FR2503977A1 - Procede de realisation d'une metallisation sur la tranche d'un support plat, et circuit electronique comportant un tel support - Google Patents

Procede de realisation d'une metallisation sur la tranche d'un support plat, et circuit electronique comportant un tel support Download PDF

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Publication number
FR2503977A1
FR2503977A1 FR8107297A FR8107297A FR2503977A1 FR 2503977 A1 FR2503977 A1 FR 2503977A1 FR 8107297 A FR8107297 A FR 8107297A FR 8107297 A FR8107297 A FR 8107297A FR 2503977 A1 FR2503977 A1 FR 2503977A1
Authority
FR
France
Prior art keywords
support
edge
line
holes
separation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8107297A
Other languages
English (en)
French (fr)
Other versions
FR2503977B1 (enExample
Inventor
Paul Parmentier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR8107297A priority Critical patent/FR2503977A1/fr
Publication of FR2503977A1 publication Critical patent/FR2503977A1/fr
Application granted granted Critical
Publication of FR2503977B1 publication Critical patent/FR2503977B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR8107297A 1981-04-10 1981-04-10 Procede de realisation d'une metallisation sur la tranche d'un support plat, et circuit electronique comportant un tel support Granted FR2503977A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8107297A FR2503977A1 (fr) 1981-04-10 1981-04-10 Procede de realisation d'une metallisation sur la tranche d'un support plat, et circuit electronique comportant un tel support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8107297A FR2503977A1 (fr) 1981-04-10 1981-04-10 Procede de realisation d'une metallisation sur la tranche d'un support plat, et circuit electronique comportant un tel support

Publications (2)

Publication Number Publication Date
FR2503977A1 true FR2503977A1 (fr) 1982-10-15
FR2503977B1 FR2503977B1 (enExample) 1985-01-18

Family

ID=9257279

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8107297A Granted FR2503977A1 (fr) 1981-04-10 1981-04-10 Procede de realisation d'une metallisation sur la tranche d'un support plat, et circuit electronique comportant un tel support

Country Status (1)

Country Link
FR (1) FR2503977A1 (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2638894A1 (fr) * 1988-11-04 1990-05-11 Thomson Csf Dispositif et procede de connexion et de fixation de composants
EP0303975A3 (en) * 1987-08-21 1990-07-18 Nokia-Mobira Oy An arrangement for connecting a hybrid circuit to a mother board
US5044963A (en) * 1989-04-12 1991-09-03 Nokia Mobile Phones Ltd. Surface connector for radio frequency signals
US5059131A (en) * 1989-04-12 1991-10-22 Nokia Mobile Phones Ltd. Resilient connector for radio frequency signals
EP0653905A1 (en) * 1993-11-16 1995-05-17 International Business Machines Corporation Direct chip attach module
EP0766507A1 (en) 1995-09-12 1997-04-02 Allen-Bradley Company, Inc. Circuit board having a window adapted to receive a single in-line package module
FR2762959A1 (fr) * 1997-01-29 1998-11-06 Motorola Inc Procede et panneau de plaques de circuit pour l'elimination en grande partie ou delaminage et de l'affaissement dans une ligne d'assemblage pour la fabrication de plaques de circuits complexes
EP0852896A4 (en) * 1996-06-28 2000-05-24 Motorola Inc METHOD AND BOARD BENEFITS TO PREVENT DELAMINATION AND SOCKING IN THE ASSEMBLY ROAD FOR THE PRODUCTION OF BOARDS
WO2000045207A1 (en) * 1999-01-28 2000-08-03 Marconi Caswell Limited Optical interface arrangement
GB2382476A (en) * 2001-11-27 2003-05-28 Nec Corp Printed circuit board having edge mounted test contacts
WO2007146546A3 (en) * 2006-05-26 2008-02-14 Ppg Ind Ohio Inc Single or multi-layer printed circuit board with improved edge via design
WO2012115284A1 (en) * 2011-02-24 2012-08-30 Yazaki Corporation Interior illumination lamp for vehicle

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1208375B (de) * 1964-03-25 1966-01-05 Telefonbau Verfahren zur Verbindung von Leitungen beiderseitig bedruckter Leiterplatten
FR1481461A (fr) * 1965-06-01 1967-05-19 Philips Nv Plaque à câblage imprimé
GB1089925A (en) * 1965-10-08 1967-11-08 London Electrical Mfg Company Method of manufacturing mica or like capacitors
FR2349466A1 (fr) * 1976-04-26 1977-11-25 Gould Inc Dispositif de suspension en tandem
GB2031763A (en) * 1978-10-16 1980-04-30 Ultra Electronic Controls Ltd Improvements in connections between a flexible circuit board and a rigid member

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1208375B (de) * 1964-03-25 1966-01-05 Telefonbau Verfahren zur Verbindung von Leitungen beiderseitig bedruckter Leiterplatten
FR1481461A (fr) * 1965-06-01 1967-05-19 Philips Nv Plaque à câblage imprimé
GB1089925A (en) * 1965-10-08 1967-11-08 London Electrical Mfg Company Method of manufacturing mica or like capacitors
FR2349466A1 (fr) * 1976-04-26 1977-11-25 Gould Inc Dispositif de suspension en tandem
GB2031763A (en) * 1978-10-16 1980-04-30 Ultra Electronic Controls Ltd Improvements in connections between a flexible circuit board and a rigid member

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0303975A3 (en) * 1987-08-21 1990-07-18 Nokia-Mobira Oy An arrangement for connecting a hybrid circuit to a mother board
FR2638894A1 (fr) * 1988-11-04 1990-05-11 Thomson Csf Dispositif et procede de connexion et de fixation de composants
US5044963A (en) * 1989-04-12 1991-09-03 Nokia Mobile Phones Ltd. Surface connector for radio frequency signals
US5059131A (en) * 1989-04-12 1991-10-22 Nokia Mobile Phones Ltd. Resilient connector for radio frequency signals
EP0653905A1 (en) * 1993-11-16 1995-05-17 International Business Machines Corporation Direct chip attach module
US5471368A (en) * 1993-11-16 1995-11-28 International Business Machines Corporation Module having vertical peripheral edge connection
US5570505A (en) * 1993-11-16 1996-11-05 International Business Machines Corporation Method of manufacturing a circuit module
EP0766507A1 (en) 1995-09-12 1997-04-02 Allen-Bradley Company, Inc. Circuit board having a window adapted to receive a single in-line package module
EP0852896A4 (en) * 1996-06-28 2000-05-24 Motorola Inc METHOD AND BOARD BENEFITS TO PREVENT DELAMINATION AND SOCKING IN THE ASSEMBLY ROAD FOR THE PRODUCTION OF BOARDS
FR2762959A1 (fr) * 1997-01-29 1998-11-06 Motorola Inc Procede et panneau de plaques de circuit pour l'elimination en grande partie ou delaminage et de l'affaissement dans une ligne d'assemblage pour la fabrication de plaques de circuits complexes
WO2000045207A1 (en) * 1999-01-28 2000-08-03 Marconi Caswell Limited Optical interface arrangement
US6487087B1 (en) 1999-01-28 2002-11-26 Bookham Technology Plc Optical interface arrangement
GB2382476A (en) * 2001-11-27 2003-05-28 Nec Corp Printed circuit board having edge mounted test contacts
GB2382476B (en) * 2001-11-27 2004-12-22 Nec Corp Manufacture of printed circuit board with test points
WO2007146546A3 (en) * 2006-05-26 2008-02-14 Ppg Ind Ohio Inc Single or multi-layer printed circuit board with improved edge via design
WO2012115284A1 (en) * 2011-02-24 2012-08-30 Yazaki Corporation Interior illumination lamp for vehicle

Also Published As

Publication number Publication date
FR2503977B1 (enExample) 1985-01-18

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