FR2485806A1 - Procede d'encapsulation d'un circuit electronique et circuit obtenu par ce procede - Google Patents
Procede d'encapsulation d'un circuit electronique et circuit obtenu par ce procede Download PDFInfo
- Publication number
- FR2485806A1 FR2485806A1 FR8013965A FR8013965A FR2485806A1 FR 2485806 A1 FR2485806 A1 FR 2485806A1 FR 8013965 A FR8013965 A FR 8013965A FR 8013965 A FR8013965 A FR 8013965A FR 2485806 A1 FR2485806 A1 FR 2485806A1
- Authority
- FR
- France
- Prior art keywords
- tabs
- circuit
- metal wire
- sheath
- substance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 6
- 238000007598 dipping method Methods 0.000 title claims description 5
- 229920002379 silicone rubber Polymers 0.000 title 1
- 239000004945 silicone rubber Substances 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims description 28
- 239000000126 substance Substances 0.000 claims description 13
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 238000002791 soaking Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 5
- 230000035617 depilation Effects 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 238000003618 dip coating Methods 0.000 abstract 2
- 238000005243 fluidization Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- CYXIKYKBLDZZNW-UHFFFAOYSA-N 2-Chloro-1,1,1-trifluoroethane Chemical compound FC(F)(F)CCl CYXIKYKBLDZZNW-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8013965A FR2485806A1 (fr) | 1980-06-24 | 1980-06-24 | Procede d'encapsulation d'un circuit electronique et circuit obtenu par ce procede |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8013965A FR2485806A1 (fr) | 1980-06-24 | 1980-06-24 | Procede d'encapsulation d'un circuit electronique et circuit obtenu par ce procede |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2485806A1 true FR2485806A1 (fr) | 1981-12-31 |
| FR2485806B1 FR2485806B1 (enExample) | 1984-08-10 |
Family
ID=9243443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8013965A Granted FR2485806A1 (fr) | 1980-06-24 | 1980-06-24 | Procede d'encapsulation d'un circuit electronique et circuit obtenu par ce procede |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2485806A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2518808A1 (fr) * | 1981-12-18 | 1983-06-24 | Radiotechnique Compelec | Procede et dispositif pour enrober un microassemblage |
| EP0178855A3 (en) * | 1984-10-13 | 1988-11-02 | Plessey Overseas Limited | Improvements relating to electrical connecting arrangements |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1221324B (de) * | 1961-02-21 | 1966-07-21 | Aerovox Corp | Verfahren zum UEberziehen von elektrischen Bauelementen mit einem waermehaertenden Harz nach dem Tauchverfahren |
| FR2258965A1 (enExample) * | 1974-01-25 | 1975-08-22 | Matsushita Electric Industrial Co Ltd |
-
1980
- 1980-06-24 FR FR8013965A patent/FR2485806A1/fr active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1221324B (de) * | 1961-02-21 | 1966-07-21 | Aerovox Corp | Verfahren zum UEberziehen von elektrischen Bauelementen mit einem waermehaertenden Harz nach dem Tauchverfahren |
| FR2258965A1 (enExample) * | 1974-01-25 | 1975-08-22 | Matsushita Electric Industrial Co Ltd |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2518808A1 (fr) * | 1981-12-18 | 1983-06-24 | Radiotechnique Compelec | Procede et dispositif pour enrober un microassemblage |
| EP0178855A3 (en) * | 1984-10-13 | 1988-11-02 | Plessey Overseas Limited | Improvements relating to electrical connecting arrangements |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2485806B1 (enExample) | 1984-08-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |