FR2500959A1 - Boitier de dispositif electronique a forte dissipation thermique - Google Patents

Boitier de dispositif electronique a forte dissipation thermique Download PDF

Info

Publication number
FR2500959A1
FR2500959A1 FR8103982A FR8103982A FR2500959A1 FR 2500959 A1 FR2500959 A1 FR 2500959A1 FR 8103982 A FR8103982 A FR 8103982A FR 8103982 A FR8103982 A FR 8103982A FR 2500959 A1 FR2500959 A1 FR 2500959A1
Authority
FR
France
Prior art keywords
cover
housing
liquid
heat
encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8103982A
Other languages
English (en)
French (fr)
Other versions
FR2500959B1 (enrdf_load_stackoverflow
Inventor
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8103982A priority Critical patent/FR2500959A1/fr
Publication of FR2500959A1 publication Critical patent/FR2500959A1/fr
Application granted granted Critical
Publication of FR2500959B1 publication Critical patent/FR2500959B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8103982A 1981-02-27 1981-02-27 Boitier de dispositif electronique a forte dissipation thermique Granted FR2500959A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8103982A FR2500959A1 (fr) 1981-02-27 1981-02-27 Boitier de dispositif electronique a forte dissipation thermique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8103982A FR2500959A1 (fr) 1981-02-27 1981-02-27 Boitier de dispositif electronique a forte dissipation thermique

Publications (2)

Publication Number Publication Date
FR2500959A1 true FR2500959A1 (fr) 1982-09-03
FR2500959B1 FR2500959B1 (enrdf_load_stackoverflow) 1984-07-20

Family

ID=9255708

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8103982A Granted FR2500959A1 (fr) 1981-02-27 1981-02-27 Boitier de dispositif electronique a forte dissipation thermique

Country Status (1)

Country Link
FR (1) FR2500959A1 (enrdf_load_stackoverflow)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0144071A3 (en) * 1983-11-29 1985-09-25 Fujitsu Limited Liquid cooling type high frequency solid state device arrangement
EP0116289A3 (en) * 1983-01-12 1987-01-07 Allen-Bradley Company Power semiconductor module and package
EP0191419A3 (en) * 1985-02-14 1988-07-27 Brown, Boveri & Cie Aktiengesellschaft Semiconductor power module with integrated heat pipe
EP1225631A3 (en) * 2000-12-22 2003-06-04 Vlt Corporation Heat dissipation arrangement for electronic components
EP0921565A3 (en) * 1997-12-08 2005-07-27 Kabushiki Kaisha Toshiba Package for semiconductor power device and method for assembling the same
FR2895589A1 (fr) * 2005-12-23 2007-06-29 Valeo Equip Electr Moteur Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne.
EP1703557A3 (en) * 2005-03-17 2009-08-19 Delphi Technologies, Inc. Electronic assembly with integral thermal transient suppression
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting
RU2492077C2 (ru) * 2007-12-21 2013-09-10 Роберт Бош Гмбх Стеклоочиститель для автомобиля
EP2510542A4 (en) * 2009-12-10 2015-03-11 Danfoss Turbocor Compressors Bv IGBT COOLING PROCESS
WO2017001582A3 (en) * 2015-06-30 2017-02-09 CommScope Connectivity Belgium BVBA System for compensation of expansion/contraction of a cooling medium inside a sealed closure
EP3098843B1 (en) * 2015-05-29 2019-10-02 Delta Electronics Int'l (Singapore) Pte Ltd Package assembly

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1266244A (fr) * 1960-08-29 1961-07-07 Sony Corp Dispositif de refroidissement pour semi-conducteurs
CH448274A (de) * 1964-05-28 1967-12-15 Westinghouse Electric Corp Halbleiterbauelement
US3373322A (en) * 1966-01-13 1968-03-12 Mitronics Inc Semiconductor envelope
CH554601A (de) * 1972-11-30 1974-09-30 Ibm Vorrichtung mit dicht gepackten integrierten schaltungen.
FR2327642A1 (fr) * 1975-10-06 1977-05-06 Alsthom Cgee Montage de semi-conducteurs de puissance refroidis par un fluide refrigerant

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1266244A (fr) * 1960-08-29 1961-07-07 Sony Corp Dispositif de refroidissement pour semi-conducteurs
CH448274A (de) * 1964-05-28 1967-12-15 Westinghouse Electric Corp Halbleiterbauelement
US3373322A (en) * 1966-01-13 1968-03-12 Mitronics Inc Semiconductor envelope
CH554601A (de) * 1972-11-30 1974-09-30 Ibm Vorrichtung mit dicht gepackten integrierten schaltungen.
FR2327642A1 (fr) * 1975-10-06 1977-05-06 Alsthom Cgee Montage de semi-conducteurs de puissance refroidis par un fluide refrigerant

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0116289A3 (en) * 1983-01-12 1987-01-07 Allen-Bradley Company Power semiconductor module and package
US4796155A (en) * 1983-11-29 1989-01-03 Fujitsu Limited Liquid cooling type high frequency solid state device
EP0144071A3 (en) * 1983-11-29 1985-09-25 Fujitsu Limited Liquid cooling type high frequency solid state device arrangement
EP0191419A3 (en) * 1985-02-14 1988-07-27 Brown, Boveri & Cie Aktiengesellschaft Semiconductor power module with integrated heat pipe
EP0921565A3 (en) * 1997-12-08 2005-07-27 Kabushiki Kaisha Toshiba Package for semiconductor power device and method for assembling the same
EP1225631A3 (en) * 2000-12-22 2003-06-04 Vlt Corporation Heat dissipation arrangement for electronic components
EP1703557A3 (en) * 2005-03-17 2009-08-19 Delphi Technologies, Inc. Electronic assembly with integral thermal transient suppression
FR2895589A1 (fr) * 2005-12-23 2007-06-29 Valeo Equip Electr Moteur Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne.
WO2007074289A3 (fr) * 2005-12-23 2007-08-16 Valeo Equip Electr Moteur Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne
RU2492077C2 (ru) * 2007-12-21 2013-09-10 Роберт Бош Гмбх Стеклоочиститель для автомобиля
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting
EP2510542A4 (en) * 2009-12-10 2015-03-11 Danfoss Turbocor Compressors Bv IGBT COOLING PROCESS
EP3098843B1 (en) * 2015-05-29 2019-10-02 Delta Electronics Int'l (Singapore) Pte Ltd Package assembly
WO2017001582A3 (en) * 2015-06-30 2017-02-09 CommScope Connectivity Belgium BVBA System for compensation of expansion/contraction of a cooling medium inside a sealed closure

Also Published As

Publication number Publication date
FR2500959B1 (enrdf_load_stackoverflow) 1984-07-20

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