FR2522459A1 - Circuit electrique imprime - Google Patents

Circuit electrique imprime Download PDF

Info

Publication number
FR2522459A1
FR2522459A1 FR8203301A FR8203301A FR2522459A1 FR 2522459 A1 FR2522459 A1 FR 2522459A1 FR 8203301 A FR8203301 A FR 8203301A FR 8203301 A FR8203301 A FR 8203301A FR 2522459 A1 FR2522459 A1 FR 2522459A1
Authority
FR
France
Prior art keywords
support
printed circuit
networks
hole
circuit according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8203301A
Other languages
English (en)
French (fr)
Other versions
FR2522459B1 (cg-RX-API-DMAC7.html
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR8203301A priority Critical patent/FR2522459A1/fr
Priority to EP19830900717 priority patent/EP0101703A1/fr
Priority to PCT/FR1983/000031 priority patent/WO1983003040A1/fr
Priority to JP58500770A priority patent/JPS59500295A/ja
Priority to AU12278/83A priority patent/AU1227883A/en
Publication of FR2522459A1 publication Critical patent/FR2522459A1/fr
Application granted granted Critical
Publication of FR2522459B1 publication Critical patent/FR2522459B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
FR8203301A 1982-02-26 1982-02-26 Circuit electrique imprime Granted FR2522459A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR8203301A FR2522459A1 (fr) 1982-02-26 1982-02-26 Circuit electrique imprime
EP19830900717 EP0101703A1 (fr) 1982-02-26 1983-02-22 Circuit electrique imprime
PCT/FR1983/000031 WO1983003040A1 (fr) 1982-02-26 1983-02-22 Circuit electrique imprime
JP58500770A JPS59500295A (ja) 1982-02-26 1983-02-22 プリント回路
AU12278/83A AU1227883A (en) 1982-02-26 1983-02-22 Circuit electricque imprime

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8203301A FR2522459A1 (fr) 1982-02-26 1982-02-26 Circuit electrique imprime

Publications (2)

Publication Number Publication Date
FR2522459A1 true FR2522459A1 (fr) 1983-09-02
FR2522459B1 FR2522459B1 (cg-RX-API-DMAC7.html) 1985-04-26

Family

ID=9271416

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8203301A Granted FR2522459A1 (fr) 1982-02-26 1982-02-26 Circuit electrique imprime

Country Status (4)

Country Link
EP (1) EP0101703A1 (cg-RX-API-DMAC7.html)
JP (1) JPS59500295A (cg-RX-API-DMAC7.html)
FR (1) FR2522459A1 (cg-RX-API-DMAC7.html)
WO (1) WO1983003040A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1137333A4 (en) * 1998-09-17 2004-03-24 Ibiden Co Ltd COMPLEX STRUCTURED PCB

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3429236A1 (de) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin Folie mit beidseitig aufgedruckten elektrischen leiterbahnen
US4802741A (en) * 1987-10-09 1989-02-07 Eastman Kodak Company In-depth electrode light valve array devices and improved fabrication method therefor
JP5773633B2 (ja) * 2010-12-13 2015-09-02 キヤノン株式会社 配線基板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1493316A (fr) * 1966-09-20 1967-08-25 Litton Industries Inc Panneau de circuit à couches multiples
US3400210A (en) * 1966-04-26 1968-09-03 Automatic Elect Lab Interlayer connection technique for multilayer printed wiring boards
DE2323529A1 (de) * 1973-05-10 1974-11-28 Peter Kammermeier Leiterplatte mit aufgedruckten oder aufplattierten leiterbahnen

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2296988A1 (fr) * 1974-12-31 1976-07-30 Ibm France Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3400210A (en) * 1966-04-26 1968-09-03 Automatic Elect Lab Interlayer connection technique for multilayer printed wiring boards
FR1493316A (fr) * 1966-09-20 1967-08-25 Litton Industries Inc Panneau de circuit à couches multiples
DE2323529A1 (de) * 1973-05-10 1974-11-28 Peter Kammermeier Leiterplatte mit aufgedruckten oder aufplattierten leiterbahnen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/66 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1137333A4 (en) * 1998-09-17 2004-03-24 Ibiden Co Ltd COMPLEX STRUCTURED PCB
EP1868423A1 (en) * 1998-09-17 2007-12-19 Ibiden Co., Ltd. Multilayer build-up wiring board
US7514779B2 (en) 1998-09-17 2009-04-07 Ibiden Co., Ltd. Multilayer build-up wiring board
US7847318B2 (en) 1998-09-17 2010-12-07 Ibiden Co., Ltd. Multilayer build-up wiring board including a chip mount region

Also Published As

Publication number Publication date
JPS59500295A (ja) 1984-02-23
EP0101703A1 (fr) 1984-03-07
WO1983003040A1 (fr) 1983-09-01
FR2522459B1 (cg-RX-API-DMAC7.html) 1985-04-26

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TP Transmission of property
ST Notification of lapse