10-21

Family

ID=24389768

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8423790A Expired GB2157077B (en) 1984-04-05 1984-09-20 Heat sinks for minimizing noise in precision electronic components

Country Status (4)

Country Link
JP (1) JPS60214598A (en)
DE (1) DE3512453A1 (en)
FR (1) FR2562750B1 (en)
GB (1) GB2157077B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140264047A1 (en) * 2012-06-01 2014-09-18 Landauer, Inc. Geometry Layout for System for Wireless, Motion and Position-Sensing, Integrating Radiation Sensor for Occupational and Environmental Dosimetry
EP2856209B1 (en) 2012-06-01 2019-05-22 Landauer, Inc. Wireless, motion and position-sensing, integrating radiation sensor for occupational and environmental dosimetry
CN103500947B (en) * 2013-07-10 2016-01-06 浙江首航实业有限公司 Multifunctional intelligent photoelectric box

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB877481A (en) * 1956-11-13 1961-09-13 Ass Elect Ind Improvements relating to electronic equipment
NL260951A (en) * 1960-03-07
US3185756A (en) * 1960-05-02 1965-05-25 Cool Fin Electronics Corp Heat-dissipating tube shield
US3313339A (en) * 1965-03-15 1967-04-11 Wakefield Engineering Company Heat transfer apparatus
DE2601035A1 (en) * 1976-01-13 1977-07-21 Bosch Gmbh Robert ELECTRICAL CIRCUIT ARRANGEMENT
DE7818810U1 (en) * 1978-06-23 1978-10-05 Schroff & Co Gesellschaft Fuer Messtechnik Mbh, 7541 Straubenhardt COOLING UNIT FOR SEMICONDUCTORS
DE3025964A1 (en) * 1980-07-09 1982-02-04 Brown, Boveri & Cie Ag, 6800 Mannheim Semiconductor component mounted on cooling base - with intermediate PTFE or silicone polyester lacquer layer
US4454481A (en) * 1982-03-04 1984-06-12 Rockwell International Corporation Shielded amplifier
JPS5825249A (en) * 1982-07-28 1983-02-15 Hitachi Ltd Heat sink

Also Published As

Publication number Publication date
GB2157077A (en) 1985-10-16
JPS60214598A (en) 1985-10-26
DE3512453A1 (en) 1985-11-28
FR2562750B1 (en) 1987-02-27
GB8423790D0 (en) 1984-10-24
FR2562750A1 (en) 1985-10-11
DE3512453C2 (en) 1993-04-29
JPH0222559B2 (en) 1990-05-18

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950920